Seiko Epson Corporation

Kazushige Hakeda

Fujio Akahane

Nagamitsu Takashima

Ryoji Uesugi

Akiharu Kurebayashi

Motoki Takabe

Yasunori Koike

Tatsuro Torimoto

Tadao Furuta

Koji Sumi

Hiroyuki Hagiwara

Tsutomu Nishiwaki

Toshinobu Yamazaki

Kentaro Murakami

Toshinao Shinbo

Shinya Momose

Takayuki Shimosaka

Tomoo Kinoshita

Hidekazu Todoroki

Isao Takimoto

Provided is a liquid ejecting head including: a first board on which a driving element for ejecting liquid is installed; a second board which is installed on the surface of the first board and covers the driving element; a wiring board that includes a first surface on which a wiring, where a driving signal is supplied to the driving element, is formed and a second surface that is at the opposite side to the first surface, and where the first surface of a first end section is joined to the surface of the first board; and a filling material which covers the wiring by being formed at least between the first surface and a wall surface of the second board, in which the height of the filling material with respect to the surface of the first board is high at the first surface side in comparison to the second surface side.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head includes a pressure element that applies a pressure to a pressure chamber which communicates with a nozzle which ejects a liquid, and a lead electrode that is joined to a wiring substrate which supplies a driving signal which drives the piezoelectric element, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.

A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.

A method of manufacturing a piezoelectric element includes a piezoelectric layer forming step of sequentially and repeatedly performing a heat treatment step of applying a piezoelectric material containing lead to a lower electrode film at a relative humidity in the range of 30% to 50% Rh and then performing a heat treatment to form a piezoelectric precursor film and a crystallization step of firing the piezoelectric precursor film to form a piezoelectric film on the lower electrode film, thereby forming a piezoelectric layer.

Method of manufacturing liquid jet head, method of manufacturing piezoelectric element and liquid jet apparatus

A male die for forming a member incorporated in a liquid ejection head is disclosed. Each of a plurality of first forging punches is operable to form a first recess on a metal plate. The first forging punches are arranged at a fixed pitch to form a punch row in a first direction. Each of a plurality of second forging punches is operable to form a second recess on the metal plate. The second forging punches are arranged adjacently to first forging punches located at both ends of the punch row. The first recess is to be a first part of the member which is used to eject liquid from the liquid ejection head, and the second recess is to be a second part of the member which is not used to eject liquid.

Forging punch, method of manufacturing liquid ejection head using the same, and liquid ejection head manufactured by the method

An object is to provide a fine forging method for forming partitions of recesses precisely and forming recess shapes for pressure generation chambers etc. with high accuracy as well as a liquid ejection head that is produced by using the fine forming method. A fine forging method for forming groove-shaped recesses that are arranged at a prescribed pitch. After groove-shaped recesses are formed tentatively in a material plate by a first punch in which tentative forming punches are arranged, finish forming is performed on the tentatively formed groove-shaped recesses by using a second punch in which finish forming punches are arranged. An end portion of a projection strip is formed with slant faces or a slant face, whereby an end portion of each groove-shaped recess is formed precisely. A liquid ejection head produced by the above method exhibits stable liquid ejection characteristics and its manufacturing cost can be reduced by virtue of simplified working of forging.

Liquid ejection head having improved ejection performance

A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a resist film having a predetermined pattern on the upper layer, and patterning the metal film by etching the metal film using the resist film as a mask. Here, patterning the metal film comprises etching the upper layer, immersing the resist film and the upper layer in a pretreatment liquid containing a nonionic surfactant after the first etching process, and etching the lower layer after the immersing process.

Metal pattern forming method

A male die is adapted to be opposed to a first face of a metallic plate member. The male die includes a plurality of punches which are provided on the male die and arranged side by side in a first direction with a fixed pitch. A guide member is formed with a guide face which supports a side portion of the male die, at least when the punches are pressed into the plate member in a second direction, to form through holes therein.

Guided punching apparatus

Fine forging method, manufacturing method of liquid ejection head, and liquid ejection head

There is disclosed a punch for forging a metallic plate member. A first die is adapted to be opposed to a first face of the plate member. A second die is adapted to be opposed to a second face of the plate member. A plurality of first projections are provided on the first die and arranged in a first direction with a fixed pitch. Each of the first projections is elongated in a second direction perpendicular to the first direction. A plurality of second projections are provided on the second die and arranged in the first direction with the fixed pitch. Each of the second projections is elongated in the second direction and provided with a concave portion extending in the second direction at a distal end portion thereof. The plate member is sandwiched between the first die and the second die so that the first projections and the second projections are cut into the plate member in a third direction orthogonal to the first direction and the second direction, to perform a first forging work.

Method for forging plate and method for manufacturing a liquid ejection head

There is disclosed a method of manufacturing a chamber formation plate of a liquid ejection head. The chamber formation plate includes a first region formed with at least recess portions to be pressure generating chambers communicated with nozzles from which liquid droplets are ejected by pressure generated in the pressure generating chambers. A metal plate and a forging die are provided. A reference part is provided on the metal plate. The reference part defines a relative position between the first region and the forging die. At least one deformation absorber is provided at a second region of the metal plate where is between the first region and the reference part. At least one plastic working is performed by the forging die, with respect to the first region to form at least the recess portions, while plastic deformation of the metal plate caused by the plastic working is absorbed by the deformation absorber.

Method of manufacturing a chamber plate for a liquid ejection head

A metallic plate member is provided. A first punch is operable to perform a first forging work to mold a first member in the plate member. The first member has a first function. A second punch is operable to perform a second forging work to mold a second member in the plate member. The second member including at least one kind of positioning member. The first forging work and the second forging work are performed at a single stage.

Forging work method

A chamber formation plate has a first face formed with a plurality of recesses arranged in a first direction at a fixed pitch such that each of the recesses is communicated with, via a through hole, a second face which is an opposite face of the first face. The chamber formation plate is comprised of nickel. A sealing plate is joined to the first face of the chamber formation plate so as to seal the recesses to form a plurality of pressure generating chambers. A metallic nozzle plate is formed with a plurality of nozzles, and joined to the second face of the chamber formation plate such that each of the nozzles is communicated with associated one of the pressure generating chamber via the through hole. A ratio of a grain size of a crystal of the nickel with respect to a thickness of a partition wall defined between each adjacent ones of the recesses is 60% or less.

Liquid ejection head, and method of manufacturing the same

Punch for forging a liquid ejection head

In order to manufacture a liquid ejection apparatus, a metal board is prepared. The metal board is subjected to a plastic working to form a plurality of recesses on a first face in a first region of the metal board. Through holes are punched so as to communicate the recesses and a second face of the metal board. The metal board is subjected to a plastic working to form a plurality of dents in a second region of the meal board. A metallic nozzle plate formed with nozzles is joined onto the second face of the metal board, such that each of the nozzles is communicated with one of the through holes.

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Nagano, Japan

Kazushige Hakeda