Ngk Spark Plug Company, Limited

Kazushige Akita

Toshihisa Nomura

Yoshitaka Yoshida

Tomoyoshi Ono

Hiroaki Yamamoto

Kenji Suzuki

Naoki Kito

Takatoshi Tojo

Takashi Kurauchi

Jun Suzuki

A wiring board includes recesses recessed to an inside of the wiring board, in a plan view, in portions connecting a far end surface to side surfaces, and an outer peripheral electroconductive layer disposed over a surface extending from the far end surface to the recesses. To electrically connect an electroconductive member to the outer peripheral electroconductive layer of the wiring board by, for example, joining such as soldering, the electroconductive member can be disposed in the recesses to be connected to the outer peripheral electroconductive layer. This structure prevents the electroconductive member from excessively protruding outward from the surface of the wiring board. Thus, a device having the wiring board installed therein can be made compact.

Wiring board, method for manufacturing wiring board, and method for manufacturing multi-pattern wiring board

A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.

Manufacturing method of part-mounting package

A wiring substrate includes an insulating substrate having a quadrangular planar outline; a quadrangular frame positioned on the surface of the insulating substrate along the periphery, and including an upper surface, a corner portion, and an adjacent portion, the corner portion including a width-expanded portion defining a via hole extending through the frame, the width-expanded portion including an inner wall surface having a rectilinear edge in a plan view, the adjacent portion including an inner wall surface, the inner wall surface of the width-expanded portion forming an obtuse angle with the inner wall surface of the adjacent portion; a via conductor filling the via hole and not exposed from the inner wall surface of the width-expanded portion; and a sealing metallization layer formed on the upper surface of the frame and electrically connected to the via conductor.

Wiring substrate

A wiring substrate includes: a substrate body made of ceramic and having a front surface and a rear surface, each having a rectangular shape in a plan view, a plurality of rear surface electrodes formed on the rear surface of the substrate body, a frame-shaped conductive portion provided on the front surface side of the substrate body, and a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion. A part of the rear surface is exposed between the plurality of rear surface electrodes and each side of the rear surface of the substrate body. On the rear surface of the substrate body, at least one projecting wiring is formed between each of the plurality of rear surface electrodes and each of a corresponding pair of the sides that intersect with each other.

Wiring substrate and multi-piece wiring substrate

A ceramic package includes a package main body which is formed of a ceramic material, which has a front surface and a back surface having a rectangular shape in plan view, and which has a cavity opening toward the front surface; a first metalized layer which has a frame shape in plan view and is formed on the front surface; and a second metalized layer which is formed on the front surface of the first metalized layer so as to assume a frame shape, and which has a width smaller than the width of the first metalized layer, wherein the width of the second metalized layer at each corner portion of the front surface in plan view is smaller than the width of the second metalized layer in a region other than the corner portion in plan view.

Ceramic package

Embodiments of the present packages comprise a package body that is made of an insulating material, has a front surface and a back surface, and has a rectangular shape in plan view, a metal layer that is formed along a peripheral portion of the front surface of the package body and that has a frame shape in plan view, a metal frame that is joined to the metal layer with a brazing material and has a frame shape in plan view. a pair of electrode pads that are formed on the front surface of the package body surrounded by the metal layer and configured to mount a crystal oscillator, and an opening portion of a cavity opened in a position that excludes the pair of electrode pads, wherein the metal layer, the pair of electrode pads, and the opening portion of the cavity are positioned in the same plane.

Package

A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with few jigs is provided. In certain embodiments the wiring board includes a base board made of an insulating material having a front surface and a back surface, the base board including a plurality of first via conductors as well as first terminals on the front surface and outer terminals on the back surface that are connected to the ends of the first via conductors, and a mounting board on the front surface of the base board having a front side that includes, a plurality of probe pads, a plurality of second terminals that are electrically connected to the first terminals of the base board, and front surface wirings that connect the probe pads to the second terminals. Lastly, a method of manufacturing the same is provided.

Wiring board for electronic parts inspecting device and its manufacturing method

A ceramic substrate for an electronic part inspecting apparatus that can be manufactured in accordance with predetermined specifications, regardless of the number and location of pins required, relatively quickly and inexpensively is provided. In certain embodiments the ceramic substrate is configured to connect to a probe for inspecting an electronic component, and the ceramic substrate comprises a plurality of vias located in a center area of the ceramic substrate that penetrate through the ceramic substrate in its thicknesswise direction, pads located in an outer periphery that surrounds the center area where the vias are located, the pads being configured to connected to the probes, and a conductive layer located only over the front surface of the ceramic substrate and connects the vias to the respective pads. Certain embodiments comprise a greater number of vias than pins. A method of manufacturing the ceramic substrate is also provided.

Ceramic substrate and method for manufacturing the same

A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with a few number of jigs is provided. In certain embodiments the wiring board comprises a board main body having a front surface, a probe pad area having probe pads located in a central portion of the front surface, an outer connecting terminal area having outer connecting terminals located in a peripheral portion of the front surface, and wherein probe pads are connected to outer connecting terminals by front surface wirings formed between the probe pad area and the outer connecting terminal area. While certain embodiments further comprise inner wirings and first via conductors to connect the probe pads and outer connecting terminals, it is preferable to have no or a minimal amount of such inner wirings. Lastly, a method of manufacturing the same is provided.

Growing community of inventors

Nagoya, Japan

Kazushige Akita