Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kazushi Higashi

Shinji Kanayama

Kenji Takahashi

Shozo Minamitani

Hiroyuki Otani

Takahiro Yonezawa

Shinji Ishitani

Hiroshi Wada

Norihito Tsukahara

Makoto Imanishi

Yoshihiko Yagi

Yoshifumi Kitayama

Koichi Yoshida

Shinzo Eguchi

Takafumi Tsujisawa

Akihiro Yamamoto

Satoshi Shida

Takashi Shimizu

Shoriki Narita

Takaharu Mae

Tatsuo Sasaoka

Naoto Hosotani

Masahiko Ikeya

Koichi Kumagai

Kenji Fukumoto

Kouji Hirotani

Daido Komyoji

Kenji Okamoto

Satoshi Horie

Yoshinori Wada

Takeshi Kita

Makoto Akita

Yukihiro Maegawa

Yasuhiro Kametani

Hideo Kawai

Kouichi Yoshida

Takashi Omura

The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute a cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.

Joining apparatus with UV cleaning

In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers, the occurrence of a faulty junction after mounting can be suppressed by placement of the n-bump at center of the bump array, because the position at the center is most resistant to occurrence of stress after the mounting. Employment of such a configuration of bump array increases reliability of mounting thereof while improving uniformity of light emission intensity in the semiconductor light emitting device having an increased size.

Semiconductor light emitting device and semiconductor light emitting device mounted board

An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

Electronic element package and method of manufacturing the same

A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.

Semiconductor element and semiconductor element fabrication method

When forming a resin material in a through hole, an electrode pad is formed in the bottom portion of the through hole, an insulating material is formed about the periphery of the through hole and a conductive material is formed in the central portion by an inkjet method, inkjet-ejected resins being ejected in such a manner that concavo-convex indentations and projections are formed in the surface thereof, whereby the adhesiveness between the insulating material and the conductive material and the adhesiveness between the insulating material and the inner walls of the through hole can be improved. Therefore, it is possible to suppress mechanical defects such as detachment of conductive material at the interfaces between the inner surface of the through hole and the resin or conductor layer, or electrical defects such as insulation defects, conduction defects, or the like.

Formation of a through-electrode by inkjet deposition of resin pastes

It is an object of the invention to provide an electronic part capable of forming an accurate gap between opposing substrates while also capable of decreasing the area of the electronic part, and a method of producing the same. A second electrode portion (), having a core pattern () and a bump pattern () covering the surface thereof, is provided on a device substrate (), the core pattern () is made of a material having hardness greater than that of the bump pattern (), a first electrode portion () of the same material as the bump pattern () is provided on a bonding substrate (), and a functional portion of the device substrate () and the first electrode portion () are electrically connected by direct bonding of the first electrode portion () and the bump pattern ().

Electronic part and method of producing the same

A first container member () mounting an electronic device () thereon and a second container member () are bonded with an adhesive () or a metal layer (). Thus an inner space () is formed and the electronic device can be closed in the inner space at a low temperature. In the case the adhesive is used, an exposed surface of the adhesive is coated with a metal film () to improve the closeness of the inner space. Further, an electronic device () may be mounted on the second container member so as to increase the electronic device arrangement density in a packaged electronic device.

Packaged electronic element and method of producing electronic element package

In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 &#x3bc;m.

Semiconductor device

By joining a lid member to a base member, internal electrodes put in contact with the lid member and an electronic device connected to the internal electrodes are placed in an internal space located in between the base member and the lid member. By performing etching from a surface of the lid member on a side opposite from the base member by a prescribed method, through holes that reach the surface of the internal electrodes are formed. A conductive material is applied to the through holes, and external electrodes connected to the internal electrodes are formed in a plane, completing a thin type electronic device package.

Electronic device package manufacturing method and electronic device package

An LED chip of the present invention has a structure in which an n-type semiconductor layer and a p-type semiconductor layer are successively formed on the lower face of an element substrate, with the p-type semiconductor layer being formed on an area except for an area for an n-electrode. A first n-electrode is formed on the area for the n-electrode and a first p-electrode is formed on the p-type semiconductor layer. A first insulating layer having openings and is formed on the first n-electrode and the first p-electrode, and a second n-electrode and a second p-electrode having virtually the same size are formed on the first insulating layer. With this arrangement, the electrode on the n-type semiconductor layer can be made larger, thereby a mounting process of LED chips onto a circuit board can be executed by using solder at low costs.

Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device

Componentis pressed onto a circuit boardso that their respective metal interconnectsare in close contact with each other, and ultrasonic vibration is applied to the suction nozzleholding the component. Friction is thereby generated between metal interconnectswhereby the componentis bonded on circuit substrate. Suction nozzlefor handling components is made of stainless steel and has a working faceprovided with a hardened layer, or alternatively, suction nozzlemay have a suction headhaving a working facemade of cemented carbide. Working faceof suction nozzleis refined by polishing as required during the mounting operation.

Component mounting tool, and method and apparatus for mounting component using this tool

A preheat device () is provided to execute, before forming bumps () to electrode parts (), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage () through controlling the heating by a controller ().

Apparatus and method for forming bump

Component () is pressed onto a circuit board () so that their respective metal interconnects (), () are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle () holding the component (). Friction is thereby generated between metal interconnects (), () whereby the component () is bonded on circuit substrate. Suction nozzle () for handling components is made of stainless steel and has a working face (a) provided with a hardened layer (b), or alternatively, suction nozzle () may have a suction head (c) having a working face (a) made of cemented carbide. Working face (a) of suction nozzle () is refined by polishing as required during the mounting operation.

Component mounting apparatus including a polishing device

A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

Semiconductor element having protruded bump electrodes

An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.

Growing community of inventors

Neyagawa, Japan

Kazushi Higashi