Fujimi Incorporated

Ebara Corporation

Kazusei Tamai

Hitoshi Morinaga

Hiroshi Asano

Maiko Asai

Katsuyoshi Ina

Yuuichi Ito

Kenji Sakai

Koji Ohno

Chiyo Horikawa

Kenya Ito

Yu Ishii

Keiji Ashitaka

Hiroaki Mizuno

Shogo Tsubota

Tadahiro Kitamura

Atsunori Kawamura

Tomoaki Ishibashi

Keigo Ohashi

Shirou Miura

Tsuyoshi Matsuda

Muneaki Tahara

Kyohei Ota

Eiichi Yamada

Youhei Takahashi

Toru Kamada

Yutaka Niwano

Yasunori Okada

Shinji Furuta

Taira Otsu

Naoyuki Ishihara

Shota Hishida

Tomoya Ikedo

Shingo Otsuki

Shingo Ohtsuki

Kyosuke Tenko

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad () having an annular polishing surface () which has a curved vertical cross-section; a workpiece holder () for holding a workpiece (W) having a polygonal shape; a rotating device () configured to rotate the workpiece holder () about an axis of the workpiece (W); a pressing device () configured to press a periphery of the workpiece (W) against the annular polishing surface (); and an operation controller () configured to change a speed at which the rotating device () rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device () is disposed more inwardly than the workpiece holder () in a radial direction of the polishing table ().

Chemical mechanical polishing apparatus for polishing workpiece

Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an &#x3b1;-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 &#x3bc;m or more to 0.35 &#x3bc;m or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.

Abrasive, polishing composition, and polishing method

To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion () in which a plurality of fibers () having a length of 2 mm or more are raised on the surface of a base (), in which the mass of the fibers () is 250 g/mor more. The polishing pad is used for polishing an object to be polished () containing metal, an alloy, or a metal oxide material and having at least one of a projection portion () and a recessed portion () on the surface.

Polishing pad and polishing method

Abrasives, a polishing composition, and a polishing method that can reduce undulation of an outer surface of a resin coating by polishing with reduced occurrence of polishing flaws. The polishing composition includes abrasives of aluminium oxide particles having a specific surface area of 5 m/g or more and 50 m/g or less and an average secondary particle diameter of 0.05 &#x3bc;m or more and 4.8 &#x3bc;m or less. This polishing composition can be used for polishing an outer surface of the resin coating.

Abrasives, polishing composition, and polishing method

Provided is a polishing composition that is produced at low cost and can impart high-grade mirror finishing to ceramic. The polishing composition includes abrasives, has a pH of 6.0 or more to 9.0 or less, and is used for polishing ceramic.

Polishing composition, polishing method, and method for manufacturing ceramic component

Provided is an article having a novel surface with a texture different from conventional kinds. The article having a metal oxide-containing coating provided by the present invention comprises a substrate and a metal oxide-containing coating provided to the substrate surface. The metal oxide-containing coating has a Vickers hardness of 350 or higher, a surface roughness Ra of 300 nm or less, and a 20&#xb0; gloss value of 50 or higher.

Article comprising metal oxide-containing coating

A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

Polishing tool and polishing method for member having curved surface shape

[Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

Polishing composition

Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 &#x3bc;m or more and 20 &#x3bc;m or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.

A polishing composition of the present invention contains abrasive grains each having a surface with protrusions. Parts of the abrasive grains have larger particle diameters than the volume-based average particle diameter of the abrasive grains, and the average of values respectively obtained by dividing a height of each protrusion on the surface of each abrasive grain belonging to the parts of the abrasive grains by the width of a base portion of the same protrusion is 0.170 or more. Protrusions on the surfaces of abrasive grains belonging to the parts of the abrasive grains that have larger particle diameters than the volume-based average particle diameter of the abrasive grains have an average height of 3.5 nm or more. The polishing composition has a content of an organic alkali of 100 mmol or less per kilogram of the abrasive grains in the polishing composition.

Polishing composition, and polishing method and substrate production method using same

A filtration method, that includes: (A) filtering a liquid having particles with a resin media filter; and (B) applying ultrasonic waves at a frequency of at least 30 kHz to the resin media filter during the filtering (A) or after completion of the filtering (A) to regenerate the resin media filter, where: i) a material of the resin media filter is nylon, polycarbonate, polytetrafluoroethylene (PTFE), polysulfone, polyether sulfone, and/or cellulose, ii) for the regeneration of the resin media filter, the applying results in a filter regeneration ratio of at least 0.40; iii) on a surface of the resin media filter, a support material comprising a mesh resin layer is disposed; and iv) the resin media filter is present in a filter housing having a three-dimensional shape and an ultrasonic vibrator, which generates the ultrasonic waves, is present on a lateral side of said filter housing.

Filtration method, method for purifying polishing composition using it, method for regenerating filter to be used for filtration, and filter regenerating apparatus

A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1&#xd7;Y1&#x2266;0 and the relationship X2&#xd7;Y2&#x3e;0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide.

Polishing composition and polishing method using the same

A polishing composition includes more than 0.1% by mass of colloidal silica, and water, and has a pH of 6 or less. The polishing composition has the ability to polish a titanium material at a high stock removal rate. Thus, the polishing composition is suitable for use in applications for polishing a titanium-containing object.

Polishing composition and polishing method

A polishing composition capable of satisfactorily polishing a semiconductor. The first polishing composition of the present invention includes silicon dioxide, at least one component selected from periodic acids and salts thereof, at least one component selected from tetraalkyl ammonium hydroxides and tetraalkyl ammonium chlorides, hydrochloric acid, and water, and contains substantially no iron. The second polishing composition of the present invention includes a predetermined amount of fumed silica, a predetermined amount of at least one component selected from periodic acids and salts thereof, a tetraalkyl ammonium salt represented by the following general formula (1), at least one component selected from ethylene glycol and propylene glycol, and water. The pH of the second polishing composition is greater than or equal to 1.8 and is less than 4.0. 

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Kazusei Tamai