Mitsubishi Denki Kabushiki Kaisha

Kazuo Yoshida

Yoshimi Kinoshita

Shigeo Sasaki

Katsuhisa Kitano

Hiroshi Ohnishi

Takeshi Iwamoto

Yoshihiko Kusakabe

Kouichirou Tsutahara

Nobuyuki Kosaka

Kenichiro Yamanishi

Toshihiko Noguchi

Taizo Eshima

Yoshio Yamane

Tomoyuki Kanda

Hideki Komori

Toru Takahama

Hiroshi Koizumi

Masao Oda

Yoshiyuki Goto

Soichiro Okuda

Hidenobu Murakami

Tatsuya Iwasa

Hiroaki Tobuse

Yasushi Hisaoka

Takashi Ishii

Yuji Mihara

Fumiharu Yabunaka

Toyomi Osige

It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer (1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.

Semiconductor producing apparatus, and wafer vacuum chucking device, gas

It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.

Semiconductor producing apparatus comprising wafer vacuum chucking device

Disposed before and behind stationary contacts 6U and 6L are one pair each of roller contacts 5FM and 5FH, and 5BM and 5BH which are supported collectively at the upper and lower ends thereof by bridge links 4FU and 4FL, and 4BU and 4BL. These paired upper and lower bridge links are then supported by either of support shafts 3F and 3B respectively. The support shafts 3F and 3B for these two pairs of roller contacts and bridge links are supported by a pair of guide shafts 2U and 2L. The guide shafts are loosely engaged with a drive arm 1 and contacting pressure springs 7U and 7L are fitted between the two support shafts.

Roller contact device

An inspection method and an inspection apparatus for the component members of the cathode-ray tube are disclosed. An inspection apparatus composed of normal members other than an object of inspection is prepared at the time of inspecting the phosphor screen of the screen panel, the electron gun or the shadow-mask constituting the cathode-ray tube. In advanced to assembling the cathode-ray tube, the object of inspection is mounted on the inspection apparatus, so that the conformance or rejection of the object of inspection is decided from the illuminated condition of the phosphor screen by irradiating electron beams thereon.

Method of inspection for cathode-ray tube component members and

To achieve a small-sized roller contact device having an increased capacity of current flow, the front and rear roller contacts 4a and 4b are arranged such that they face each other with the contact portions 1a and 2a of the first and second fixed contacts 1 and 2 therebetween to bridge-contact the contact portions 1a a and 2a of first and second fixed contacts 1 and 2 from the front and rear sides of the portions of the first and second fixed contacts 1 and 2 which are arranged in parallel to each other. The front and rear roller contacts 4a and 4b are supported by the front and rear roller contact supporting members 5a and 5b, respectively. The driving member 6 extends between the first and second fixed contacts 1 and 2 and supports the front and rear roller contact supporting members 5a and 5b. The springs are installed between the front and rear roller contact supporting members 5a and 5b.

A semiconductor film production apparatus includes a reaction vessel for containing a substrate and including a gas supply port for supplying a reaction gas to the vessel, a gas discharge port for discharging the reaction gas from the vessel after reaction, and a light-transmitting glass window; a light source disposed outside the reaction vessel for irradiating a substrate in the reaction vessel through the light-transmitting glass window to heat the substrate; a cylindrical substrate holder disposed in the reaction vessel for holding the substrate with a first surface facing the light source and a second surface, opposed to the first surface, exposed to the reaction gas; a ring plate having a central opening with an area smaller than the substrate and an outside diameter dividing the reaction vessel into two compartments, the ring plate contacting the first surface of the substrate; a carrier gas supply port for introducing a carrier gas between the substrate and the light-transmitting glass window; and a reaction gas supply nozzle disposed in the substrate holder connected to said gas supply port and opposing the second surface of the substrate.

Apparatus for producing semiconductor film

Described herein is a roller contact device wherein, upon moving a drive arm into a contact closing position, a pair of roller contacts are pressed across a pair of stationary contacts through a pair of bridge links and a pair of roller shafts by a pair of support shafts which are each forwardly pressed by a compression spring, thereby closing the contacts. In the event if there is a difference in height between the contacting surfaces of the two stationary contacts, the bridge links are inclined to hold the roller contacts securely in the contact closing positions.

A charged-particle distribution measuring apparatus includes a particle passing member having a plurality of through-holes through which portions of a beam of charged particles can pass, a particle trapping member for trapping charged particles that have passed through the through-holes, a recoil particle trapping member disposed between the particle passing member and the particle trapping member, and a mechanism for moving the members to measure the spatial distribution of the charged particle beam. Preferably, the through-holes in the particle passing member are uniformly distributed in a checkerboard pattern. The movement of the members permits measurement of the currents produced by the charged particle beam at various intervals between the locations of the through-holes at the beginning of the measurement. The measurement of the charged particle beam intensity at positions across through the beam, rather than at fixed locations within the beam, improves the resolution of the measured distribution. The apparatus can be employed with positively and negatively charged beams and is useful in ion implantation.

Charged-particle distribution measuring apparatus

Growing community of inventors

Amagasaki, Japan

Kazuo Yoshida