Oki Electric Industry Co., Ltd.

Other

Honda Giken Kogyo Kabushiki Kaisha

The Furukawa Electric Co., Ltd.

Asahi Kasei Chemicals Corporation

Honda Motor Co., Ltd.

Mitsubishi Electric Corporation

Oki Data Corporation

Dai Nippon Insatsu Kabushiki Kaisha

Furukawa Automotive Systems Inc.

Kabushiki Kaisha Tokyo Kikai Seisakusho

Oki Electric Industrial Co., Ltd.

Kazuo Yoshida

Kyota Susai

Yoshimi Kinoshita

Masato Negishi

Takeo Uno

Toshinari Sonoda

Seiichiro Ishikawa

Tadayuki Ishii

Shuichi Kitagawa

Susumu Kono

Hiroki Toyoshima

Kohei Adachi

Takashi Sasaki

Kenji Hirose

Hiroshi Abe

Yoshiaki Kobayashi

Takashi Kondo

Yoshihiro Kashiba

Masahiko Tada

Darwin Hu

Kengo Mitose

Morison S Cousins

Yuji Tada

Akira Fujiwara

Koichi Fukuo

Masao Yamanaka

Masahiko Minemi

Masaaki Iwamoto

Yasuhiro Urata

Toshihiko Matsubara

Koki Sugawara

Yosuke Nobuta

Hideki Enomoto

Kazuaki Shimoyama

Masakatsu Miyao

Takashi Otowa

Kiyoshi Ishii

Junichi Nakahashi

Yutaka Koinuma

Takeshi Fujisawa

Isao Sakata

Yoshihito Tsuji

Ikuo Ogo

Toshiyasu Komatsu

Masanobu Hirai

Kouki Sugawara

Ryuji Nishida

Taro Maejima

Touri Takahashi

Junzo Nagashima

Arthur J Henry

Montgomery Teague

Naoko Aimiya

Hiroyuki Miura

Kazuhiko Asami

A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surface lower portion of the device.

Semiconductor device having a device fixed on a substrate with an adhesive

By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

A rolled copper foil composed of crystal particles of copper or a copper alloy, wherein an average particle size of the crystal particles composing the outermost surface is not less than 0.2 &#x3bc;m and not greater than 6 &#x3bc;m; a ratio of the average particle size of the crystal particles composing the outermost surface to a thickness of the rolled copper foil is not less than 1% and not greater than 6%; and an intragranular distortion rate found by the following formula (1) when a cross-section perpendicular to a length direction of the rolled copper foil is analyzed by electron backscatter diffraction (EBSD) is not less than 0.5% and not greater than 10%:Intragranular distortion rate (%)=(A)/(B)&#xd7;100&#x2003;&#x2003;Formula (1)in the above formula (1), (A) represents the area of a region identified through image analysis to have an orientation difference of not less than 1 degree and not greater than 15 degrees, and (B) represents the area of a region identified through image analysis to have an orientation difference of not less than 0 degrees and not greater than 15 degrees.

Rolled copper foil

A metallic material for an electrical electronic includes a CU&#x2014;Sun alloy layer () provided on a conductive base (). A Cu concentration of the Cu&#x2014;Sn alloy layer gradually decreases from the base side to the surface () side.

Metal material for electrical electronic component

A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu&#x2014;Sn. The alloy layer of Cu&#x2014;Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu&#x2014;Sn. The alloy layer of Cu&#x2014;Sn has the concentration of Cu decreasing gradually toward the surface thereof.

Connector and metallic material for connector

A plated material, containing: on a conductive substrate, an underlayercomposed of nickel and the like; an intermediate layercomposed of Cu or a Cu alloy being provided thereon; and an outermost layercomposed of a Cu&#x2014;Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.

Plated material and electric and electronic parts using the plated material

A variable compression ratio device includes a piston having a piston inner part and a piston outer part. The piston outer part integrally includes ear parts facing opposite ends of a piston pin and having long holes with longer diameters directed in an axial direction of a piston. A shaft portion connected to the opposite ends of the piston pin is slidably fitted in the long holes to allow an axial relative movement between the piston inner part and the piston outer part, while preventing relative rotation between the piston inner part and the piston outer part. Thus, the variable compression ratio device reliably prevents the relative rotation between the piston inner part and the piston outer part with a simple structure, and reduces weight of the piston.

Variable compression ratio device of internal combustion engine

An aluminum conducting wire, containing a stranded conductor that is formed by stranding solid conductors of an aluminum alloy, in which the aluminum alloy comprises 0.1 to 1.0 mass % of Fe, 0.05 to 0.5 mass % of Cu, and 0.05 to 0.4 mass % of Mg, in which the total amount of Cu and Mg is 0.3 to 0.8 mass %, with the balance being aluminum and inevitable impurities, and a solid conductor of an aluminum alloy for the aluminum conducting wire.

Aluminum conducting wire

The present invention relates to a production process of polyphenylene ether composition comprising (A-1) a polyphenylene ether, (A-2) a polystyrene, (A-3) an ester phosphate, (B) a hindered amine light stabilizer, and (C) an ultraviolet absorber. The feature of the present invention is melt compounding a part of raw materials to obtain a pre-mixture at Step 1, and melt compounding the pre-mixture and the rest of the raw materials at Step 2. A polyphenylene ether composition which has a good light-discoloration resistance and causes little unmelted portion, and to a molded article formed from the polyphenylene ether composition can be obtained according to the production process of the present invention.

Production process of polyphenylene ether composition

The invention relates to: a process for producing a poly(phenylene ether) resin composition which comprises (A) a poly(phenylene ether) and (B) a styrene resin and in which the styrene resin (B) is a styrene resin comprising a rubber-modified polystyrene containing a polybutadiene having 90% or higher cis-1,4 bonds, the process comprising a first step in which the poly(phenylene ether) (A) is melt-kneaded together with (B1) part or all of the styrene resin which does not include any rubber-modified polystyrene containing an unhydrogenated polybutadiene and a subsequent second step in which the remaining styrene resin including (B2) a rubber-modified polystyrene containing a polybutadiene having 90% or higher cis-1,4 bonds is melt-kneaded; and a poly(phenylene ether) resin composition obtained by the process. According to the invention, a modified PPE can be stably supplied which is free from various appearance failures such as black foreign particles, unmelted matter, and color unevenness and is excellent in practical properties such as stability to high-temperature residence, heat exposure resistance, and low-temperature impact resistance, in particular, heat deterioration resistance.

Process for producing polyphenylene ether resin composition

A concentric stranded conductor having a concentric strand having multiple strands. Each strand has multiple single wires. The concentric stranded conductor has a central core strand () and a first concentric strand layer () having multiple first-layer strands () twisted around the central core strand. The twist pitch of the central core strand is from 8 to 70 times the distance between diametrically opposed outer wires of the central core strand, the twist pitch of the first concentric strand layer is from 8 to 30 times the distance between diametrically opposed strands of the first concentric strand layer. |&#x3b1;&#x2212;(&#x3b2;+&#x3b3;)| is 15 degrees or less, where &#x3b1; is the twist angle of the central core strand and &#x3b2; and &#x3b3; are the twist angles of the first-layer strands and first concentric strand layer, and the single wires are made of an aluminum or aluminum alloy to have elongation of 2% or more.

Concentric stranded conductor

A variable compression ratio device of an internal combustion engine includes a piston inner part connected to a connecting rod and a piston outer part fitted on an outer periphery of the piston inner part. The piston outer part is only slidably in an axial direction, and is movable between a low compression ratio position near the piston inner part and a high compression ratio position near the combustion chamber. A skirt part is slidable and is guided by an inner peripheral surface of a cylinder bore of an engine. The skirt part is integrally formed on the piston inner part. A peripheral wall of the piston outer part is terminated directly above the skirt part. Thus, switching of the position between the low compression ratio position and the high compression ratio position by an inertia force of the piston outer part is performed smoothly with a reduction in weight of the piston.

A polyphenylene ether composition comprising: 100 parts by weight of (A) a polyphenylene ether resin or a combination of a polyphenylene ether resin and a styrene resin; 1 to 40 parts by weight of (B) a flame retardant which is comprised mainly of at least one member selected from the group consisting of two specific condensed phosphoric esters; 0.3 to 10 parts by weight of (C) a hydrogenated block copolymer which is defined as a hydrogenation product of a block copolymer comprising a polymerized styrene block and a polymerized conjugated diene block, wherein at least one polymerized styrene block has a number average molecular weight of 15,000 or more; and 0.3 to 10 parts by weight of (D) a polyolefin resin, wherein the weight ratio of the component (C) to the component (D) is from 70/30 to 15/85.

Polyphenylene ether composition

A Rankine cycle system includes a first Rankine cycle (A) operated by a first working medium and a second Rankine cycle (B) operated by a second working medium. The first Rankine cycle (A) is constituted from an evaporator (A), an expander (), a condenser (A) and a supply pump (A), and the second Rankine cycle (B) is constituted from an evaporator (B), the expander (), a condenser (B) and a supply pump (). The evaporator (A) in the first Rankine cycle (A) and the evaporator (B) in the second Rankine cycle (B) are disposed at locations upstream and downstream of an exhaust emission control device () mounted in an exhaust passage () for the internal combustion engine (). The first working medium has a boiling point higher than that of the second working medium, and the capacity of the pump (A) in at least the first Rankine cycle (A) is variable. Thus, the efficiency of recovery of a waste heat from the internal combustion engine by the Rankine cycle system can be enhanced to the maximum, and the activation of the exhaust emission control device can be promoted.

Rankine cycle device of internal combustion engine

The resin composition of the present invention comprises (A) a resin composition comprising a polyphenylene ether resin or a polyphenylene ether resin and a polystyrene resin and (B) a phosphazene compound having an acid value of less than 0.5. This resin composition contains no halogen compounds and hence is environmentally preferred, and furthermore is excellent in electrical characteristics, heat resistance and mechanical properties, causes substantially no problems such as smoking during injection molding and desposition of flame-retardants on the mold, and has high flame retardancy.

Polyphenylene ether resin composition

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Tokyo, Japan

Kazuo Yoshida