Hitachi, Ltd.

Kyowa Hakko Kogyo Co., Ltd.

Nikon Corporation

Kanagawa University

Hitachi Metals, Ltd.

Kyowa Hakko Bio Co., Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Kazuo Yamaguchi

Motoo Yamasaki

Moriyuki Sato

Shunji Maeda

Minoru Yoshida

Yukihiro Shibata

Kenji Oka

Seiga Itoh

Atsushi Yoshida

Yoshiharu Yokoo

Makoto Morimoto

Masami Okabe

Hiromasa Miyaji

Tetsuro Kuga

Yoshinori Komatsu

Hajime Yoshida

Yuji Takagi

Chie Shishido

Yusuke Kawakami

Keiichi Yano

Kenji Shibata

Isao Kawamoto

Eiji Tsukuda

Yuzuru Matsuda

Toshiyuki Suzawa

Shigeto Kitamura

Shigeru Chiba

Mayumi Yoshida

Takeo Tanaka

Tatsuhiro Ogawa

Yoshikazu Morishita

Chieko Bando

Mika Makino

Toshihide Ikemura

Kenji Watanabe

Asahiro Kuni

Kunikatsu Shirahata

Nobuyuki Akiyama

Juro Endo

Hiroshi Kawauchi

Michiko Itou

Kenji Maeda

Ryoichi Katsumata

Susumu Sekine

Kazumi Kawamoto

Koichi Sugimoto

Yukio Hashimoto

Makoto Yagasaki

Toru Mizukami

Sadao Teshiba

Ikuo Kawaguchi

Tetsuya Hirano

Naohiko Baba

Shigenori Ohta

Kozo Nakahata

Kazuo Aoyama

Akiko Saito

Masaru Hasegawa

Shuichi Ishino

Atsushi Murata

Masaki Azuma

Takashi Minato

Tsutomu Yoshiya

Masayuki Ichinohe

Shinzoo Nishiyama

Kyouichi Yamamoto

Kazuhisa Iwata

Genji Itoh

Kouichiro Ohara

A compound represented by Formula (1). [In the formula, X represents a halogen atom or an alkoxy group, Rrepresents any one group selected from an alkyl group having 1 to 5 carbon atoms, a group represented by Formula (R2-1), and a group represented by Formula (R2-2), Rrepresents a group represented by Formula (R2-1) or (R2-2), n0 represents an integer of 0 or greater, n1 represents an integer of 0 to 5, and n2 represents a natural number of 1 to 5.]

Compound, substrate for pattern formation, photodegradable coupling agent, pattern formation method, and transistor production method

What is provided is a compound, a pattern forming substrate, a coupling agent, and a pattern formation method. The compound is represented by Formula (1).

Compound, pattern forming substrate, coupling agent, and pattern formation method

A method for producing a fluorine-containing compound represented by General formula (1), wherein X represents a halogen atom or an alkoxy group, Rrepresents a hydrogen atom or a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, Rand Rare each independently a fluorinated alkoxy group, and n represents an integer of 0 or more. 

Fluorine-containing compound, substrate for patterning, photodegradable coupling agent, patterning method, and compound

Provided is a compound represented by Formula (1). 

Disclosed is a fluorine-containing composition containing a fluorine-containing compound represented by general formula (1) and a fluorine-based solvent. 

Fluorine-containing composition, substrate for pattern formation, photodegradable coupling agent, pattern formation method and transistor production method

A fluorine-containing compound represented by a following general formula (1) is provided. [In the general formula (1), X represents a halogen atom or an alkoxy group, Rrepresents a branched chain or cyclic alkyl group having 3 to 10 carbon atoms, and Rand Rrepresent fluorinated alkoxy groups. n represents an integer of 0 or greater.] 

Fluorine-containing compound, substrate for pattern formation, photodegradable coupling agent, pattern formation method, and compound

Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel.

Defect inspection method and apparatus

A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image.

A method of inspecting patterns to detect a defect of the patterns by using information of a scattered diagram of brightness of said first and second images.

A defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.

Method and apparatus for observing and inspecting defects

A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.

A defect inspecting apparatus can detect finer defects with high resolution optical images of those defects. The apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. A display displays the optical image detected by this lighting and detecting apparatus. An optical parameter setting device sets and displays optical parameters for the lighting and detecting apparatus on the display. An optical parameter adjusting apparatus adjusts optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus. A storage device stores comparative image data. A defect detecting device detects defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.

A defect inspecting apparatus is disclosed that can detect finer defects with high resolution optical images of those defects, and which makes the difference in contrast greater between fine line patterns of a semiconductor device. The defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.

A method of manufacturing an optic transmission module assures a high reliability for the module by inspecting the character of a low bit error rate (BER) of the module quickly and accurately. The module is employed in an optical communication system (light transmission system) required to cope with information communication systems that are becoming faster and faster in operation and larger and larger in capacity. Also disclosed is a system and a method for inspection of the BER character which uses a rectangular wave pulse as an interference light to calculate a degradation quantity of a signal-to-noise ratio (S/N) on the basis of a simple theory, thereby inspecting the BER character by extrapolating a case in which there is no interference light (S/X&equals;&infin; or X&equals;0) with use of a sign error rate theoretical value according to a bit error rate of a light signal measured according to the degradation quantity.

Method for manufacturing optic transmission modules and system for inspecting bit error rate characters

Growing community of inventors

Sagamihara, Japan

Kazuo Yamaguchi