Panasonic Corporation

Joled Inc.

Kazuo Uetani

Kaname Mizokami

Akira Shiokawa

Yoshinao Ooe

Hiroyuki Kado

Shinichiro Ishino

Hideji Kawarazaki

Koyo Sakamoto

Akira Takiguchi

Seiji Imanaka

Kenji Harada

Masaki Nishimura

Jun Hashimoto

Takuya Sato

Zenken Kin

Ken Ito

Hiroyuki Kadou

A method of manufacturing an EL display device having a panel part includes a step of forming film of an element constituting the panel part, by using a vapor deposition equipment. The vapor deposition equipment is equipped with crucible configured to accommodate vapor deposition material, metal case configured to dispose the crucible therein, and heater configured to heat vapor deposition material in the crucible. Case includes container and lid. Container is configured to accommodate crucible with a gap between the container and crucible. Lid is configured to be removably attached to an opening of container, and includes a jetting port through which vapors of vapor deposition material jet out.

Method of manufacturing EL display device

An organic EL display device comprising: an anode; a cathode that is a metal film; a light-emitting layer between the anode and the cathode; and a sealing layer that covers a side of the cathode opposite a side on which the light-emitting layer is provided. An oxidation inhibiting layer and a cathode protecting layer are stacked between the cathode and the sealing layer. The oxidation inhibiting layer is closer to the light-emitting layer than the cathode protecting layer is.

Organic EL display device and method for manufacturing same

A method of manufacturing an EL display device having a panel part that comprises a light emitting part in which a plurality of pixels are arrayed, and a thin-film transistor array device to control light emission of the light emitting part. The method includes the following steps: forming the panel part on a substrate, and then forming a sealing layer to cover the panel part. The step of forming the sealing layer is performed by forming a film configuring the sealing layer, with the mask being disposed over base substrate. Mask includes contact part in contact with the base substrate, and edge part disposed over the panel part with a gap between the edge part and the panel part.

A plasma display panel includes a front panel including a substrate, a display electrode formed on the substrate, a dielectric layer formed so as to cover the display electrode, and a protective layer formed on the dielectric layer; and a rear panel disposed facing the front panel so that discharge space is formed, and including an address electrode formed in a direction intersecting the display electrode and a barrier rib for partitioning the discharge space. The protective layer is formed by forming a base film on the dielectric layer and attaching a plurality of aggregated particles of a plurality of crystal particles of metal oxide to the base film so that a plurality of aggregated particles are distributed over the entire surface, and the base film is made of MgO containing Al.

Plasma display panel with MgO crystal protective layer

An apparatus for forming a protective layer of magnesium oxide on a front glass substrate () in an evaporation chamber () includes the following: oxygen outlet openings () for introducing oxygen into the evaporation chamber (); water vapor outlet openings () for introducing water vapor into the evaporation chamber () from the downstream side in the transfer direction of the front glass substrate (); a mass analyzer () for measuring the ionic strength of hydrogen and the ionic strength of oxygen in the evaporation chamber (); and mass flow controllers () and () for controlling the introduction amount of the water vapor and the introduction amount of the oxygen, respectively, by the ionic strengths measured by the mass analyzer ().

Method and apparatus for forming protective layer

A plasma display panel including: a front panel including a glass front substrate, a display electrode formed on the substrate, a dielectric layer formed so as to cover the display electrode, and a protective layer formed on the dielectric layer; and a rear panel disposed facing the front panel so that a discharge space is formed, the rear panel including an address electrode formed in a direction intersecting the display electrode, a plurality of longitudinal barrier ribs arranged in parallel to the address electrode and a plurality of lateral barrier ribs combined with the longitudinal barrier ribs to form mesh-shaped barrier ribs. The protective layer is formed by forming a base film on the dielectric layer and attaching a plurality of aggregated particles obtained by aggregating a plurality of crystal particles made of metal oxide to the base film so as to be discretely distributed over a surface of the base film.

Plasma display panel

A plasma display panel includes a front panel including a glass substrate, a display electrode formed thereon, a dielectric layer formed so as to cover the display electrode, and a protective layer formed on the dielectric layer; and a rear panel disposed facing the front panel so that discharge space is formed and including an address electrode formed in a direction intersecting the display electrode, and a barrier rib for partitioning the discharge space. The dielectric layer of the front panel contains bismuth oxide and calcium oxide without containing lead, and does not contain lead. The protective layer on the dielectric layer is formed by forming a base film on the second dielectric layer and attaching a plurality of crystal particles made of metal oxide to the base film so as to be distributed over an entire surface of the base film.

A method for manufacturing a protective layer such that when the protective layer is formed in a film-forming chamber, the partial pressure of water in the film-forming chamber is controlled by the exhaust velocity of the water in the film-forming chamber. During formation of the protective layer the total pressure in the film-forming chamber is kept constant. In addition, the partial pressure of the water in the film-forming chamber is controlled while introducing a gas into the film-forming chamber, thereby controlling the ratio of the partial pressure of hydrogen to the partial pressure of oxygen in the film-forming chamber.

Growing community of inventors

Osaka, Japan

Kazuo Uetani