Seiko Epson Corporation

Kazuo Tasaka

Narumi Ishibashi

Masanori Akiyama

Hirokazu Fujishima

A method of manufacturing an electro-optical device by cutting up a pair of mother substrates that are joined to each other by means of a sealant with an electro-optical material being sandwiched therebetween into a plurality of panel formation regions. The method includes: forming a groove along each of at least two pre-work cut lines in either one of the pair of mother substrates; blowing air on one edge face of a region between the grooves formed in the one of the pair of mother substrates; and removing the region between the grooves formed in the one of the pair of mother substrates by vacuuming the region. Herein, the vacuuming is applied to the other edge face of the region.

Method and apparatus for producing electro-optical device

A substrate transfer apparatus transfers substrates stored in a first substrate storage case, which has support grooves in its inner wall, along the support grooves to substrate storage surfaces included in a second substrate storage case. The substrate transfer apparatus includes a first-substrate-storage-case placement section in which the first substrate storage case is placed, a second-substrate-storage-case placement section in which the second substrate storage case is placed, a substrate transfer mechanism that holds the substrates stored in the first substrate storage case so as to draw out the substrates from the first substrate storage case, and transfers the substrates to a substrate placement section of a substrate placing mechanism, a substrate holding mechanism that holds the substrates placed in the substrate placement section at hold positions, and discharges the substrates at discharge positions so as to dispose the substrates on the substrate storage surfaces of the second substrate storage case, and a transport mechanism that transports the substrate holding mechanism from the hold positions to the discharge positions.

Substrate transfer apparatus, method of transferring substrate, and method of manufacturing electro-optical device

A substrate gap adjusting device adjusts a gap between first and second substrates in a composite substrate. In the substrate gap adjusting device, the composite substrate includes the first substrate; the second substrate that is oppositely bonded to the first substrate through a sealant, the second substrate having a smaller area than the first substrate; and liquid crystal that is injected into a space surrounded by the first substrate, the second substrate, and the sealant. The substrate gap adjusting device includes a first base that has a mounting section; a ring-shaped support member that is mounted on the mounting section and that comes in contact with a second surface out of two surfaces of the first substrate so as to support the composite substrate, the second surface being opposite to a first surface on which the second substrate is bonded; a substrate pressing section that has a movable range in a normal direction of a plane defined by the support member and comes in contact with the first substrate at a circumferential edge of the first surface in any position of the movable range; and an external applying section that transmits a force to the substrate pressing section, the force displacing the substrate pressing section within the movable range. In this structure, the circumferential edge is positioned at the outer side of the support member, as seen from the normal direction.

Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device, comprising substrate pressing sections that independently transmit force

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Eniwa, Japan

Kazuo Tasaka