Sharp Kabushiki Kaisha Corporation

Kazuo Tamaki

Yoshihisa Dotta

Yoshiki Sota

Yasuyuki Saza

Toshio Hata

Shinji Yamaguchi

Masanobu Okano

Masayuki Ohta

Masaki Tatsumi

Hiroshi Umeda

Tomoshi Kimura

Masayuki Itoh

Tohru Ohnishi

Atsushi Yamashita

Masahiro Konishi

Manabu Onozaki

Shin Itoh

Masamichi Harada

Yuji Yano

Yasuki Fukui

Shin Ito

Yusuke Shibata

Yoshifumi Inada

Naruki Hara

Masataka Yamashita

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion.

Test socket and method of manufacturing the same

An illumination device () includes a light guide plate () and a light source unit () which includes a substrate () and a plurality of LED chips () disposed on the substrate (), and which is disposed in a position at which emitted light of the LED chips () enters a light entrance portion () of the light guide plate (). The LED chips () are disposed to form a plurality of rows on the substrate (), and are disposed to line up in a direction which orthogonally intersects the rows between each of the rows.

Illumination device, illumination equipment, and display device

A method for manufacturing a light-emitting device of the present invention includes a step in which solid-state sealing resin () containing a phosphor () and the solid-state sealing resin () containing a phosphor () are arranged in recesses in package resin () having LED chips placed thereon, are thereafter melted by heating, and, in addition, are cured by heating.

Method for manufacturing light-emitting device

Pkg resin crack is suppressed after dicing. A light emitting devicewhere a light emitting devicethat emits light is mounted on a lead frameand that uses a resin cavity molding packagehaving an integrally molded lead framesconstituting electrodes that correspond to the light emitting elementand resin, wherein roundness is given to a part or all of a cutting plane corner part of a retention section (hanger lead) that become a cause of crack generation due to the retention sections (hanger leads) of the lead frames giving stress concentration to resin at the time of cutting by a blade

Light emitting device, lead frame and resin cavity molding package

Improves light extraction efficiency. A light emitting deviceusing a white resin molding packageintegrally molded with lead framesconstituting an electrode corresponding to one or a plurality of light emitting elementand white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting elementis configured to be larger than total area in a plane view occupied by surfaces of the lead framesand the light emitting element. Further, a step section is formed on the surfaces of lead frames, white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting elementis mounted is increased.

Light-emitting device with reflective resin

Light emitting device

A light-emitting apparatus including: a substrate; an LED chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the LED chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like.

Light-emitting apparatus and method for manufacturing same

A semiconductor apparatus according to the present invention with a semiconductor element implemented on an insulated substrate comprises: a substrate front surface electrode formed on a front surface side of the insulated substrate and connected with an element electrode of the semiconductor element; a substrate back surface electrode formed on a back surface side of the insulated substrate and electrically connected with the substrate front surface electrode; and a plurality of connection electrodes, extending in a thickness direction of the insulated substrate from one side to the other side of a front surface and a back surface thereof, for electrically connecting the substrate front surface electrode with the substrate back surface electrode, where the substrate front surface electrode or the substrate back surface electrode is formed to have a plane pattern separated for each of the plurality of connection electrodes.

Semiconductor apparatus, inspection method thereof and electric device

The semiconductor device includes a plurality of semiconductor chips, and a circuit substrate having a substantially rectangular outer shape. The semiconductor device is an MCM having an MCM packaging structure in which the plurality of semiconductor chips are juxtaposed on the semiconductor chip mounting surface of the circuit substrate, and the semiconductor chip mounting surface is covered by a sealing resin along an outer edge of the circuit substrate so that the plurality of semiconductor chips are sealed. The thickness of the semiconductor chip to be mounted so as to traverse a center line has a thicker thickness in a direction perpendicular to the semiconductor chip mounting surface than the thickness of any of the other semiconductor chips which is mounted on the semiconductor chip mounting surface, the center line being defined an intersection of (i) a longitudinal cross section which divides the semiconductor chip mounting surface into two in a longitudinal direction of the semiconductor chip mounting surface and (ii) a transverse cross section which divides the semiconductor chip mounting surface into two in a transverse direction of the semiconductor chip mounting surface. This enables to suppress the warpage generated in the semiconductor device, and to reduce inadequate connection occurred due to the warpage in the semiconductor device.

Semiconductor device

With a semiconductor apparatus package of example embodiments of the technology disclosed herein and a method of producing the semiconductor apparatus package, the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin. The circuit board has a groove in a section of a surface of the circuit board. The section is outside of the resin sealing section, and the surface includes the resin sealing section. The groove is at least partially filled with sealing resin having seeped from a resin sealing section. Thus, in the semiconductor apparatus package including the circuit board, which is exposed from the resin sealing section, and the semiconductor device sealed on the circuit board with the sealing resin, the spread of a thin resin film onto that exposed circuit board resulting from seepage of resin sealing the semiconductor device is prevented.

Semiconductor apparatus and method of producing the same

A bump structure includes a squashed ball provided on an electrode pad, and a wire provided on the squashed ball. The wire is a wire loop that is loop-shaped and is formed so as to protrude from an end part of the squashed ball. This provides high bonding reliability between a bonding pad and the bump structure.

Bump structure, method of forming bump structure, and semiconductor apparatus using the same

A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 &#x3bc;m or more and 100 &#x3bc;m or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits are provided.

Semiconductor package and a method for producing the same

A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input/output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input/output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input/output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.

Stack type semiconductor apparatus package and manufacturing method thereof

A semiconductor device includes, a circuit constituting section having a function circuit and an externally-drawing electrode, connected to the function circuit, on a surface of the circuit constituting section. An insulating layer is provided on a side of a rear surface of the circuit constituting section. The insulating layer has a face opposite to the circuit constituting section, which has an area that is larger than an area of the rear surface of the circuit constituting section.

Growing community of inventors

Osaka, Japan

Kazuo Tamaki