Sumitomo Chemical Company, Limited

Kazuo Takebe

Yutaka Shiomi

Shuichi Kanagawa

Shigeki Naitoh

Yasuhiro Hirano

Noriaki Saito

Masatsugu Akiba

Takashi Morimoto

Shinichiro Kitayama

Mitsuhiro Shibata

Yasuhiro Endo

Kunimasa Kamio

Yasuhisa Saito

Youichi Ueda

Shigeo Hozumi

Takao Mori

Yasuhide Sugiyama

A colored photosensitive composition used for producing a color filter which comprises a colorant (A), a binder polymer (B), a photo-polymerizable compound (C), a photo-polymerization initiator (D) and a chain transfer agent (E) is provided, and using the colored photosensitive composition, color pixels or black matrices having a rectangular or forward-tapered cross section can be formed even when the colored photosensitive composition contains the colorant in a high concentration.

Colored photosensitive composition and method for producing a color filter

A photosensitive solution comprising a colorant, a binder, a photoactive compound and a solvent, wherein the solvent can dissolve a dried film formed from a photosensitive solution in 5 minutes or shorter when the dried film is immersed in the solvent, the amount of the solvent being 10 times by weight based on the amount of the dried film, is provided; and by using the photosensitive solution, even when application of the solution is conducted with a coater of slit and spin system, formation of the dried colored matter adhered to a color filter can be suppressed, frequency of the washing can be reduced, and the productivity can be improved.

Photosensitive solution for forming picture cell

A pigment-dispersion photo-sensitive coating solution comprising a binder resin, an organic-solvent and a main pigment dispersed in the solvent, wherein the combined area of peaks detected at a relative retention ratio in the range of 0.68 to 0.72 based on a retention time of dibutyl phthalate and peaks detected at a relative retention ratio in the range of 1.06 to 1.10 based on a retention time of dibutyl phthalate is not more than 50% of the total area of all peaks when the pigment is extracted by ethyl acetate and the extracts are analyzed by high-speed liquid chromatography using dibutyl phthalate as internal standard, is provided and use of the coating solution ensures that the colored image of stable quality is formed.

Pigment-dispersion photo-sensitive coating solution

An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

Unsaturated imide compounds containing alicyclic structure, process for

An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) ##STR1## wherein each R.sub.1, independent of the other, represents hydrogen, a hologen atom, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups, and X represents ##STR2## and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product exhibiting low hygroscopicity and high adhesiveness.

Epoxy resin composition and resin-encapsulated semiconductor device

A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

Semiconductor device encapsulated with an epoxy resin and a process for

The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the

An epoxy resin composition contains (a) an epoxy resin represented by the general formula (2) ##STR1## wherein R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

Polyhydric phenol, and epoxy resin and epoxy resin composition derived

There is provided an epoxy resin composition represented by the general formula: ##STR1## wherein R.sub.1 represents an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, R.sub.2 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl group, and n represents an average number of repeating units of 0.1 to 1.6. Cured products prepared from the epoxy resin have a lower hygroscopicity and a balance between thermal resistance and curing performance.

Polyhydric phenol and epoxy resin and epoxy resin composition derived

A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.

Aromatic allyl amine thermosetting resin composition

A thermosetting resin composition is provide, which contains a compound of ##STR1## wherein substituents R.sub.1 -R.sub.6 each represents a hydrogen atom or a saturated alkyl group having 1-6 carbon atoms, substituents R.sup.7 -R.sup.12 each represents a hydrogen atom, a saturated alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms, X.sub.a -X.sub.e each represents a hydrogen atom, a chlorine atom or a bromine atome, and the average repeating unit number n denotes a numeral from 0 to 5, and a polyamide compound having two or more maleimide groups and, if desired, a compound of ##STR2## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicylic epoxy group, l denotes a numeral in the range of 0-500, and m denotes a numeral in the range of 1-500, or ##STR3## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicyclic epoxy group, and p denotes a numeral in the range of 0-500. The composition is useful for electronic parts.

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Tsukuba, Japan

Kazuo Takebe