Denso Corporation

Jtekt Corporation

Kazuo Tada

Koji Kondo

Satoshi Takeuchi

Shigeki Nagase

Yoshihiko Shiraishi

Toshikazu Harada

Toshihiro Miyake

Hideki Seki

Kimitake Ishikawa

Yoshitaro Yazaki

Hideaki Kako

Yasuhiro Sagou

Hiroyasu Oide

Kouji Kondoh

Masayuki Aoyama

Yosuke Ozaki

Masaaki Inoguchi

Katsumi Yamazaki

Seiji Konishi

Seiichi Shindou

A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.

Radiant heater

In a semiconductor device, each of a first connection metal member, a second connection metal member, a third connection metal member, and a fourth connection metal member electrically connects a corresponding line to a corresponding one of main electrodes formed on lower surfaces and upper surfaces of first and second semiconductor elements. A cross-sectional area of each of the first connection metal member, the second connection metal member, the third connection metal member, and the fourth connection metal member is larger than a cross-sectional area of a fifth connection metal member that is disposed at a region located outside regions of the first and second semiconductor elements in a plan view.

Semiconductor device

A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.

Multi-layer printed circuit board and method for manufacturing the same

A multilayer printed circuit board with a built-in capacitor includes a plurality of resin films, each of which is made of thermoplastic resin and has a plurality of via-holes at predetermined positions, a plurality of conductive patterns, which are located on the resin films, and a plurality of conductive pattern interconnecting members, which are located in the via-holes to electrically interconnect the conductive patterns that are electrically separated by the resin films. Two of the conductive patterns are respectively located on two surfaces, which are opposite to each other, of one of the resin films while overlapping. The two of the conductive patterns and the one of the resin films make up a capacitor.

Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board

Growing community of inventors

Kariya, Japan

Kazuo Tada