Hitachi, Ltd.

Kazuo Shirase

Kenji Morita

Hideaki Sasaki

Shinichi Kazui

Hitoshi Odashima

A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N wherein a value of N N is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.

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Hadano, Japan

Kazuo Shirase