Kabushiki Kaisha Toshiba

Mitsubishi Materials Corporation

Tokyo Institute of Technology

Shizuoka University

Kazuo Shinozaki

Akihiko Tsuge

Kazuo Anzai

Mituo Kasori

Fumio Ueno

Akihiro Horiguchi

Takeshi Takano

Hiroshi Inoue

Mitsuo Kasori

Hiroshi Imagawa

Hideki Sato

Hiroshi Endo

Nobuyuki Mizunoya

Mitsuyoshi Endo

Akira Osada

Shun-ichiro Tanaka

Nobuo Iwase

Noboru Sato

Kiyoshi Iyogi

Masaru Hayashi

Hidemitsu Takaoka

Naoki Wakiya

Kazutaka Saitoh

Hisao Suzuki

Yoshiko Sato

A method of manufacturing a surface-coated cutting tool includes: forming an aluminum oxide layer having a layer thickness of 0.05 to 5 &#x3bc;m and an &#x3b1;-alumina structure with a corundum type crystal structure on a cutting tool body using a sol-gel method. The step of forming includes adding an alcohol to aluminum alkoxide; adding an acid; stirring the mixture at 10&#xb0; C. or lower to form a sol; applying the sol on a surface of the cutting tool body or an outer-most surface of a hard-coating layer formed on the surface of the cutting tool body; performing a drying process at least once, the applied sol being dried at 100 to 400&#xb0; C. in the drying process; and annealing the cutting tool body with a dried sol layer at 500 to 1000&#xb0; C.

Method of manufacturing surface-coated cutting tool with excellent abrasion resistance

There is disclosed an aluminum sintered body prepared by sintering aluminum nitride and additives, which consists essentially of

Aluminum nitride sintered body

There are disclosed an aluminum sintered body comprising

Aluminum nitride sintered body and preparation thereof

According to the present invention, there is provided an aluminum nitride sintered body having a high thermal conductivity and essentially consisting of a AlN single-phase, containing 0.01 to 8,000 ppm of rare earth elements and less than 2,000 ppm of oxygen. According to the present invention, there is provided a method of fabricating an aluminum nitride sintered body having a high thermal conductivity and essentially consisting of AlN single-phase, containing 0.01 to 8,000 ppm of rare earth elements and less than 2,000 ppm of oxygen, wherein a molded body prepared by mixing and molding an aluminum nitride power having less than 7 wt % of oxygen and an average particle size of 0.05 to 5 .mu.m and with rare earth compounds of 0.01 to 15 wt % of based on rare earth elements content, or a sintered AlN body containing oxide grain boundary phases of 0.01 to 15 wt % of rare earth elements and 0.01 to 20 wt % of oxygen and (rare earth element)--Al--O compounds phases and/or (rare earth element)--O compounds phases, is fired in a reducing atmosphere at a temperature of 1,550 to 2,050.degree. C. for 4 hours or more.

AlN sintered body having high thermal conductivity and a method of

For higher thermal conductivity, stronger adhesion strength, excellent insulating characteristics, and multilayer interconnection, an aluminium sintered body for circuit substrates comprises a novel conductive metallized layer on the surface of the sintered body. The metallized layer comprises at least one element selected from the first group of Mo, W and Ta and at least one element selected from the second group of IIa, III, IVa group elements, lanthanide elements, and actinide elements in the periodic table, as the conductive phase element. The first group element serves to improve the heat conductivity and resistance, while the second group serves to increase the wetness and adhesion strength between the insulating body and the metallized layer. Further, the plural insulating ceramic bodies and the plural metallized conductive layers can be sintered simultaneously being stacked one above the other to permit a multilayer interconnection.

Aluminum nitride sintered body having conductive metallized layer

An aluminum nitride-based sintered body having a high thermal conductivity and a total oxygen content of 0.01 to 20% by weight which is prepared by mixing a main component of aluminum nitride powder containing 0.001 to 7% by weight of oxygen with 0.01 to 15% by weight of at least one of the group consisting of a powder of a rare earth element and/or a powder of a material containing the rare earth element (said 0.01 to 15% by weight being counted on the basis of the content of the rare earth element), and sintering said powder mixture.

Aluminum nitride-based sintered body of high thermal conductivity

Disclosed are an aluminum nitride sintered body comprising aluminum nitride, rare earth element-aluminum compounds and alkaline earth metal-aluminum compounds, and a process for producing an aluminum nitride sintered body, which comprises adding to aluminum nitride powder:

Aluminum nitride sintered body and process for producing the same

An aluminum nitride sintered body prepared by a process comprising adding to a principal component of aluminum nitride an additional component of at least one of fluorides of alkaline earth metals selected from the group consisting of calcium (Ca), strontium (Sr) and barium (Ba) or at least one of fluorides of rare earth elements added in an amount of 0.01 to 20% by weight, followed by sintering.

A high thermal conductivity circuit substrate is provided comprising a sintered aluminum nitride ceramic substrate consisting essentially of one member selected from the group of yttrium, the rare earth metals and the alkali earth metals and an electrically conductive thick film paste for a conductive layer formed on the substrate.

Circuit substrate having high thermal conductivity

Growing community of inventors

Inagi, Japan

Kazuo Shinozaki