Nippon Soda Co., Ltd.

Nisso Chemical Analysis Service Co., Ltd.

Kazuo Ono

Nobuo Kimura

Natsuki Amanokura

Masami Kaneko

Shigemichi Fukayama

Masayuki Kataoka

Kazuji Okabe

Yoshiharu Komoda

Tomoya Hidaka

Motoyuki Toki

Akiji Higuchi

Yoshitaka Fujita

Norifumi Nakamoto

Hitoshi Matsumoto

Eiji Hoshi

Hiroyuki Takeda

Naoyuki Kamegaya

Emi Nakayama

A method for producing a thermodynamically more stable clathrate compound including at least one compound selected from the group consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 5-hydroxyisophthalic acid, and 5-nitroisophthalic acid as a host compound and an imidazole compound as a guest compound. The method for producing a clathrate compound includes: a mixing step of mixing a mixed solvent including a protic solvent, at least one compound selected from the group consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 5-hydroxyisophthalic acid and 5-nitroisophthalic acid, and an imidazole compound; and a heating step.

Production method for inclusion compound

It is to provide a more stable crystal polymorph of a clathrate compound consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane and 2-phenyl-4-methyl-5-hydroxymethylimidazole (molar ratio 1:2). A novel crystal polymorph of a clathrate compound, consisting of 1,1,2,2-tetrakis(4-hydroxyphenyl)ethane and 2-phenyl-4-methyl-5-hydroxymethylimidazole (molar ratio 1:2) and has diffraction peaks at diffraction angles (2&#x3b8;) of 11.20&#xb0;, 13.36&#xb0;, 14.36&#xb0;, 18.16&#xb0;, 19.20&#xb0;, 19.68&#xb0;, 20.84&#xb0;, 21.48&#xb0;, 22.56&#xb0;, 23.76&#xb0; and 24.08&#xb0; in a powder X-ray diffraction pattern as measured using a CuK&#x3b1; ray, can be obtained by, for example, further recrystallizing a crystal obtained by a conventionally known method or the like.

Crystal polymorphism of inclusion compound and method for producing same, and curable resin composition

An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): 

Composition for formation of cured epoxy resin, and cured products thereof

It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4'-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.

Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor

The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C-Calkyl group, phenyl group, benzyl group or cyanoethyl group, and Rto Rrepresent a hydrogen atom, nitro group, halogen atom, C-Calkyl group, phenyl group, benzyl group, hydroxymethyl group or C-Cacyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein Rto Reach represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.

Epoxy resin composition, curing agent, and curing accelerator

The invention provides dispersoids having metal-oxygen groups which are suitable for the production of metal oxide thin-films at a low temperature of 200&#xb0; C. or below and for the production of homogeneous organic-inorganic hybrid materials. The invention also provides metal oxide thin-films and organic-inorganic hybrid materials endowed with various capabilities, particularly organic-inorganic hybrid materials having a high refractive index and high transparency. Use is made of a dispersoid having metal-oxygen bonds which is obtained by mixing a metal compound having at least three hydrolyzable groups with at least 0.5 mole but less than 2 moles of water per mole of the metal compound in an organic solvent, in the absence of an acid, a base and/or a dispersion stabilizer, and at a temperature at or below the temperature at which the metal compound begins to hydrolyze, then raising the temperature to at least the temperature at which hydrolysis begins.

Dispersoid having metal-oxygen bonds, metal oxide film, and monomolecular film

A metallic or resinous material having excellent deodorant, antifouling, antibacterial, antifungal, and other effects which can be industrially efficiently provided by applying to a polymer resin film an adhesive coating fluid containing a silane coupling as a hardener, drying the coating to form an adhesive layer, applying a coating fluid for photocatalyst-layer formation, subsequently drying the coating to produce a photocatalyst-supporting film consisting of the polymer film and a photocatalyst layer deposited thereon through the adhesive layer, and laminating this photocatalyst-supporting film to the surface of a metallic plate or resin structure by heat pressing. The laminate may be processed into a complicated shape.

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Ichihara, Japan

Kazuo Ono