Mitsubishi Denki Kabushiki Kaisha

Kazuo Okahashi

Osamu Hayashi

Ichiro Takahashi

Goro Okamoto

Hiroshi Adachi

Etsushi Adachi

Mitsuhiro Nishida

Hiromi Ito

Hiroshi Ono

Hitoshi Yamazaki

Sakuei Yamamoto

Kyoichi Shibayama

Tadaki Murakami

Toshiyuki Kobayashi

Kazuharu Kato

Takao Takeda

Isao Ishii

Sadamu Matsuda

Kou Shimomura

Nobuo Sonoda

Shoji Takagi

Kiyoshi Takata

High purity phenyl silicone ladder polymer, and a method for producing such polymer, suitable for use as the protective film, the interlayer insulating film, etc. in the fabrication of semiconductor elements, which polymer contains therein 1 ppm or below of each of sodium, potassium, iron, copper, lead and chlorine, and 1 ppb or below of each of uranium and thorium, and which is represented by the following general formula (I): ##STR1## (where: R.sub.1 to R.sub.4 denote respectively hydrogen or a lower alkyl group; n is an integer of from 8 to 1,000); or the following general formula (II): ##STR2## (where: n is an integer of from 8 to 1,600).

High purity phenyl silicone ladder polymer and method for producing the

A material for forming a high purity thin film which includes a silicone ladder polymer dissolved in an organic solvent is applied to a substrate to form a thin film thereon. The thin film is then heated, thereby removing the solvent and simultaneously curing the thin film. Subsequently, the cured thin film is exposed to an oxygen plasma to form a high purity SiO.sub.2 thin film on the substrate. Although the method consists of simple processes and employs low treatment temperatures, it is capable of forming a high purity SiO.sub.2 thin film which exhibits excellent step coverage and high dielectric breakdown strength.

Method of forming high purity SiO.sub.2 thin film

A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus.

Semiconductor sealing epoxy resin composition

A stress relaxation protective layer made of a silicone material is formed on a coating covering a circuit disposed on a substrate of a semiconductor device, and a predetermined depth of the surface of the stress relaxation protective layer is modified. A resist is formed on the thus-modified surface of the stress relaxation protective layer, and the thus-formed resist is patterned so that the resist in a predetermined region is removed. The stress relaxation protective layer in the region from which the above-described resist has been removed is removed by etching, and the remaining resist is removed. Next, the coating layer in the region from which the stress relaxation protective layer has been removed is removed by etching with the remaining stress relaxation protective layer used as a mask so that the circuit is exposed. The manufacturing process for semiconductor devices can be significantly simplified since the resist patterning needs to be performed only once and the resist removal can be performed by a dry treatment.

Method of manufacturing semiconductor device using silicone protective

An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube and an insulating member adhered on and around the outer peripheral surface of the metal conduit tube. The insulating member is a laminated body of a web of glass fiber impregnated with water-dispersion varnish of a hot-water resistant and thermoplastic resin and a polyether/ether/ketone resin film, which is formed by first alternately winding the glass fiber web and the resin film on and around the outer peripheral surface of the metal conduit tube for a plurality of winding turns, and then subjecting both polyether/ether/ketone resin film and glass fiber web thus wound on and around the metal conduit tube to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C, and under a pressure of from 10 kg/cm.sup.2 to 200 kg/cm.sup.2.

Electrode supporting conduit tube for electrical heating of underground

An electrode supporting conduit tube for electrical heating of underground hydrocarbon resources comprises a metal conduit tube; and an insulative covering adhered on and around the outer peripheral surface of the metal conduit tube, the insulative covering being a laminated body of polyether/ether/ketone resin and glass fiber, which is obtained by confining both polyether/ether/ketone resin and glass fiber wound on and around the metal conduit tube within a metal mold and subjecting the laminated materials to shaping under heat and pressure at a heating temperature of from 350.degree. C. to 450.degree. C. and a pressure of from 10 to 200 kg/cm.sup.2.

Electrode supporting conduit tube for electrical heating or underground

A conduct pipe produced by the process of:

Conduct pipe covered with electrically insulating material

A conduct pipe covered with an electrical insulating material, which is obtained by a process comprising winding a polyether ether ketone resin film around the outside of a metal conduct pipe, carrying out impregnation treatment in vacuum under pressure with using an impregnant resin comprising an ether bonding epoxy resin, and thereafter hardening by heating, is disclosed. The conduct pipe is particularly useful in an electrode apparatus for collecting underground hydrocarbon resources by an electrically heating method.

A method for producing an air-tight, heat-resistant plate for a particular use in manufacturing bulbous fluorescent lamp, which comprises: preparing a shaping material by mixing an inorganic filler composed of alumina powder and silica powder in a specified compositional ratio, and glass powder having a thermal expansion coefficient of 8.5 to 11.5.times.10.sup.-6 /.degree.C., both inorganic filler and glass material being blended at a predetermined ratio then, forming the shaping material into a shaped product of any desired configuration by a known shaping method; thereafter heating this shaped body to a temperature, at which the glass powder used becomes molten and fused, thereby rendering it to be a burned body.

Method for producing air-tight, heat-resistant plate

An insulating pipe joint is disclosed. The joint comprises a first tubular member, a second tubular member comprising a cylinder having the same inside diameter as that of the first tubular member and an annular metal stopper at one end of said cylinder, and an insulator made of a glass/mica composition and a cured organic, solventless resin. The annular metal stopper has an inside diameter larger than the outside diameter of the first tubular member, and the annular metal stopper nests the first tubular member with a space left between them. The insulator fills the space to hold the first and second tubular members in position and provide air- and water-tightness, and secures the insulation creeping distance between each tubular member.

Insulating pipe joint

A conduit tube of an electrode device for electrically heating underground hydrocarbon resources, which comprises: a metal conduit tube and an electrically insulative covering adhered on and around the outer peripheral surface of said metal conduit tube, said electrically insulative covering being formed by adhering polyether/ether/ketone resin in powder form having particle size of a range of from 10 to 100 .mu.m on and around said metal conduit tube which has been preheated to a temperature range of from 350.degree. C. to 450.degree. C. by the electrostatic coating method, and fusion-bonding the electrically insulative covering material thereon at said temperature range of the preheating.

Conduit tube of an electrode device for electrically heating underground

A molding material having low moisture permeability for use in the stators of submersible motors. The molding material comprises approximately 20-30 parts by weight of an epoxy resin, approximately 1-3 parts by weight of a curing agent, approximately 0.5-1.5 parts by weight of zinc stearate, approximately 2-3 parts by weight of a mechanical reinforcing agent, approximately 7.5-56.5 parts by weight of quartz powder, and one or more substances selected from anhydrous gypsum and silica gel, with the total amount of said inorganic substance(s) being approximately 55-20 parts by weight, and with the total amount of quartz powder and said inorganic substance(s) being approximately 62.5-76.5 parts by weight. Because of its low moisture permeability, the insulating properties of the molding material can be maintained indefinitely.

Molding material for the stator of a submersible motor

An epoxy resin composition for flexible products having excellent electrical and mechanical characteristics and having long pot-life is provided by incorporating (A) a liquid epoxy compound having 2 or more epoxy groups in one molecule, (B) an acid anhydride type hardener and (C) a reaction product obtained by reacting a phenoxy resin or a high molecular weight epoxy resin with a monohydric alcohol glycidyl ether and a metal salt of carboxylic acid.

Epoxy resin composition

This invention relates to an epoxy resin composition suitable for impregnating coils of electrical apparatus such as motors, generators and the like. More particularly, this invention relates to an epoxy resin composition having excellent workability and a long pot life, which composition is prepared by adding the reaction product of the glycidyl ether of a monoalcohol and a metal carboxylate, which works as a reactive diluent and accelerator, to an epoxy resin having at least two epoxy groups per molecule and containing a curing agent.

Growing community of inventors

Amagasaki, Japan

Kazuo Okahashi