Seiko Epson Corporation

Kazuo Oike

Chihiro Tanaka

Katsuhiro Imai

Satoshi Taguchi

Kozo Gyoda

Yoshio Yamaguchi

Katsuya Ide

Hideki Uehara

Naoki Makino

Yasuhiro Kitagawa

An electrical wiring structure is provided which can be formed simultaneously when non-linear elements containing corrosion resistant metal wires and non-corrosion resistant metal wires are formed. In addition, a manufacturing method of the electrical wiring structure, an electro-optical device substrate provided with the electrical wiring structure, an electro-optical device, and a manufacturing method thereof are also provided. In particular, an oxide layer and the non-corrosion resistant metal wire are sequentially formed on a surface of the corrosion resistant metal wire. An exposed portion of the corrosion resistant metal wire is formed by removing part of the oxide layer. An electrical connection auxiliary member, such as a through-hole formed at the exposed portion or a conductive inorganic oxide film formed on the corrosion resistant metal wire and the exposed portion, is formed to electrically connect the corrosion resistant metal wire and the non-corrosion resistant metal wire.

Electrical wiring structure, manufacturing method thereof, electro-optical device substrate having electrical wiring structure, electro-optical device, and manufacturing method thereof

A liquid crystal device comprises a plurality of pixel electrodes ( ), and nonlinear elements ( ) including element-side electrodes ( ) electrically connected to the pixel electrodes ( ). An element-side electrode ( ) is shaped in a pattern ( ) formed along the edge of a pixel electrode ( ). The presence of the element-side electrode pattern ( ) makes it possible to prevent etchant from entering between said pixel electrode ( ) and the element-side electrode ( ) and causing a wire break therebetween in patterning the pixel electrode ( ). When the element-side electrode pattern ( ) is made of a substance having a higher light-shielding ability than that of the pixel electrode ( ), it may be used as a mark for adjusting position in bonding an element substrate and an opposite substrate.

Liquid crystal device, liquid crystal device manufacturing method and electronic apparatus

A new drying method and apparatus is provided for drying a semiconductor device substrate, a liquid crystal panel substrate, or the like, which can reduce the possibility of contamination during drying, reduce facility costs and the area required for setting the facilities, and can perform drying in batches. Of the four sides of the upper end of the pull-up bath,two of the sides that oppose each other have a smaller height than the remaining two sides, and form overflow portions,where water in the pull-up bath overflows into a drainage bath,A rod-shaped heater,is mounted to the inside of the pull-up bath,and a heater cover,is disposed above the heater,with a pair of exhaust tubes,being led out to a location above the pull-up bath,so as to allow discharge of gas to the outside therefrom. A water supply tube,is connected to the bottom surface of the pull-up bath,to allow ultra-pure water to be supplied from a water supply system to be described later. A drainage tube,is connected to the lower portion of the drainage bath,as well as to a water supply control device,composed of a circulating pump, a change-over valve, or the like.

Pull-up drying method and apparatus

Liquid-crystal display unit, and process for manufacturing the same

Growing community of inventors

Suwa, Japan

Kazuo Oike