Sumitomo Electric Industries, Limited

Sumitomo Electric Hardmetal Corp.

Sumitomo Electric Sintered Alloy, Ltd.

Kazuo Nakamae

Motoki Kakui

Shinobu Tamaoki

Yoshiki Nishibayashi

Hitoshi Sumiya

Natsuo Tatsumi

Yoshihiro Hirata

Yasuomi Kaneuchi

Mamoru Ono

Hiroyuki Murase

Atsushi Sato

Koji Yamaguchi

Katsuko Yamamoto

Yutaka Kobayashi

Kazushi Kusawake

Masato Uozumi

Tsuyoshi Haga

Jun Yorita

Kazuya Yano

Katsuyuki Tanaka

Hiroyuki Shimada

Kazunori Okada

Yoshinori Tanigawa

Teruhiro Enami

Toshiyuki Numazawa

Toshimitsu Sakata

Hiroki Moriwaki

Yoshikazu Yamashita

A method of manufacturing a diamond by a vapor phase synthesis method includes: preparing a substrate including a diamond seed crystal; forming a light absorbing layer lower in optical transparency than the substrate by performing ion implantation into the substrate, the light absorbing layer being formed at a predetermined depth from a main surface of the substrate; growing a diamond layer on the main surface of the substrate by the vapor phase synthesis method; and separating the diamond layer from the substrate by applying light from a main surface of at least one of the diamond layer and the substrate to allow the light absorbing layer to absorb the light and cause the light absorbing layer to be broken up.

Method of manufacturing diamond, diamond, diamond composite substrate, diamond joined substrate, and tool

A method for manufacturing a semiconductor substrate according to the present invention includes preparing a seed substrate containing a semiconductor material, forming an ion implanted layer at a certain depth from a front surface of a main surface of the seed substrate by implanting ions into the seed substrate, growing a semiconductor layer on the main surface of the seed substrate with a vapor-phase synthesis method, and separating a semiconductor substrate including the semiconductor layer and a part of the seed substrate by irradiating the front surface of the main surface of at least any of the semiconductor layer and the seed substrate with light.

Method for manufacturing semiconductor substrate, semiconductor substrate, method for manufacturing combined semiconductor substrate, combined semiconductor substrate, and semiconductor-joined substrate

A low-loss compact and a method for producing the compact are provided. A method for producing a compact by using coated soft magnetic powder that includes coated soft magnetic particles constituted by soft magnetic particles and insulating coatings coating outer peripheries of the soft magnetic particles includes a raw material preparation step and an irradiation step. In the raw material preparation step, a raw compact is prepared by press-forming coated soft magnetic powder. In the irradiation step, part of a surface of the raw compact is irradiated with a laser. Irradiating a part of a surface of a raw compact with laser increases the number of disrupted portions of conductive portions where constituent materials of the soft magnetic particles at the surface of the raw compact have become conductive to each other, and the loss of the compact can be decreased.

Compact, method for producing compact

A cutting tool includes a portion made of a high hardness material. The portion includes a rake face, a flank face, and a cutting edge. The rake face is divided into a region A along the cutting edge and a region B excluding the region A of the rake face, a surface roughness of the region A is smaller than a surface roughness of the region B, and the region B is deepened with respect to a position of the region A.

Cutting tool

Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam.

Cutting tool and method and apparatus for manufacturing the same

The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (), a YbDF (), a bandpass filter (), a YbDF (), a bandpass filter (), a YbDF (), a YbDF (), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus () and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.

Laser processing method and laser processing device

The present invention relates to a laser marking method which is capable of changing the grey level of a marking even in the case of a high processing speed. The laser marking method forms a marking pattern on a marking object by irradiating the marking object with pulsed light oscillated from a pulsed light source of a MOPA structure in which a semiconductor laser outputting directly-modulated pulsed light is used as a seed light source. At this time, the pulse duration of the pulsed light is changed in order to change a gray level of the marking pattern to be formed. In this way, a peak power of the pulsed light is changed by changing the pulse duration, so that it is possible to positively change the gray level of the marking pattern without changing the processing speed.

Laser marking method

The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.

Laser processing method, laser processing device and cable harness production method

The present invention relates to a light source apparatus or the like provided with a structure that can block reflected return light also when an emitting end side of an optical isolator is a space. The light source apparatus comprises a light source section, a guide section, and an optical module. The optical module includes a collimator, an optical isolator, and an oblique-beam blocking section. The collimator outputs collimated light with a predetermined beam diameter as a forward propagating beam. The optical isolator is a polarization-independent optical isolator that introduces the collimated light from a first end and outputs this collimated light from a second end. The oblique-beam blocking section includes first and second optical components each having a window of a diameter D, and blocks light incident at a predetermined angle relative to an optical axis of the forward propagating beam out of a backward propagating beam, by separating the first and second optical components from each other by a predetermined distance.

Light source apparatus and optical module included therein

The present invention relates to a laser processing method and the like having a structure for making it possible to process an object to be processed in various ways while accurately adjusting the installation state of the object. The method irradiates the object with plural adjustment laser light beams that are set in a specific positional relationship against a converging point of processing laser light beam, and adjusts the state of installation of the object while monitoring irradiation areas of the adjustment laser light beams on the surface of the object. Each irradiation directions of adjustment laser light beams is different from that of the processing laser light beam. By reflecting the irradiation condition of the adjustment laser light beam and monitored information of the irradiation areas in positional adjustment of the object, the installation state of the object can be adjusted in accordance with various kinds of processing.

Laser processing method and laser processing apparatus

The present invention relates to a laser welding method of welding an electrode and a cable core to each other satisfactory by irradiation of a laser beam, even when the core is thin and the area of the electrode is small. The laser welding method welds on a substrate the electrode and the core of a coaxial cable to each other by irradiation of the laser beam. The core is sandwiched between a pressing member and the electrode, while the electrode and the core are brought into contact with each other at a connection section. The pressing member is a member that is transparent to the processing laser beam. A part of the core is molten by radiating the laser beam from the pressing member side. As a result, the electrode and the core are connected with each other.

Laser welding method

The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.

Laser processing apparatus and laser processing method

The present invention relates to a method and apparatus having a structure that enables laser processing of an object even when the object has a surface formed with irregularities. The laser processing method irradiates objects, each having a cylindrical form extending in a first direction, with laser light. Here, the objects are arranged on a first plane along a second direction orthogonal to the first direction. The arranged objects are irradiated with first and second laser light beams in irradiation directions different from each other to the first plane. At least during when the first and second irradiation light beams are respectively emitted, irradiation positions of the first and second laser light beams to the first plane are relatively moved.

The present invention relates to a method of measuring backward light, which is constructed for checking, prior to laser processing, backward light that propagates backward through an isolator included in a laser processing apparatus. The present invention also relates to a laser processing method and the like. A laser processing apparatus has an optical head provided with a laser light source part, light guide, and isolator. The optical head has an emitting optical system, irradiation optical system, and light collecting optical system. The method of measuring backward light uses a photodetector to detect, from reference light introduced from a measurement light source into the optical head, the power of an optical component that has passed through the isolator, while changing the position of the measurement light source. The laser processing method performs laser processing by using the laser processing apparatus that has the optical head in which the arrangement of optical components is adjusted beforehand on the basis of the result of detection or result of measurement.

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Yokohama, Japan

Kazuo Nakamae