Jsr Corporation

Jsp Corporation

Kazuo Nakahara

Hiromitsu Nakashima

Mitsuo Sato

Masafumi Hori

Takanori Kawakami

Kazuki Kasahara

Yasuhiko Matsuda

Yuusuke Asano

Yoshifumi Oizumi

Reiko Kimura

Mitsuo Satou

Takashi Mori

Tomoki Nagai

Ken Maruyama

Norihiko Ikeda

Hayato Namai

Masayuki Motonari

Yusuke Asano

Kazunori Takanashi

Makoto Sugiura

Yoshio Takimoto

Takanori Nakano

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. Rrepresents an alkali-labile group. A represents an oxygen atom, &#x2014;NR'&#x2014;, &#x2014;CO&#x2014;O&#x2014;or &#x2014;SO&#x2014;O&#x2014;, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R&#x2032; represents a hydrogen atom or an alkali-labile group, and '#' and '##' each indicate a bonding hand bonded to R.-A-R&#x2003;&#x2003;(x).

Radiation-sensitive resin composition, method for forming resist pattern, polymer and polymerizable compound

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. Rrepresents an alkali-labile group. A represents an oxygen atom, &#x2014;NR'&#x2014;, &#x2014;CO&#x2014;O&#x2014;or &#x2014;SO&#x2014;O&#x2014;, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R&#x2032; represents a hydrogen atom or an alkali-labile group, and '#' and '##' each indicate a bonding hand bonded to R. 

A photoresist composition containing a polymer having a structural unit including an acid-labile group, and a compound represented by the formula (1). In the formula (1), Rrepresents a hydrogen atom or a monovalent acid-labile group. Rrepresents an alicyclic hydrocarbon group having 3 to 20 carbon atoms and a valency of (m+1). m is an integer of 2 to 5. Rand Reach independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms or a monovalent fluorinated hydrocarbon group having 1 to 20 carbon atoms. n is an integer of 0 to 5. At least two of a plurality of Rs optionally taken together represent a ring structure, together with a plurality of oxygen atoms bonding to Rand the carbon atom(s) constituting Rand bonding to these oxygen atoms. Mrepresents a monovalent radiation-degradable onium cation. 

Photoresist composition, resist pattern-forming method, compound, acid generating agent, and photodegradable base

A radiation-sensitive resin composition includes a compound represented by a formula (1), and a polymer that includes a structural unit having an acid-labile group. Rand Reach independently represent a hydrogen atom, or the like. Rand Reach independently represent a hydrogen atom or the like. Xand Xeach independently represent a hydrogen atom, or the like, or Xand Xtaken together represent &#x2014;S&#x2014;, &#x2014;O&#x2014;, &#x2014;SO&#x2014;, or the like. A represents an ethanediyl group, wherein at least one hydrogen atom included in X, Xand A is substituted by &#x2014;Y&#x2014;SOM. Y represents an alkanediyl group having 1 to 10 carbon atoms, or the like. Mrepresents a monovalent onium cation. In the case where &#x2014;Y&#x2014;SOMis present in a plurality of number, a plurality of Ys are each identical or different and a plurality of Ms are each identical or different. 

Radiation-sensitive resin composition and compound

A multilayer resist process pattern-forming method includes providing an inorganic film over a substrate. A protective film is provided on the inorganic film. A resist pattern is provided on the protective film. A pattern is provided on the substrate by etching that utilizes the resist pattern as a mask. A multilayer resist process inorganic film-forming composition includes a compound, an organic solvent, and a crosslinking accelerator. The compound includes a metal compound that includes a hydrolyzable group, a hydrolysate of a metal compound that includes a hydrolyzable group, a hydrolysis-condensation product of a metal compound that includes a hydrolyzable group, or a combination thereof. The compound includes at least one metal element belonging to Group 6, Group 12, or Group 13 of the Periodic Table of the Elements.

Multilayer resist process pattern-forming method and multilayer resist process inorganic film-forming composition

The radiation-sensitive resin composition includes a compound represented by a following formula (1), and a resin. The resin has an acid-dissociable group, is insoluble or hardly soluble in an alkali, and turns to be soluble in an alkali when the acid-dissociable group is dissociated. R represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, Rrepresents a hydrocarbon group having 1 to 20 carbon atoms or the like, Rto Reach independently represent an alkyl group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 to 20 carbon atoms, or the like, and Rrepresents a halogen atom or the like. 

Radiation-sensitive resin composition

A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. Rrepresents an alkali-labile group. A represents an oxygen atom, &#x2014;NR'&#x2014;, &#x2014;CO&#x2014;O&#x2014;or &#x2014;SO&#x2014;O&#x2014;, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R&#x2032; represents a hydrogen atom or an alkali-labile group, and '#' and '##' indicates a bonding hand bonded to R.-A-R&#x2003;&#x2003;(x)

A radiation-sensitive resin composition includes a compound, a resin and a radiation-sensitive acid generator. The compound has a structure in which a group represented by a following formula (1) is bound to a nitrogen atom. The resin has an acid-dissociative dissolution-controlling group and has a property such that alkali solubility of the resin increases by an action of an acid. In the formula (1), Y is a monovalent group having 5 to 20 carbon atoms, and '*' represents a bonding hand with the nitrogen atom. In the formula (i), R, Rand Reach independently represent a linear or branched alkyl group having 1 to 4 carbon atoms or a monovalent alicyclic hydrocarbon group having 4 to 12 carbon atoms, or Rand Rare linked with each other to form a bivalent alicyclic hydrocarbon group, and '*' represents a bonding hand with the oxygen atom. 

A resist lower layer film-forming composition includes (A) a polymer that includes a cyclic carbonate structure. The polymer (A) includes a structural unit (I) shown by the following formula (1). 

Resist lower layer film-forming composition, polymer, resist lower layer film, pattern-forming method, and method of producing semiconductor device

A radiation-sensitive resin composition includes (A) a polymer that includes a structural unit (I) including a group shown by the following formula (i), (B) a photoacid generator, and (C) a polymer that has a fluorine atom content lower than that of the polymer (A), and includes an acid-labile group. The polymer (A) preferably includes a structural unit shown by the following formula (1) as the structural unit (I). It is preferable that X in the formula (1) represent a divalent or trivalent chain-like hydrocarbon group or alicyclic hydrocarbon group. 

Radiation-sensitive resin composition, method for forming resist pattern and polymer

A radiation-sensitive resin composition includes a polymer having a structural unit represented by a formula (I). In the formula (I), Rrepresents a hydrogen atom or a methyl group. X represents a bivalent alicyclic hydrocarbon group not having or having a substituent. Y represents a bivalent hydrocarbon group having 1 to 20 carbon atoms. Rrepresents a methyl group or a trifluoromethyl group. 

Radiation-sensitive resin composition, polymer and compound

A radiation-sensitive resin composition including (A) a polymer that includes a repeating unit (a1) and a fluorine atom, and (B) a photoacid generator, the repeating unit (a1) including a group shown by any of the following formulas (1-1) to (1-3). 

A radiation-sensitive resin composition includes a compound shown by a formula (1) in which Rrepresents a divalent hydrocarbon group having 1 to 20 carbon atoms and Rrepresents a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms, or Rand Rform a heterocyclic structure having 4 to 20 carbon atoms, Rrepresents a monovalent acid-dissociable group, n is an integer from 1 to 6, each of R, R, and Rrepresents one of an alkyl group having 1 to 4 carbon atoms and a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms, or Rrepresents one of an alkyl group having 1 to 4 carbon atoms and a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms and Rand Rform a divalent alicyclic hydrocarbon group having 4 to 20 carbon atoms. 

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Tokyo, Japan

Kazuo Nakahara