Mitsubishi Denki Kabushiki Kaisha

Kazuo Kuramoto

Naohiko Fujino

Kazuhiko Tsutsumi

Junji Kobayashi

Motohisa Taguchi

Yukari Toide

Masaru Tsuchihashi

Koichi A Ono

Akihiko Furukawa

Masahiro Sekine

Tomohiro Sasagawa

Hiroshi Kurokawa

Tsuyoshi Horikawa

Akihiro Suzuki

Takaaki Kawahara

Toshiyuki Oishi

Taisuke Furukawa

Nobuyoshi Hattori

Masashi Ohmori

Noboru Mikami

Hitoshi Wakata

Kenyu Haruta

Kenichi Kuroda

Mutsumi Tsuda

Hideki Yabe

Junji Tanimura

Isamu Karino

Osamu Wada

Tetsuya Takami

Kazuyoshi Kojima

Yukihiko Wada

Kouji Kise

Yoshio Saito

Noriko Hirano

Jiro Naka

Akimasa Yuki

Tetsuo Makita

Hiroshi Kuroki

Tetsuo Ogama

Yasuji Matsui

Fusami Soeda

Yoshitsugu Nakagawa

Koichiro Hori

Keisuke Nanba

A method for recovering impurities on a surface of a silicon wafer includes a first step of using a pretreatment solution to decompose an oxide film, a nitride film on an oxynitridation film formed at a peripheral portion on a surface of a silicon wafer and to remove impurities on the peripheral portion and a second step of recovering impurities on the surface of the wafer expect for the peripheral portion.

Apparatus for recovering impurities from a silicon wafer

A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

Thin film forming apparatus using laser

An optical disc comprises two facing disc units, at least one of which has a recording layer formed on its surface facing to the other disc unit. The disc units are bonded together by a layer of adhesive which may be a room-temperature curing thermosetting adhesive having a glass transition temperature higher than the upper limit of the range of temperatures of environments in which the disc may be used. Alternatively, the adhesive may be a room-temperature curing two-pack epoxy adhesive which comprises a bisphenol epoxy resin base agent and a modified aliphatic polyamine curing agent, and which has a viscosity of 100-1000 cps, a pot life of one hour or more, a cure shrinkage of 1.0% or less, a water absorption, after curing, of 0.2% or less, and a Shore hardness, after curing, of 80-90.

Optical disc

Method for detecting and examining a slightly irregular surface state is provided which includes the steps of: illuminating a surface of a sample with light beam for detecting the slightly irregular surface state; observing a variation of the light beam occurring due to the slightly irregular surface state to specify the location of the slightly irregular surface state in an x-y plane of the sample; making the location of a probe needle of a scanning probe microscope and the location of the slightly irregular surface state on the sample coincide with each other; and measuring a three-dimensional image of the slightly irregular surface state by means of the scanning probe microscope. The scanning probe microscope for use in the aforementioned method and a method for fabricating a semiconductor device or a liquid crystal display device which utilizes the aforementioned method are also provided.

Method for detecting and examining slightly irregular surface states,

Optical disc and method and apparatus for making same

Growing community of inventors

Amagasaki, Japan

Kazuo Kuramoto