Toppan Printing Co., Ltd.

Renesas Electronics Corporation

Kazuo Kudo

Takashi Abe

Takashi Mizutani

Toru Ueguri

Hideaki Tamimoto

Keiji Kazato

Takumi Soba

The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do bonding of the Al ribbon to the source pad of the silicon chip, and the source post of the lead frame, first, the first branch and second branch of the wedge tool are contacted by pressure to Al ribbon on the source pad, and supersonic vibration is applied to it. Subsequently, the first branch is contacted by pressure to Al ribbon on the source post, and supersonic vibration is applied to it. Here, since the width of the first branch is narrower than the width of the source post, Al ribbon is not joined at the end surface of the width direction of the source post.

Semiconductor device and manufacturing method of the same

A hollow bottle and the production method therefor. The hollow bottle of the invention is of multi-layer structure and has excellent chemical resistance and large fused adhesion strength in the pinch-off portion of the bottom. The inner layer of the bottle is made of polyamide resin and the depth of the joint groove formed in the inside surface of the inner layer in the pinch-off portion is 20% in depth as compared with the length of the pich-off portion, which portion is in a cross-sectionally tapered-off projection formed on the bottom of the bottle. In the production method of the present invention, after the multi-layer parison is extruded from dies, the lowermost end of the parison is closed and an inert gas is then blown into the parison, or the bottom of the parison is closed with blowing the inert gas. After the bottom of the parison is closed, it is transferred into a blow mold and blow molding is carried out, thereby forming a hollow bottle of the present invention.

Hollow bottle and production method therefor

A multilayer parison extrusion molding machine for blow molding which is characterized in that a main extruder and one or more sub-extruders are radially attached to special diehead and said die head comprises a core holder having a core pin at the lower end; a cylindrical mandrel enclosing said core holder; a plurality of sleeves surrounding said mandrel; housings surrounding said sleeves respectively; one or more pressure rings controlling the space in molten resin passages; pressure ring adjusting screws; an extrusion die; and a die adjusting screw.

Multilayer parison extrusion molding machine for blow molding

Growing community of inventors

Tokyo, Japan

Kazuo Kudo