Shin-etsu Handotai Co., Ltd.

Kazuo Kubota

Yasuaki Nakazato

Hisakazu Takano

Kenkichi Kitajima

In a lapping apparatus including upper and lower lapping turn tables, and disc-shaped workpiece holding fittings which are held rotatably between the upper and lower lapping turn tables and defines a plurality of receiving holes in which flat workpieces are located in the receiving holes, respectively, and the flat workpieces are lapped while the workpieces are moved together with the workpiece holding fittings relative to the upper and lower lapping turn tables, the thickness of the workpiece holding fittings is set to be thinner than a finished thickness of the workpieces with a difference between the thickness of the workpiece holding fittings and the finished thickness of the workpieces being 70 .mu.m or more.

Lapping method using upper and lower lapping turntables

A lapping apparatus and a method for effectively utilizing a regenerated abrasive fluid in the lapping process of works such as semiconductor wafers or quartz wafers without causing any damage such as scratches to the works. A work lapping method using a regenerated abrasive fluid prepared from a used abrasive fluid and a new abrasive fluid, which comprises the steps of preliminarily lapping a work using the regenerated abrasive fluid to a predetermined stock removal of the work, and finally lapping the preliminarily lapped work using the new abrasive fluid.

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Nagano, Japan

Kazuo Kubota