Ngk Spark Plug Company, Limited

Howa Plastics Co., Ltd.

Nkg Spark Plug Co., Ltd.

Ngb Spark Plug Co., Ltd.

Kasei Kogyo, Co., Ltd.

Kazuo Kondo

Asao Morikawa

Akio Takami

Masahiko Okuyama

Kazunori Miura

Tatsunori Kurachi

Tsuneyuki Sukegawa

Hidetoshi Mizutani

Masateru Hattori

Yoshimasa Shibata

Shigeo Niwa

Hiroshi Iwata

Hisaharu Shiromizu

Masakazu Watanabe

Satoshi Iio

Kazuya Kato

Takashi Okamura

Kazutoshi Tanaka

Katsutoshi Bekki

Shinji Nishio

Hiroyuki Oe

Naoyuki Okamoto

Katsutoshi Betsuki

Kazuto Tsuge

Embodiments provide a helical layer structure including: a helical core member which is formed of a flexible, lengthy, flat plate-like core member and which is formed of a steel plate made of a metal material, such as iron; and a polymeric coating layer which is formed of a polymeric material such as a thermosetting elastic material or a thermoplastic elastic material, and which coats the helical core member. The manufacturing method of the helical layer structure includes: a feeding step of feeding a core member having flexibility; a supply step of supplying the polymeric material having fluidity; a coating step of coating the core member with the polymeric material; a cooling step of cooling a coated intermediate which is coated with the polymeric material; and a helix formation step of helically twisting the coated intermediate to form the helical layer structure.

Helical layer structure and manufacturing method of helical layer structure

A multilayered substrate is disclosed comprising a first layer of relatively dense crystalline glass, and a second layer of a porous crystalline glass characterized by a relatively low dielectric constant bonded to the first layer. The crystalline glass in both layers is of substantially the same composition.

Multilayered glass substrate

The invention provides a glass-ceramic composite with sufficient strength and other excellent properties suitable for IC packages or multilayer substrates. The glass-ceramic composite of the invention includes crystallized glass and at least either of alumina and mullite at the ratio by weight of eighty through fifty-five to twenty through forty-five. The crystallized glass includes cordierite as primary crystals and contains 40 to 52 percent by weight of silicon dioxide or SiO.sub.2, 27 to 37 percent by weight of aluminum oxide or Al.sub.2 O.sub.3, 11 to 13 percent by weight of magnesium oxide or MgO, 2 to 8 percent by weight of diboron trioxides or B.sub.2 O.sub.3, 2 to 8 percent by weight of calcium oxide or CaO, and 0.1 to 3 percent by weight of zirconium oxide or ZrO.sub.2.

Glass-ceramic composite

A method of forming a substrate for electronic devices by forming a mixture of a liquid vehicle, crystalline glass powder and carbon powder into a slurry. The slurry is then formed into a desired shape and heated in an oxidizing atmosphere at a temperature less than 900.degree. C. for a time sufficient to oxidize the carbon powder and partially sinter the crystalline glass to form the porous substrate having closed porosity.

Process of making a coated substrate having closed porosity

A ceramic substrate is described consisting essentially of a crystallized glass and having at least one throught-hole filled with a conductor material having 100 parts by weight of copper and form 1 to 30 parts by weight of a glass having a softening point of 1,000.degree. C. or less and a thermal expansion coefficient of from 1.5.times.10.sup.-6 /K to 4.0.times.10.sup.-6 /K as measured in a temperature range of from room temperature to 400.degree. C.

Ceramic substrate

A high heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region has a substrate having high heat conductivity. An oxidized layer is formed on a surface of the substrate. Electrically conductive layers formed of a printed paste containing crystallized glass, and insulating layers formed of a printed insulating paste containing crystallized glass as a principal constituent are alternately disposed by printing on the oxidized layer of the substrate. The conductive and insulating layers are heated to form solid layers between successive printing steps. The substrate is AlN, Sic/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductivity of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulting layer has a low dielectric constant.

Process for making a high heat-conductive, thick film multi-layered

A process for producing a ceramic sintered body having a metallized via hole previously formed after lamination of the ceramics is disclosed and said process comprises immersing in a first liquid a ceramic semi-sintered body formed through heating at 500 to 900.degree. C. and having a large number of pores and a straight via hole, thereby to allow the first liquid to penetrate into the pores of the semi-sintered body, subsequently immersing the resulting semi-sintered body in a suspension of electrically conductive powder particles having an average particle size of 2 to 3 .mu.m in a second liquid incompatible with the first liquid, thereby to fill the via hole with the suspension, and then sintering the resulting semi-sintered body in a non-oxidizing atmosphere.

Process for producing ceramic sintered body having metallized via hole

A composition for metalizing low temperature-fired ceramics according to the invention includes: a combination of two or three oxides selected from the group consisting of 1 to 8 percent by weight of bismuth(III) oxide (Bi.sub.2 O.sub.3), 0.1 to 5 percent by weight of MoO.sub.3, and 0.1 to 2 percent by weight of Cr.sub.2 O.sub.3 as well as a primary constituent, that is, mixture of copper (Cu) and copper(II) oxide (CuO) or mixture of copper(II) oxide (CuO) and copper(I) oxide (Cu.sub.2 O). The additives of the invention efficiently keep the resultant metalized layer out of cracks and prevent local sintering and burr of the metalized layer.

Composition for metalizing ceramics

A substrate having a low dielectric constant for use with electronic devices consisting essentially of porous crystalline glass. The composition of the crystalline glass is represented by the formula X-Al.sub.2 O.sub.3 -SiO.sub.2, where X is one or more of the metal oxides ZnO, MgO, Li.sub.2 O, ZrO.sub.2, B.sub.2 O.sub.3, P.sub.2 O.sub.5, Y.sub.2 O.sub.3 and BaO. The crystalline glass may also include a filler material such as a ceramic powder or non-glass material. The substrate initially has a particle size of approximately 5 microns or less, which provides a high mechanical strength to the substrate even at high porosities.

Low-temperature baked substrate

High heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region, the circuit board comprising: a substrate having high heat conductivity; an oxidized layer formed on a surface of said substrate; an electrically conductive layer formed of a printed paste containing therein crystallized glass; and an insulating layer formed of a printed insulating paste comprised of crystallized glass as a principal constitutent, wherein at least one of said conductive layer and at least one of said insulating layer are alternately disposed by printing on the oxidized layer of said substrate, and said conductive and insulating layers have been heated to form solid layers. The substrate is AlN, SiC/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductively of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulating layer has a low dielectric constant.

High heat-conductive, thick film multi-layered circuit board

A metallizing composition for use with ceramics which comprises 100 parts by weight of a CuO-Cu combination consisting of 30 to 70 wt % CuO and 70 to 30 wt % Cu, at least one inorganic component selected from the group consisting of not more than 10 parts by weight of MnO.sub.2, not more than 7 parts by weight of Pt and not more than 5 parts by weight of Au, an organic binder, and a solvent.

Metallizing composition for use with ceramics

A method of preparing colored crystallized glass is disclosed, comprising the steps of:

Method of producing colored crystallized glass

An artificial radix dentis comprises a prong portion buried in an alveolar bone, which is made of a SiC-based ceramic material or is covered with a SiC-based film.

SiC based artificial dental implant

A crystallized glass tooth crown is described, consisting essentially of from 40 to 75 mol % component X, from 20 to 55 mol % component Y and from 0.1 to 10 mol % component Z, wherein

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Aichi, Japan

Kazuo Kondo