Murata Manufacturing Co., Ltd.

Kazuo Kishida

Hiroshi Takagi

Takahiro Takada

Mitsuyoshi Nishide

Hiromichi Kawakami

Hirofumi Sunahara

Yuichi Iida

Yuki Takemori

Akira Shiratori

Osamu Yokokura

Takahiro Oka

Masaaki Hanao

Yoshitake Yamagami

Yusuke Otsuka

Yasutaka Sugimoto

Takahiro Sumi

Tsuyoshi Katsube

Seiji Fujita

Hiromitsu Hongo

Hiroaki Yamada

Yusuke Otuka

A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1&#x3e;X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Multilayer ceramic substrate

A ceramic multilayer substrate that includes a ceramic insulator layer, which includes a first layer, a second layer, and a third layer and in which the first layer is interposed between the second layer and the third layer, an inner pattern conductor, an outer pattern conductor, and outer electrodes. The ceramic insulator layer is interposed between the inner pattern conductor and the outer pattern conductor. The sintering shrinkage start temperatures of the second layer alone and the third layer alone in a green sheet state are higher than or equal to the sintering shrinkage stop temperature of the first layer alone in a green sheet state. The thickness of the ceramic insulator layer is 5.0 &#x3bc;m to 55.7 &#x3bc;m. The ratio of the total of the thickness of the second layer and the thickness of the third layer to the thickness of the first layer is 0.25 to 1.11.

Ceramic multilayer substrate

A ceramic circuit board that includes a ceramic insulator layer, grounding pattern conductors, connection lands disposed on a first surface of the ceramic circuit board, and grounding electrodes disposed on a second surface of the ceramic circuit board and connected to the grounding pattern conductors. Each of the grounding pattern conductors contains a metal and an oxide and includes a pattern main portion disposed inside the ceramic circuit board and an extended portion in which a first end thereof is connected to the pattern main portion and a second end thereof is exposed at a side surface of the ceramic circuit board. The metal content of the extended portion is lower than the metal content of the pattern main portion.

Ceramic circuit board, electronic circuit module, and method for manufacturing electronic circuit module

A composition for ceramic substrates that includes a mixture of borosilicate glass powder and ceramic powder. The borosilicate glass powder contains 4% to 8% by weight BO, 38% to 44% by weight SiO, 3% to 10% by weight AlO, and 40% to 48% by weight MO, where MO is at least one selected from CaO, MgO, and BaO. The mixing proportions of the borosilicate glass powder and the ceramic powder are 50% to 56% by weight the borosilicate glass powder and 50% to 44% by weight the ceramic powder. The ceramic powder has an average particle diameter D50 of 0.4 to 1.5 &#x3bc;m.

Composition for ceramic substrates and ceramic circuit component

A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.

Multilayer ceramic substrate and method for producing the same

A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the first ceramic green layer of the composite sheet by an ink jet method. Subsequently, a plurality of second ceramic green layers are stacked with the composite sheet such that the shrinkage-retardant layer of the composite sheet defines an outermost layer, thus forming a multilayer composite including an unfired multilayer ceramic substrate and the shrinkage-retardant layer. Then, the multilayer composite is fired, and the shrinkage-retardant layer is removed to obtain a sintered multilayer ceramic substrate.

Method for manufacturing multilayer ceramic substrate and composite sheet

In a method for producing a multilayer ceramic substrate by a non-shrinkage process, even when a total area of surface electrodes on a first principal surface side is smaller than that on a second principal surface side, a favorable balance in terms of a time period from softening to crystallization of glass is achieved between the first principal surface side and the second principal surface side, thereby allowing all base material layers to be densified and prevented from causing cracks or warpage, even when the crystallization temperature is lowered to prevent production of a reaction layer. The crystallization temperature of a glass material included in a second base material layer defining a second principal surface with a larger total area of surface electrodes is less than that of a glass material included in a first base material layer defining a first principal surface.

Method for producing multilayer ceramic substrate

A shrinkage suppression layer used in the production of a ceramic substrate according to a non-shrinkage process provides favorable removal performance while sufficiently ensuring the restraining performance of the shrinkage suppression layer. Resin beads, which disappear at a temperature lower than the sintering temperature of a low-temperature sintering ceramic material of a base material layer to form open bores in a shrinkage suppression layer, are added to the shrinkage suppression layer and dispersed uniformly at least in a principal surface direction. The shrinkage suppression layer provides sufficient restraining performance to the base material layer in the step of firing, and after the firing, forms open bores, thereby improving the removal performance of the shrinkage suppression layer.

Process for producing ceramic substrate

Unfired first ceramic layersand at least one unfired second ceramic layerhaving a different color from the unfired first ceramic layersare laminated to prepare an unfired ceramic laminate. Notchesare then formed on a surface of the unfired ceramic laminateusing the second ceramic layeras a reference. The unfired ceramic laminateis fired to provide a fired ceramic laminate, which is then divided along the notchesinto ceramic composites. In this process, notches having the proper depth can be formed on the unfired ceramic laminate

Method of manufacturing ceramic laminated body

There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B O , about 28% to 44% by weight of SiO , 0% to about 20% by weight of Al O , and about 36% to 50% by weight of MO (where MO is at least one selected from the group consisting of CaO, MgO, and BaO), and a powdered ceramic; in which the amount of the powdered borosilicate-based glass is about 40% to 49% by weight based on the total amount of the composition for a ceramic substrate, and the amount of the powdered ceramic is about 60% to 51% by weight based on the total amount of the composition for a ceramic substrate.

Composition for ceramic substrate and ceramic circuit component

A ceramic substrate composition includes about 26 to 48% by weight of a CaO&mdash;Al O &mdash;B O &mdash;SiO type glass, about 35 to 68% by weight of at least one of alumina, mullite, cordierite and forsterite, and about 3 to 24% by weight of quartz, said glass being capable of being crystallized to wollastonite by firing of the composition at a temperature of about 800 to 1000&deg; C. A ceramic circuit component contains a circuit formed on the ceramic substrate obtained by firing the composition.

Ceramic substrate composition and ceramic circuit component

Provided is an electrically conductive paste adapted to be sintered at the same time when a ceramic body is being sintered, wherein said paste has a contraction starting temperature that is higher than the contraction ending temperature of said ceramic body during the sintering treatment. Also provided is an electrically conductive paste comprising an electrically conductive component and an organic vehicle component, wherein said electrically conductive component comprises an electrically conductive powder mainly comprising silver, the particles of said electrically conductive powder being coated with a metal oxide having a melting point higher than that of silver.

Electrically conductive paste ceramic multi-layered substrate

An inorganic composition for low temperature firing comprising about 15 to 40 weight % of glass powder and about 60 to 85 weight % of cordierite, is disclosed. The glass powder is composed of about 20 to 60 weight % of SiO,, about 30 to 50 weight % of B,O,, about 5 to 30 weight % of MgO, 0 to about 15 weight % of Al,O,, and about 1 to 5 weight % of R,O (R is alkali metal). The inorganic composition is capable of being fired at a relative low temperature, and has a low thermal expansion coefficient and permittivity, as well as high mechanical strength.

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Nagaokakyo, Japan

Kazuo Kishida