Sharp Kabushiki Kaisha Corporation

Kazuo Kinoshita

Hiroaki Tsukamoto

Takashi Yasudome

Nobuhito Hirosumi

Katsuitsu Nishida

Yoshikazu Ohara

In order to attain an optical module which can prevent a foreign object from intruding into the optical module, a camera module includes a top surface section having an opening for allowing light to pass through the opening into the optical module; and a glass substrate for sealing the opening, the glass substrate being adhered to the top surface section, the top surface section including a projection section which projects to abut on the glass substrate, the projection section being formed to surround the opening.

Optical module and method for manufacturing optical module

A camera module () is an assembly of a lens holder () and a wiring board (). The lens holder () holds an optical structure () which forms an image of a subject. The wiring board () has formed thereon a solid-state image sensing element () which converts the image of the subject formed by the optical structure () to electrical signals. Grease () is applied to the camera module () in such a manner that the grease is not present in an optical path in the optical structure (). The grease () catches the dust (D) produced during manufacture and while in use, thereby prevented the dust (D) from causing image defects. A solid-state image sensing device is thus provided which is capable of preventing the dust produced during manufacture and while in use from causing image defects.

Solid-state image sensing device capable of preventing dust from attaching to optical path, method for manufacturing same, and electronic device

The solid image capture devicein accordance with the present invention is detachably fixed to a wiring boardand applies pressure to the side faces of a transparent lid sectionin a direction normal to the faces, so as to nip and secure the transparent lid section. The mechanism allows a solid image capture elementto be attached to and detached from the wiring board. The solid image capture elementis readily positioned precisely on the wiring board

Solid image capture device and electronic device incorporating same

A solid-state image pickup apparatusof the present invention includes a transparent cover sectionwhich is provided so as to be spaced from a lens section, the transparent cover sectionbeing provided (i) so as to face a light-receiving section of a solid-state image sensing deviceand (ii) so as to have a gap between the solid-state image sensing deviceand the transparent cover section. Furthermore, the transparent cover sectionis provided with a positioning mark which serves as a reference for positioning the lens section in consideration of the solid-state image sensing device. Consequently, it is possible to provide a shock-resistant solid-state image pickup apparatus in which a lens section and an image pickup section are positionally aligned with high accuracy.

Solid-state image pickup apparatus with positioning mark indicating central part of light-receiving section of solid-state image sensing device and electronic device comprising the same

A camera moduleof the present invention includes a lens unitwhich includes a lensand a lens holderholding the lenstherein, and an image sensing unitwhich includes a solid-state image sensorand a transparent lid sectionwhich is arranged so as to face the receiving surface of the solid-state image sensor, provided with a space S therebetween. The transparent lid sectionand the lensare independent of each other, and the lensis aligned with respect to the solid-state image sensorby engaging the transparent lid sectionwith the lens holderby mounting the lenson the transparent lid section. Thus, it is possible to provide a solid-state image sensing device having high lens alignment precision with respect to a solid-state image sensor.

Solid-state image sensing device and electronic apparatus comprising same

The camera module structure () of the present invention is arranged such that a board electrode () of a printed board () and a mounting electrode () of a camera module () mounted on the printed board () are joined with each other through a solder joint section (), and the board electrode () and the mounting electrode () are aligned by self-alignment. The solder joint section () includes a solder section () for solder-joining, and a supporting section () for supporting the camera module (). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.

Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure

A camera moduleincludes: an optical structurethat forms a subject image and moves up and down along an optical path; a solid-state image pickup elementthat converts, into an electrical signal, a subject image formed by the optical structure; a lens holder, holding the optical structuretherein, which contains the solid-state image pickup element, the optical structurehaving a cushioning memberso provided on a back surface thereof as to absorb the impact of contact between the optical structureand the holding section. The cushioning memberhas a removing section for, when in contact with a contact surfaceof the holding section, removing dust D on the contact surfaceoutward from the contact surface. This makes it possible to provide a small camera modulewhile preventing (reducing) dust from causing an image defect.

Solid-state image pickup device and electronic apparatus including same

A camera moduleincludes a lens unit, which includes a lensand a lens holderholding the lenstherein, and an image sensing unit, which has a solid-state image sensor. A position adjustment of the lensis performed by moving the lensindependently of the lens holder, by use of electromagnetic force. This allows a fine adjustment of a position of the lens, thereby improving the alignment precision of the lens. Thus, a solid-state image sensing device is provided, which can make fine adjustments of focal lengths.

Optical unit, solid-state image sensing device with position adjusting section and electronic apparatus comprising same

A camera moduleincludes a lens unitwhich includes a lensand a lens holderholding the lenstherein, and an image sensing unitwhich includes a solid-state image sensorand a transparent lid sectionwhich is arranged so as to face the receiving surface of the solid-state image sensor, provided with a space S therebetween. The lens holderblocks unnecessary light to the transparent lid sectionby engaging the lens holderwith a whole periphery part of the transparent lid section. Thus, it is possible to provide a solid-state image sensing device, which realizes adequate camera function by blocking unnecessary light to the transparent lid section.

A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.

Optical device module, optical path fixing device, and method for manufacturing optical device module

A camera module of the present invention includes a plurality of projectionson a bottom base of a driving sectionof an AF/Zoom module. The projectionsare radially extended from an apertureformed on an optical path. By this, adhesive can be spread over the projectionswhen bonding a lens holder and the AF/Zoom module together. Furthermore, even if the adhesive is excessively applied, excessive adhesive can be retained between the projections. As a result, it is possible to realize a solid-state imaging device which makes it possible to improve adhesive strength between the lens holder and the AF/Zoom module and easily bond the lens holder and the AF/Zoom module.

Solid-state imaging device and electronic device including same

A lens holder for supporting a lens is put so as to slide on a side surface of a lens barrel in which an image sensor having a light receiving portion is arranged at the bottom, and the lens barrel and the lens holder are connected together by a connecting material. A fluid is filled in a space formed by the container composed of the substrate and the lens barrel, and the lens holder, and then a position of the lens with respect to the light receiving portion is controlled by controlling a volume of the fluid in the space to thereby move a position of the lens holder with respect to the lens barrel. Positioning of the lens is easily performed even when it is a compact configuration.

Fluid operated lens-position controller and imaging module

An optical path delimiter having a lens is disposed so as to be in contact with a transparent lid bonded to a surface of a solid-state image sensor, and is fixed without bonded. Further, the solid-state image sensor to which the transparent lid is bonded, the optical path delimiter disposed so as to be in contact with the transparent lid without bonded, a DSP serving as a signal processor, a circuit part and a wiring board are fixed by being sealed in a synthetic resin. Even when distortion occurs due to warpage, flexure or the like on a board where the solid-state image sensor is disposed, the accuracy of the alignment of the lens with respect to the solid-state image sensor never decreases. In addition, the solid-state image sensor or the signal processor is never damaged by an external shock.

Image sensor module with optical path delimiter and accurate alignment

A screw portion is provided on an image sensing unit, a screw hole portion to be engaged with the screw portion is provided on an optical path delimiter, and the screw portion and the screw hole portion are engaged together to thereby fix the image sensing unit and the optical path delimiter so that a lens barrel of the optical path delimiter is in contact with a transparent lid bonded to a surface of a solid-state image sensor. The solid-state image sensor, the transparent lid, a DSP, a wiring board and the like are sealed by a sealing portion made of a resin. Even when distortion occurs due to warpage, flexure or the like on the board where the solid-state image sensor is disposed, the accuracy of the positioning of the lens with respect to a pixel area of the solid-state image sensor is never decreased, it can be prevented that the solid-state image sensor or a signal processor is damaged by an external shock, and the optical device module is easily fabricated.

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Fukuyama, Japan

Kazuo Kinoshita