Ngk Spark Plug Company, Limited

Kazuo Kimura

Kazuhisa Sato

Hisashi Wakako

Motohiko Itai

Koichi Ishikawa

Masahiro Iba

Haruhiko Murata

Takahiro Shibata

Hideshi Matsubara

Futoshi Sonoda

Tomio Satou

Yukihiro Aoyama

Hajime Saiki

Kozo Yamasaki

Makoto Nagai

Masahito Morita

Rokuro Kanbe

Atsushi Uchida

Hiroyuki Hashimoto

Mitsuo Shiraishi

Masanori Kitou

Yosuke Kondo

A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

Ceramic substrate, ceramic package for housing light emitting element

A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.

Method for fabricating printed-wiring substrate

A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ball.

Printed circuit board

A printed-wiring substrate has main-face-side connection terminals for solder-bonding to connection terminals of an IC chip on a main face A thereof and back-face-side connection terminals for connecting, through mechanical contact, to connection terminals of a motherboard on a back face B thereof. The surface of each of the main-face-side connection terminals is covered with a main-face-side displacement Au plating layer having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals is covered with a back-face-side displacement Au plating layer , which is thicker than the main-face-side displacement Au plating layer and has a thickness of 0.2 &mgr;m or greater.

Printed-wiring substrate and method for fabricating the printed-wiring substrate

In a resinous circuit board having a circuitized substrate having conductive layers therewithin, a plurality of pin pads formed on a rear surface of the substrate, and a plurality of pins, each pin having a tip end portion and a head portion and soldered to the pin pad in such a manner as to contact at the head portion to the pin pad. The head portion of the pin consists of a flange section which is larger in diameter than the tip end portion, and a part-spherical abutment section bulging from the flange section in the direction opposite to the tip end portion and brought into contact with the pin pad. The part-spherical abutment section is made of eutectic silver solder which is lower in melting point than solder such as Sn&mdash;Ag solder which is used for soldering the pin to the pin pad. Since the silver solder and soft solder are present between the flange section and the pin pad, they can release the stress applied to the pin, thus making it possible to increase the joining strength considerably. Further, the above structure can dispense with holes which are formed in the circuitized substrate and in which pins are press-fitted and fixed as in the prior art circuit board.

Resinous circuit board with pins improved in joining strength

A method of making a laminate ceramic substrate with domed pads is provided. In the method, a ceramic green sheet is prepared which has a pair of first and second opposite main surfaces and a plurality of through holes extending between the first and second main surfaces. The ceramic green sheet is placed upon a flat elastic sheet in such a manner that the first main surface of the ceramic green sheet is in contact with the flat elastic sheet. Metallizing ink is filled into the through hole so that a portion of the ink protrudes beyond the first main surface to form domed protruded portions by elastic deformation of the elastic sheet. The green sheet (optionally placed upon at least one other green sheet in such a manner that the second main surface is in contact with the other green sheet) is then sintered, thereby forming the domed, protruded portions of the metallizing ink into domed pads.

Method of making laminate ceramic substrate with domed pads

A ceramic substrate having on the surface thereof a plurality of pads to be attached to terminal members is provided. Each pad includes a metallic layer formed on the surface of the substrate and a connecting layer made of a nickel base alloy and formed on the metallic layer. A gold-nickel layer made of a gold base alloy containing nickel is formed on the connecting layer. The gold-nickel layer may be formed by first forming a gold layer on the connecting layer and then making nickel in the connecting layer to diffuse into the gold layer by heat treatment. A method of producing such a ceramic substrate is also provided.

Ceramic substrate having pads to be attached to terminal members with

A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer for contact with the ceramic lid substrate is formed from a metallized paste containing glass frits so that the metallized layer is baked to adhere to the ceramic lid by reflowed glass frits. A portion of the metallized layer for contact with the solder layer is formed from a metallized paste containing no glass frits so that substantially no void is formed in the solder layer.

Ceramic lid assembly for semiconductor packages

In accordance with the present invention, there is provided a ceramic IC package base which comprises a ceramic substrate, and a heat radiating member adhered to a side surface of the ceramic substrate and made of copper or copper alloy. The heat radiating member has an adhering portion at which it is adhered to the ceramic substrate. The adhering portion, when the heat radiating member is observed in a plan view, has one side which is equal to or larger than 8 mm. The adhering portion is of the thickness within the range from 0.25 mm to 0.76 mm. A ceramic IC package cover is also provided.

Ceramic IC package base and ceramic cover

In a ceramic lid for a semiconductor package, a metallized layer is generally uniform in width and has at least one increased or reduced width portion or a plurality of increased or reduced width portions which are arranged in intervals.

Ceramic package lid having metallized layer with varying widths

An outer lead having a plurality of external leads 1 for electrically connecting the semiconductor IC of a semiconductor IC package to external devices comprises a base plate 11, a plated base structure formed over the surface of the base plate 11 and consisting of a plurality of plated base layers 12, 13 and 14 of Ni or a Ni alloy, and a surface layer 15 of Au or an Au alloy formed over the uppermost plated base layer 14 of the plated base structure. The number of the plated base layers is at least three. Each plated base layer 12, 13 and 14 of the plated base structure is subjected to crystal-growth annealing after being formed by plating to crystal-grow the grains thereof. A method of fabricating such an outer lead is provided.

Outer lead for a semiconductor IC package and a method of fabricating

Outer lead for a semiconductor IC package having individually annealed

Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins in corresponding one of openings formed in a plating jig made of an electrically conductive material for thereby bringing a side surface of each of the lead pins in contact with the jig. The portions of the package are electroplated under the condition where each of the lead pins is held in conduction. After the electroplating, each of the lead pins is separated from the jig through movement in the direction differing from an axial direction of each of the lead pins. Various jigs used for carrying out the above method are also disclosed.

Jig for electroplating lead pins of an integrated circuit package

Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins in corresponding one of openings formed in a plating jig made of an electrically conductive material for thereby bringing a side surface of each of the lead pins in contact with the jig. The portions of the package are electroplated under the condition where each of the lead pins is held in conduction. After the electroplating, each of the lead pins is separated from the jig through movement in the direction differing from an axial direction of each of the lead pins. Various jigs used for carrying out the above method are also disclosed.

Method of electroplating lead pins of integrated circuit package

A metal-ceramics composite material is produced by forming a metal film comprised of three layers on a ceramic substrate, and laminating a metal member thereon, the metal film comprising first layer of Group IV a metal, second layer of Group VIa metal and third layer of Group Ib metal, wherein the first and second layers are formed by gas deposition technique and the Group Ib layer may be formed by gas deposition technique or electrochemical plating. An additional Group VIII metal layer may be interposed between Group VIa layer and Group Ib layer by gas deposition technique.

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Aichi, Japan

Kazuo Kimura