Shincron Co., Ltd.

Polymatech Co., Ltd.

Creansmaerd Co., Ltd.

Kazuo Kikuchi

Shigeharu Matsumoto

Masafumi Yamasaki

Shigetaro Ogura

Qi Tang

Takeshi Sakurai

Shinichiro Saisho

Masanori Shimizu

Yizhou Song

There are provided a point management system and a point management method allowing effective use of points acquired by a customer, etc., and prevention of a waste in points. Therefore, exchange for various points or points having acquired a digital ticket is possible, exchange using foreign currency is possible, and the number of points desired to be traded for each type of currency, and a rate as a standard for exchange of each type of currency to one point are displayed on an exchanging currency selection screen. A standard number of points converted to one US dollar, one European euro, and one Chinese yuan, for example, is displayed, making it easy to understand transaction conditions under succeeding sales transaction status. Moreover, for example, point exchange conditions are displayed as a list and confirmed, thereby allowing specification of one's own exchange conditions, and allowing exchange of points etc. based on specification of accepted exchange conditions.

Point management system and point management method

A method of manufacturing a key top for a push-button switch according to the present invention includes forming a hot-melt adhesive layer on a resin key top so as to have a shape corresponding to a display portion for displaying a letter, symbol, or other indicia, and transferring a metallic thin film layer onto the hot-melt adhesive layer. Therefore, the metallic thin film layer is not damaged due to coating of the hot-melt adhesive layer, and positioning of the display portion is unnecessary. Further, when a transfer resin layer is formed on the metallic thin film layer, oxidation of the metallic thin film layer or damages thereto can be prevented.

Method of manufacturing a key top for a push-button switch

There is disclosed a method and apparatus for forming a thin film of a composite metal compound. Independent targets formed of at least two different metals are sputtered so as to form on a substrate an ultra-thin film of a composite metal or an incompletely-reacted composite metal. The ultra-thin film is irradiated with the electrically neutral, activated species of a reactive gas so as to convert the composite metal or the incompletely-reacted composite metal to a composite metal compound through the reaction of the ultra-thin film with the activated species of the reactive gas. The formation of the ultra-thin film and the conversion to the composite metal compound are sequentially repeated so as to form on the substrate a thin film of the composite metal compound having a desired thickness.

Method for forming a thin film of a composite metal compound and apparatus for carrying out the method

The present invention is drawn to an apparatus for forming a thin film. The apparatus includes a vacuum chamber; a vacuum apparatus connected to the vacuum chamber; a holder placed in the vacuum chamber, which holder holds a substrate and is rotated by means of a rotating mechanism; a plasma CVD apparatus; and a sputtering apparatus, wherein the plasma CVD apparatus and the sputtering apparatus are placed in a single vacuum chamber and a thin film having an medium refractive index is formed on the substrate held by the holder, by means of the plasma CVD apparatus and the sputtering apparatus. The method making use of such an apparatus is also disclosed.

Apparatus and method forming thin film

A method for forming a thin film of a metal compound is disclosed. Within a vacuum chamber, a metallic ultra-thin film of a metal or an incompletely-reacted metal is deposited on a substrate. The metallic ultra-thin film is brought in contact with the electrically neutral activated species of a reactive gas so as to convert the metallic ultra-thin film to an ultra-thin film of a metal compound through the reaction of the metallic ultra-thin film with the activated species of the reactive gas. The above-described steps are sequentially repeated so as to deposit on the substrate the ultra-thin film of the metal compound in layers until a thin film of the metal compound having a desired thickness is formed on the substrate.

Growing community of inventors

Tokyo, Japan

Kazuo Kikuchi