Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Kazuo Kido

Hideki Uchida

Tomoyuki Nakano

Takeshi Kuribayashi

Minoru Kitani

Yoshihiko Misawa

Kazunori Kanai

Seikou Abe

Osamu Okuda

Motohiro Higuchi

Shigeru Matsukawa

Masanori Ikeda

Masahiro Taniguchi

Takashi Yazawa

Tatsuya Sano

Tomotaka Nishimoto

Hiroyuki Kondo

Kenichi Kaida

Koji Odera

Haneo Iwamoto

Keishi Ikeya

Takaki Fukami

Shin-ichiro Endo

Syoujirou Nishihara

Hidetoshi Suenaga

Risa Sakurai

Tetsutaro Hachimura

Kazuyuki Yoshidomi

Koji Hiramoto

A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.

Component supplying apparatus and component supplying method

A component supplying apparatus comprises a tape guide surface facing a lower surface of the carrier tape, a preceding tape contact part climbing onto a upper surface of the preceding carrier tape, and a subsequent tape blocking part configured to wait on the upstream side of the preceding tape contact part in a tape feeding direction while keeping a distance from the tape guide surface so as to enable the carrier tape to pass between the subsequent tape blocking part and the tape guide surface, and to move downwardly toward the preceding carrier tape when the preceding tape contact part is climbed onto the preceding carrier tape. The subsequent tape blocking part keeps the subsequent carrier tape waiting by contacting a front end of the subsequent carrier tape stacked on the preceding carrier tape onto which the preceding tape contact part climbs.

A component supplying apparatus comprises an inclined straight path Pwhich is for the carrier tape and which extends obliquely upward, a horizontal straight path Pwhich is for the carrier tape and which extends in the horizontal direction from a front end of the inclined path Pand runs through the component supply position Q, a first sprocket wheel engaging with the feed holes of the carrier tape within the inclined path P, a guide member locating the carrier tape in the width direction within the horizontal path, a top tape removing device disposed above the inclined path Pbetween the first sprocket wheel and the horizontal path Pand partially removing the top tape from the base tape so as to expose the components, and a sprocket wheel drive device rotating the first sprocket wheel.

A component mounting method of mounting a component onto a board by a component mounting apparatus which includes a transportation device having a plurality of rails capable of transporting a plurality of boards in parallel is provided. The method includes positioning the rails so that a center of a mounting area in a forward-backward direction is at an intermediate position between corresponding parts of two component supply units, the mounting area covering an area in which two mounting heads mount components on one or more of the boards which are transported by the transportation device, and the intermediate position being equally distant in the forward-backward direction from the two component supply units; and alternately mounting the components in the mounting area between the two mounting heads.

Component mounting method and component mounting apparatus

A mounting-line power control device () includes: a target value obtaining unit () which obtains, for each mounting line, a target value for demand power for a first period; a priority obtaining unit () which obtains a first priority level of each mounting line; a target value changing unit () which decreases the target value for the demand power of a second mounting line in the first period when the demand power of a first mounting line in the first period exceeds its target value, the second mounting line having the lower first priority level than the first mounting line; and a power usage changing unit () which reduces power used in the first period by the component-mounted board production apparatus included in the second mounting line, such that the demand power of the second mounting line in the first period does not exceed the decreased target value.

Mounting-line power control device and mounting-line power control method

Provided is a component placement machine including a rail () which extends along an X axis and slidably guides a head () along the X axis; an X beam () which has a bar shape, extends along the X axis, and has one side which is in a direction of a Y axis and on which the rail () is installed; and a Y beam () which extends along the Y axis and slidably guides the X beam () along the Y axis, and further including a reinforcement member () which acts against bending caused by difference in thermal expansion between the rail () and the X beam (), is made of carbon fiber reinforced plastic, and is fastened, with first fasteners at three or more positions arranged along the X axis, to another side of the X beam () in the direction of the Y axis.

Component placement machine

A mounting head is provided with suction nozzles, image capturing cameras, and a movable mirror unit. When the mirror unit is placed at an advance position, mirrors advance into a viewing field of the image capturing cameras and refract an optical axis for image capturing, so that the image capturing cameras can capture images of tips of the suction nozzles and/or held components. When the mirror unit is placed at a retreat position, the mirrors retreat from the viewing field of the image capturing cameras, so that the image capturing cameras can capture images of component supplying positions and mounting positions.

Component mounting device and component mounting method

A suction-and-holding face for a component in a suction nozzle is formed from a semiconductor ceramic so that the suction-and-holding face to be brought into direct contact with the component in suction and holding has the characteristics of a semiconductor. Thus, detrimental effects due to static electricity on the suction nozzle as well as detrimental effects due to electrical conduction between the suction nozzle and the component can be prevented from occurring.

Component mounting head

A board supporting mechanism and a board supporting method eliminating an adjustment of a support height of a support pin upon position-changing of the support pin in accordance with a change in the model of a circuit board, as well as a component mounting apparatus and a component mounting method. A single or a plurality of support pin(s) () have one end(s) and are brought into contact with a bottom face of a circuit board () to support the bottom face of the circuit board () and the other end(s) are brought into contact with a surface of a support table () for raising/lowering the support pin(s) (). Each support pin is held in a direction substantially perpendicular to the surface of the support table (). The one end(s) of the support pin (), held in the direction substantially perpendicular to the surface of the support table (), is brought into contact with the bottom face of the circuit board (), and thereby, the support pins support the circuit board ().

Board supporting mechanism, board supporting method, and component mounting apparatus and component mounting method using the same mechanism and method

An X-Y robot having a structure that linearly deforms along an X-axis direction and a Y-axis direction, a camera reference mark, and a control unit are provided. The X-Y robot causes no displacement of warp or the like and linearly deforms along only the X-axis direction and the Y-axis direction even if heat takes effect due to continuous operation. Therefore, if the amount of expansion and contraction of the X-Y robot due to heat is obtained by picking-up an image of the camera reference mark by a board recognition camera and the component placing position is corrected on the basis of the amount of expansion and contraction, then an electronic component can be mounted in a prescribed position or almost in the prescribed position.

Component mounting method

An origin detection method for a component placement head includes setting an axial origin for each elevation nut section, of the component placement head, by detecting a rotational angle of a drive section corresponding to the elevation nut section. The elevation nut sections are then individually moved down from the axial origin so that light emitted from a light-projecting section is received by a light-receiving section without being interrupted. Then, it is confirmed that the axial origin of each elevation nut section is an origin of elevation by detecting interruption of light, emitted from the light-projecting section, by the elevation nut section at a position corresponding to the elevation nut section having been lowered from the axial origin by a prescribed light interruption dimension.

Origin detection method for component placement head

A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.

Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device

A number of recognition operations for a circuit-formed substrate as a whole is reduced by concurrently recognizing a bad mark and an individual substrate mark in the course of a recognition process of a single or a plurality of individual substrate(s) provided by sectioning the circuit-formed substrate. Results of the recognition of an inclination and dislocation of the circuit-formed substrate are used to control a position of a substrate-recognition camera which recognizes the individual substrate, thereby reducing a rate of occurrence of recognition errors. When a component of recognition marks or the individual substrate mark is captured within a visual field of the substrate-recognition camera, a position of a corresponding one of these recognized marks is specified, and such a mark is again recognized, and thus, the occurrence of a recognition error can be inhibited.

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Kofu, Japan

Kazuo Kido