Nippon Steel Chemical & Material Co., Ltd.

Kukdo Chemical Co., Ltd.

Kazuo Ishihara

Masahiro Soh

Jin Soo Lee

Joong Hwi Jee

Hiroshi Sato

Jae Il Kim

Chan Ho Park

Tsugutoshi Wasano

Jaeman Han

Haerry Youn

Ki Hwan Yu

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, Rrepresents a hydrocarbon group having 1 to 8 carbon atoms, Rrepresents a hydrogen atom, or formula (1a) or formula (1b), and at least one Ris formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

Active ester resin, method for producing thereof, epoxy resin composition, cured product thereof, prepreg, laminated board, and material for circuit substrate

Provided is a resin material showing a high thermal conductivity and having high heat resistance while having a low dielectric constant and a low dielectric loss tangent. The material is a polyfunctional vinyl resin, which is represented by the following general formula (1): where Rs each independently represent a hydrocarbon group having 1 to 8 carbon atoms, Rs each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof represents a dicyclopentenyl group, Xs each independently represent a hydrogen atom or a vinyl group-containing aromatic group represented by the formula (1), and at least one thereof represents a vinyl group-containing aromatic group, 'n' represents a number of repetitions, and the average thereof is a number of from 1 to 5, and Ar represents an aromatic ring.

Polyfunctional vinyl resin and method for producing same, polyfunctional vinyl resin composition, cured article, prepreg, resin sheet, and laminated plate

Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R's each represent a hydrocarbon group having 1 to 10 carbon atoms; R's each represent a hydrogen atom, Formula (1), or Formula (1), where at least one of R's is Formula (1) or Formula (1); and n represents the number of repetitions of 0 to 5.

Phenolic resin, epoxy resin, epoxy resin composition and cured product of same

There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where Rrepresents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Naphthol resin, epoxy resin, epoxy resin composition, and cured products thereof

Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.

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Tokyo, Japan

Kazuo Ishihara