Sumitomo Chemical Company, Limited

Kazuo Hieda

Kuniaki Asai

Teruo Saito

Tadayasu Kobayashi

Masakazu Inoue

Masahito Matsumoto

Nobuhiro Usui

Takahisa Hara

Yoshiharu Tatsukami

Shigeyoshi Matubara

Haruo Hayashida

A molded article of a thermoplastic resin with good apperance which may have a skin material is produced by providing upper and lower molds having a product part-molding section and a non-product part-molding section, supplying a melt of a thermoplastic resin in a cavity of the molds or a space between the skin material and either one of the upper and lower molds through a resin melt passage which is formed in a wall of one of the molds and has an opening for supplying the melt in the non-product part-molding section when a clearance of the cavity is larger than a thickness of a finally produced article, closing the molds to effect press molding, cooling the molds.

Method for producing molded article of thermoplastic resin

The aromatic polysulfone resin composition of the present invention can be produced by mixing 100 parts by weight of an aromatic polysulfone resin and 0.1 to 5 parts by weight of a hydrotalcites and/or a zeolite. Molded articles formed of said composition have a mechanical strength and heat resistance inherent to its constituent resin, and generate low-boiling gases and corrosive gases very little. Therefore, the composition of the present invention is best suited for relay parts.

Aromatic polysulfone resin composition

A process for producing an aromatic polysulfone molding compound improved in mold-release characteristics by adding a predetermined amount of metal soap to aromatic polysulfone resin, wherein pellets composed of an aromatic polysulfone resin and a specific amount of metal soap, and otherwise similar pellets but containing no metal soap are prepared separately by melt-mixing, and these two kinds of pellets are dry-blended together so as to satisfy a predetermined condition.

Process for producing aromatic polysulfone molding compound improved in

A resin composition for printed circuit board comprising:

Resin composition for printed circuit board

An aromatic polysulfone resin composition with excellent plating characteristics comprising:

Aromatic polysulfone resin composition having excellent plating

An aromatic polysulfone resin composition comprising 20 to 80% by weight of an aromatic polysulfone, 10 to 70% by weight of wallastonite and 0.5 to 20% by weight of a fluororesin. The aromatic polysulfone resin composition is superior in heat resistance, strength, stiffness, flame resistance, processability, etc. as engineering plastics.

A polyetherketone resin composition improved in heat stability when melted, which comprises 30 to 95% by weight of polyetherketone and 70 to 5% by weight of potassium titanate fibers which do not contain more than 0.25% by weight of free potassium.

Polyetherketone resin composition

An aromatic polysulfone resin composition comprising from 30% to 95% by weight of an aromatic polysulfone and from 5% to 70% by weight of a potassium titanate fiber having not more than 0.25% by weight of a free potassium content is disclosed. The composition has improved heat resistance, strength, rigidity and, in particular, does not undergo gelation during melting.

A coating resin composition is described, comprising from 50 to 99% by weight of a thermoplastic aromatic polyether ketone resin and from 50 to 1% by weight of a perfluoroalkoxy resin or a tetrafluoroethylene/hexafluoropropylene copolymer resin having hexafluoropropylene content of from 18 to 25% by weight. The composition, when applied to a steel plate, for example, produces a coating film which is greatly improved in water repellency while retaining the desirable properties of the polyether ketone, such as high heat resistance, good mechanical and electrical properties, and high chemical resistance.

Growing community of inventors

Nishinomiya, Japan

Kazuo Hieda