Murata Manufacturing Co., Ltd.

Kazuo Hattori

Isamu Fujimoto

Shinichiro Kuroiwa

Tadateru Yamada

Hirobumi Adachi

Noriyuki Inoue

Hiromasa Saeki

Masaru Takahashi

Masanori Fujidai

Satoru Noda

Choichiro Fujii

Takeo Arakawa

Yasuyuki Sekimoto

Toshiki Tanaka

Kensuke Aoki

Ken Ito

Norio Shiroiwa

A switching module includes mechanical relays, semiconductor switches, voltage detectors to detect an input voltage to a power converter, and a controller. When the controller determines that the waveform of the input voltage is abnormal during a first determination period, the controller outputs an open command signal to mechanical relays corresponding to a power source electrically coupled to the power converter. When the controller subsequently determines that the waveform of the input voltage is normal during a second determination period, the controller outputs a close command signal to the mechanical relays.

Switching module and power supply system

A multilayer ceramic capacitor includes a multilayer body having a rectangular parallelepiped shape. A first external electrode is disposed on at least a first end surface and a first main surface of the multilayer body. A second external electrode is disposed on at least a second end surface and a first main surface of the multilayer body. A first joining member is electrically connected to the first external electrode. A second joining member is electrically connected to the second external electrode. Each of the first joining member and the second joining member includes a plurality of spherical cores.

Chip electronic component, electronic component mounting structure and electronic component assembly

A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

Composite electronic component and resistor

A capacitor having a conductive porous substrate with at least two electrostatic capacitance forming sections, each of the at least two electrostatic capacitance forming sections including a porous portion of the conductive porous substrate, a dielectric layer on the porous portion, and an upper electrode on the dielectric layer. The at least two electrostatic capacitance forming sections are electrically connected in series by the conductive porous substrate.

Capacitor

An electronic component includes a component main body including an embedded internal conductor and an outer electrode. The component main body includes an end surface on which the internal conductor is exposed, and a main surface that is continuous with the end surface and intersects with the end surface. The outer electrode includes an end surface covering portion connected to the internal conductor by covering at least a portion of the internal conductor exposed on the end surface, and a main surface covering portion that covers at least a portion of the main surface. At least a portion of an exposed surface of the main surface covering portion includes a Sn plating layer, and at least a portion of an exposed surface of the end surface covering portion includes a Sn&#x2014;Ni layer.

Electronic component and electronic component series including the same

A mounting structure includes a circuit board including one principal surface on which a multilayer capacitor is mounted. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer. A multilayer capacitor built-in substrate includes a circuit board, a multilayer capacitor on one principal surface of the circuit board, and a resin layer on the one principal surface of the circuit board and embedding the multilayer capacitor. The circuit board includes a first insulating layer, and a second insulating layer having a Young's modulus smaller than that of the first insulating layer. The second insulating layer is closer to the one principal surface than the first insulating layer.

Mounting structure and multilayer capacitor built-in substrate

A multilayer ceramic capacitor includes a stacked body and first and second external electrodes. When a dimension of the stacked body in a length direction is L, a dimension of the stacked body in a width direction is W, a dimension of the stacked body in a stacking direction is T, a dimension of the first outer layer portion in the stacking direction is T, a dimension of the second outer layer portion in the stacking direction is T, a dimension of the first side margin in the width direction is W, a dimension of the second side margin in the width direction is W, a dimension of the first end margin in the length direction is L, and a dimension of the second end margin in the length direction is L, conditions of (L+L)/L&#x3e;(W+W)/Wand (L+L)/L&#x3e;(T+T)/Tare satisfied, and a condition of 0.244&#x2264;(L+L)/L&#x2264;0.348 is satisfied.

Multilayer ceramic capacitor and multilayer-ceramic-capacitor-mounted structure

A composite electronic component includes an electronic element mounted on a resistance element in a height direction. The electronic element includes an electronic element body, and first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on an upper surface of the base portion, and first and second upper surface conductors on the upper surface of the base portion. The first and second upper surface conductors are separated from each other in the length direction, and the resistor is located between the first and second upper surface conductors. A dimension in the height direction of the resistor is smaller than both a dimension in the height direction of the first external electrode of a portion located on a lower surface of the electronic element body, and a dimension in the height direction of the second external electrode of a portion located on a lower surface of the electronic element body.

Composite electronic component and resistance element

A composite electronic component includes a capacitor device and a resistor device stacked together in a height direction. The capacitor device includes a capacitor body and first and second external electrodes. The resistor device includes a base, a resistive element, first and second upper surface conductors, first and second lower surface conductors, a first connection conductor, and a second connection conductor. The upper surface of the base of the resistor device faces the lower surface of the capacitor body of the capacitor device, the first upper surface conductor is electrically connected to the first external electrode, and the second upper surface conductor is electrically connected to the second external electrode.

Composite electronic component and resistor device

An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.

Electronic component containing substrate

A composite electronic component includes an electronic element and a resistance element in a height direction. The electronic element includes an electronic element body, and a first and second external electrodes separated from each other in a length direction. The resistance element includes a base portion, a resistor disposed on the upper surface of the base portion, a protective film, and first to third upper surface conductors. The first and second upper surface conductors are separated from each other in the length direction, and the resistor and the third upper surface conductor connected thereto are located between the first and the second upper surface conductors. Dimensions in the height direction from the upper surface of the base portion to the surfaces of the first and second upper surface conductors are larger than dimension in the height direction from the upper surface of the base portion to the surface of the portion overlapped with the protective film in the height direction of the third upper surface conductor.

A capacitor that includes a porous metal base material, a dielectric layer formed on the porous metal base material, an upper electrode formed on the dielectric layer, a first terminal electrode electrically connected to the porous metal base material, and a second terminal electrode electrically connected to the upper electrode. The porous metal base material includes a high-porosity part and low-porosity parts, and the low-porosity parts are present at a pair of opposed side surfaces of the porous metal base material.

Growing community of inventors

Nagaokakyo, Japan

Kazuo Hattori