Kokusan Denki Co., Ltd.

Kazuo Hara

Shuichi Muramatsu

Hidetoshi Suzuki

Tomoyuki Sato

Hirofumi Yamaguchi

Masaki Asari

Motoki Yamazaki

A resin sealing semiconductor device () having a structure in which a portion to be sealed of components including a plurality of chip mounting board, a semiconductor chip mounted to a front surface of each chip mounting board, and a plurality of leads provided correspondingly to each chip mounting board is embedded in resin molded portions (and) molded into a generally plate shape, and outer lead portions of the plurality of leads (and) are led out in line from a side surface at one end in a width direction of the resin molded portions, and back surfaces as exposed surfaces (toandto) of each chip mounting board are placed on one surfaces of the resin molded portions (and), wherein a plurality of positioning protrusions () are provided on one surfaces of the resin molded portions (and), and a protrusion height of the positioning protrusions is set so that a gap to be filled with insulating resin is formed between each part of the exposed surface of each chip mounting board and a radiator plate when the positioning protrusions () are abutted against the radiator plate.

Resin sealing semiconductor device and electronic device using resin sealing semiconductor device

A semiconductor device having a plurality of semiconductor chips mounted on a lead frame () and required portions covered with seal portions in which: the plurality of semiconductor chips are divided into a first group of semiconductor chips (Dx to Dz) and a second group of semiconductor chips (Du to Dw and Thx to Thz); both groups of semiconductor chips are mounted on the lead frame () at a distance from each other; the seal portions are comprised of first and second resin-seal portions (and) which cover the first and second groups of semiconductor chips, respectively, along with required portions of the lead frame; both resin-seal portions are mechanically coupled with each other by coupling portions; and a group of read terminals respectively connected to circuits within the first resin-seal portion and circuits within the second resin-seal portion are led out through a gap between the first resin-seal portion () and the second resin-seal portion ().

Semiconductor device

Growing community of inventors

Numazu, Japan

Kazuo Hara