Fuji Electric Co., Ltd.

Fuji Electric Device Technology Co., Ltd.

Souriau Japan K.k.

Kazuo Enomoto

Hiroyuki Uwazumi

Yasushi Sakai

Sadayuki Watanabe

Naoki Takizawa

Toyoji Ataka

Shinichiro Adachi

Keiji Ohkubo

Noboru Kurata

Shigeru Ohnuki

A semiconductor apparatus includes a cooler including a bottom plate, a plurality of fins disposed on the bottom plate, and a cover member including a fin cover member and a plate cover member. The fin cover member covers the plurality of fins and has a heat dissipation outer surface. The plate cover member surrounds an outer periphery of the fin cover member, is disposed on the bottom plate, and has a plate cover surface. The apparatus further includes an insulating substrate on the heat dissipation outer surface, a semiconductor element on the insulating substrate, and an insulating member on the plate cover surface, to seal the insulating substrate and the semiconductor element. The plate cover surface is position closer to the bottom plate than is the heat dissipation outer surface with respect to a height direction orthogonal to the bottom plate.

Semiconductor apparatus

A semiconductor module includes a heat dissipating plate; an insulating substrate disposed on an upper surface of the heat dissipating plate; a semiconductor element disposed an upper surface of the insulating substrate; a frame-shaped case bonded to the upper surface of the heat dissipating plate via an adhesive so as to surround peripheries of the insulating substrate and the semiconductor element; and a sealing resin that fills an inner space defined by the frame-shaped case and the heat dissipating plate so as to seal the insulating substrate and the semiconductor element, wherein at an interface between the heat dissipating plate and the frame-shaped case, a recess communicating with the inner space is formed in at least one of the frame-shaped case and the heat dissipating plate, and the sealing resin is filled in the recess.

Semiconductor module and manufacturing method of semiconductor module

A semiconductor device includes an insulated circuit board in which a metal layer is formed on one surface of an insulating board and a semiconductor element having a polygonal shape when viewed in a plan view that is bonded to the metal layer via a bonding material. The metal layer of the insulated circuit board has a recess that exposes the insulating board at a position corresponding to at least one corner of the semiconductor element.

Semiconductor device and method of manufacturing semiconductor device

A connector mounted to a circuit board to be inserted into a storage destination, and configured to include: a connector body including a housing part for housing an electric terminal connected to a predetermined wire of the circuit board, and a base part connected to the housing part; a panel including an opening which is formed in a pair of opposed surfaces and through which the housing part can be inserted; an ejector for detaching the circuit board from an insertion destination by turning; and a connection member connected to a turning shaft part for turning the ejector to fasten the circuit board and the base part of the connector body. The connector can be mounted, together with the ejector, to a compact circuit board corresponding to a compact unit wire rack and can be efficiently mounted in a saved space.

Connector

A perpendicular magnetic recording medium and method thereof, includes a nonmagnetic substrate; a soft magnetic under layer; an intermediate layer; a bilayer magnetic recording layer; a protective layer; and a liquid lubricant layer. According to a following order, the soft magnetic under layer, the intermediate layer, the bilayer magnetic recording layer, the protective layer, and the liquid lubricant layer are sequentially stacked on the nonmagnetic substrate. The bilayer magnetic recording layer includes a first magnetic layer including a CoCr alloy crystalline film, and a second magnetic layer including a rare earth-transition metal alloy noncrystalline film.

Fabrication method for perpendicular magnetic recording media

Perpendicular magnetic recording medium and fabrication method thereof

A magnetic recording medium is provided which includes a non-magnetic base, and a non-magnetic metal base layer, a magnetic layer, and a protective layer, which are laminated in the order of description on the non-magnetic base, wherein the non-magnetic metal base layer is formed from an alloy film in which at least one element selected from the group consisting of W, Ta, Hf, Mo, Cr, Zr and Nb is added to NiAl.

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Nagano, Japan

Kazuo Enomoto