Matsushita Electric Industrial Co., Ltd.

Kazuo Arikado

Teruaki Kasai

Shinji Sasaguri

Tadahiko Sakai

Shinichi Nakazato

Norifumi Eguchi

Kenichi Takakura

An electronic component mounting apparatus removes an electronic component supplied to a part feeder in face-up status and mounts it to a board. A flip-chip supplied from a first holding table is removed and flipped over by a take-out head and then delivered to a mounting head, which mounts the component on the board. A die supplied from a second holding table is picked up directly and mounted to the board by the mounting head. This structure allows a single mounting apparatus to perform both die bonding and flip-chip bonding.

Method of mounting electronic components

A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.

Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls

In a mounting apparatus for mounting conductive ball where a conductive ball,is picked up by vacuum to a suction hole,formed in the bottom of a suction head,for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector,when a suction head,is sucking a conductive ball,rightly in the normal state is compared with a wave form detected at the light detector,when actually mounting the conductive ball; also a reference wave form detected at the light detector,when there is no conductive ball,at all on the suction head,is compared with a wave form detected at the light detector,after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head,and machining errors during processing of suction holes,are eliminated, and the existence, or non-existence, of the conductive ball,is detected at a high accuracy level.

Method of mounting conductive ball

When applying a flux 2 kept in a container 16 onto a conductive ball 1, the flux 2 is first applied by a squeegee unit 17 on a bottom 16a of container 16 in the form of layer having a certain predetermined layer thickness. Then, a suction head 20 holding a solder ball 1 is lowered towards the container 16. As soon as a touch sensor 43 detects a touching of the solder ball 1 to the bottom 16a, the suction head 20 is lifted, and the solder ball 1 held to the suction head 20 is transferred onto a workpiece. Thus a solder ball 1 may be transferred onto a workpiece after being applied with a certain specific amount of flux 2 with precision.

Mounting apparatus for mounting small balls and mounting method thereof

A method of pressure bonding a bumped electronic part using: a tilting mechanism which tiltably supports a suction tool for sucking a bumped electronic part; and locking means for inhibiting a tilting operation of the tilting mechanism. The method includes: a suction step of sucking the bumped electronic part to the suction tool; a step of detecting the position of the bumped electronic part which is sucked to the suction tool, and positioning the bumped electronic part with respect to a substrate, under a state where the tilting operation is inhibited; and a pressure bonding step of pressure bonding bumps of the bumped electronic part which is sucked to the suction tool, to the substrate under a state where the tilting operation is enabled. According to this arrangement, the tilting mechanism is not accidentally swung during the positioning operation, and hence the mounting accuracy is prevented from being impaired.

Method of pressure bonding a bumped electronic part and an apparatus for

An apparatus for bonding such as wire bonding or inner lead bonding comprises a holding unit for holding an object to be bonded, a supporting unit for mounting thereto the holding unit, a driving unit for moving upwardly and downwardly the supporting unit, and a drive control circuit for controlling the driving unit in accordance with stored information about operations of the supporting member. The bonding apparatus includes a control unit for changing a gain characteristic of the drive control circuit from a high gain characteristic to a low gain characteristic while the holding unit is caused to descend before this holding unit is contacted onto a bonding surface.

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Fukuoka, Japan

Kazuo Arikado