Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Electric Co., Ltd.

Kazunori Omoya

Mitsuru Harada

Koji Hashimoto

Toshiharu Fukui

Masato Hashimoto

Akio Fukuoka

Takashi Oobayashi

Yoshihiro Bessho

Takeshi Suzuki

Norio Miyatake

Tomoki Masuda

Tatsuo Ogawa

Akira Nakanishi

Kazuhiko Fujikawa

Kiyoshi Uchida

Wataru Sakurai

Hideaki Nishida

Fuminori Umemura

Takashi Obayashi

Takuya Yagasaki

An optically transparent touch panel includes an upper substrate provided with an upper conductive layer formed on a lower surface thereof, and a lower substrate provided with a lower conductive layer formed on an upper surface thereof in a manner to confront the upper conductive layer with a predetermined space. The upper and lower substrates are bonded together with a spacer having a modulus of elasticity between 10and 10Pa. The touch panel has a long usable life with the capability of downsizing the whole body, while maintaining a required effective operating area.

Transparent touch panel and a method of manufacturing the same

In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

Chip-type electronic component and chip resistor

A TTP comprising two substrates each provided with a transparent resistive-layer, and an insulating section formed on at least one of the transparent resistive-layers using an ultra violet curing resin or an electron beam curing resin. The glass transition temperature of the cured resin in the insulating section is not higher than 80&deg; C., and the insulating section contains a methyl ethyl keton soluble component of not less than 5 weight % and not more than 80 weight %. Since the insulating section is cured at a low temperature, it may be formed on a plastic substrate whose heat-withstanding capability is low. The insulating section can be formed in any desired shape and it can be cured within a short curing time, which are quite advantageous properties for the production of TTPs in volume. The insulating section spreads only minimally during the curing operation, therefore the initial shape, if it is a fine pattern, can be well preserved. Since an acid, alkaline solution or organic solvent is not used for forming the insulating section in the present invention, TTPs thus manufactured are free from the safety problems on the production floor as well as the environmental hazards associated with the use of these chemicals. The same applies also to an electronic system that incorporates the TTP.

Transparent touch panel and electronic equipment using the same

A paste for via-hole filling is provided, and the paste comprises at least (a) 30-70 volume % of conductive particles whose average diameter ranges from 0.5 to 20 .mu.m and whose specific surface area ranges from 0.05 to 1.5 m.sup.2 /g, and (b) 70-30 volume % of resin comprising at least 10 weight % of epoxy resin comprising at least one epoxy group per molecule, in which the total amount of a hydroxyl group, an amino group and a carboxyl group is not more than 5 mol % of the epoxy group, and the epoxy equivalent ranges from 100 to 350 g/eq. The conductive paste for filling via-holes and a printed circuit board comprising thereof can be used to provide an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener and a dispersant if necessary. The paste having low viscosity and low volatility is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foils on both sides to attain a printed circuit board where both sides are electrically connected by inner-via-hole.

Conductive paste for filling via-hole, double-sided and multilayer

This invention aims to offer a transparent touch panel that functions with a soft touching pressure by a pen or a finger, at the same time assures a long operating life. The transparent touch panel comprises a base plate having a transparent electro conductive layer, a top plate having a transparent electro concuctive layer, and a plurality of dot spacers located in between the base plate and the top plate. By a touch pressure given from the outer surface of the top plate, the transparent electro conductive layer placed in the top plate touches to the transparent electro conductive layer placed in the base plate, and the place touched is detected. What this touch panel specifically features is that it comprises dot spacers made of a composite resin containing a flexible modified epoxy resin. Hardness of the dot spacer is preferably not more than 95 according to JIS-K6301-A.

Transparent touch panel

An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa.multidot.s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

Semiconductor unit package, semiconductor unit packaging method, and

In a magneto-optic disk, a protective coating is applied to the magnetic recording layer made from a composite comprising minute particles of an inorganic compound, a lubricant and a radical-polymerizable resin. The surfaces of the minute particles of the first type are coated with a surface coating agent which has a lyophilic property with the radical-polymerized resin and this surface coating prevents the minute particles from forming aggregates in the protective coating. Then, the surface of the protective coating becomes smooth. In another type of protective coating, two types of the minute particles are included. The surfaces of the minute particles of the first type are coated with a surface coating agent, while those of the second type remain not coated. Thus, the minute particles of the first kind are not liable to form aggregates in the protective coating, whereas those of the other kind may form aggregates. Although the aggregates decrease the smoothness of the protective coating, they can enhance the amount of the lubricant which can be incorporated in the coating.

Magneto-optic disk

Growing community of inventors

Osaka, Japan

Kazunori Omoya