Dexerials Corporation

Sony Chemical & Information Device Corporation

Kazunori Hamazaki

Yasuhiro Suga

Takashi Matsumura

Daisuke Sato

Hiroyuki Nakamura

Tomohisa Kawai

Provided is a reel member and an adhesive film winding body capable of suppressing sticking and blocking and preventing falling off. A real member includes: a winding corearound which an adhesive filmis to be wound; a pair of reel flangesprovided on both sides of the winding core; and a plurality of ribsformed on an inner surfaceof the reel flange, protruding from the inner surface, and extending from the center side to the peripheral edge side of the reel flange, wherein in the rib, a rib top width Win contact with the adhesive filmis narrower than a rib base width Win contact with the inner surfacein cross-sectional view.

Reel member and adhesive film winding body

An adhesive tape structure can suppress protrusion of adhesive agent and blocking. The adhesive tape structure includes adhesive tapes each provided with a base film, an adhesive film, and a cover film laminated in this order, and a linking tape linking the adhesive tapes and configured such that the cover films of the adhesive tapes are integrally released. The adhesive tapes each have a part having a predetermined length completely removed from an edge portion of the adhesive film on a release initiation side in a cover film release direction; the adhesive tape thus has gaps in the edge portions of the adhesive films.

Adhesive tape structure

A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8&#xd7;10to 1&#xd7;10Pa&#xb7;s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film

A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2&#xd7;10to 1&#xd7;10Pa&#xb7;s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.

Method of manufacturing semiconductor device

An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 &#x3bc;m is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0&#xd7;10Pa&#xb7;s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 &#x3bc;m is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Method and apparatus for mounting electric component

An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a non-conductive adhesive agent having a low minimum melt viscosity and having no conductive particle where a thin electronic component having a thickness smaller than or equal to 200 &#x3bc;m is mounted on a wiring board. In the mounting apparatus, a non-conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0&#xd7;10Pa&#xb7;s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 &#x3bc;m is placed on the non-conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a film thickness 0.5 to 2 times the thickness of the semiconductor chip. The sealing resin film is arranged on the semiconductor chip so that the thermosetting sealing resin layer faces the semiconductor chip. Heat is applied to the side of the circuit board, while applying pressure to the sealing resin film from the side of the mold release film by using a rubber head having a rubber hardness of 5-100 to bond the semiconductor chip on the circuit board. After sealing the semiconductor chip with the resin, the mold release film is peeled.

Growing community of inventors

Tochigi, Japan

Kazunori Hamazaki