Renesas Technology Corp.

Hitachi, Ltd.

Other

Hitachi Ulsi Systems Co., Ltd.

Hitachi Microcomputer System, Ltd.

Ntt Docomo, Inc.

Kaijo Corporation

Hitachi Microsoftware Systems, Inc.

Renesas Electronics Corporation

Hitachi Yonezawa Electronics Co., Ltd

Hitachi Chemical Company, Ltd.

The Japan Steel Works, Ltd.

Kyb Corporation

Hitachi Microcomputer Engineering, Ltd.

Hitachi Hokkai Semiconductor Ltd.

Kazunari Suzuki

Kunihiro Tsubosaki

Yoshinori Miyaki

Hiromichi Suzuki

Kunihiko Nishi

Fujio Ito

Takafumi Nishita

Akihiko Kameoka

Masahiro Ichitani

Chuichi Miyazaki

Hiroaki Tanaka

Noriyuki Takahashi

Masayuki Suzuki

Tadashi Kuwabara

Keiichi Nakane

Takashi Miwa

Kenichi Imura

Kouji Tsuchiya

Takao Matsuura

Takanori Hashizume

Teppei Azuma

Koutarou Nagase

Gen Murakami

Yoshiyuki Abe

Ichiro Anjoh

Takahiro Naito

Sueo Kawai

Masamichi Ishihara

Naomichi Nonaka

Hiroyuki Koreeda

Ryosuke Kimoto

Junichi Arita

Akihiko Iwaya

Takafumi Konno

Michio Tanimoto

Tomoko Higashino

Toshihide Uematsu

Shigeki Tanaka

Tokuji Toida

Daisuke Omoda

Shunji Koike

Taisei Jin

Ryouhei Kurita

Kiyoshi Masuda

Toshihiro Shiotsuki

Ki Han

Hideyuki Suga

Nobuhiro Sawai

Minoru Kimura

Yujiro Kajihara

Masao Odagiri

Manabu Takata

Hirohito Ohashi

Kazuhiko Kajigaya

Yasuhiro Naka

Masachika Masuda

Tamaki Wada

Hiroshi Watanabe

Michiaki Sugiyama

Seiji Narui

Naotaka Tanaka

Hiroaki Aotsu

Kiyoshi Nakai

Seigo Takahashi

Naoya Ikeda

Yukio Fujiwara

Keizo Kawakita

Hidekazu Matsuura

Takashi Wada

Daisuke Makino

Takehiro Shimizu

Yoshihiro Nomura

Bunshi Kuratomi

Hideaki Tsugane

Hiroshi Kodaka

Tomoo Matsuzawa

Masaki Kawase

Choju Nagata

Nobuo Ichimura

Yujiro Tatsuno

Takuji Ide

Yasuyuki Nakajima

Hideo Inayoshi

Junichi Seki

Daisuke Satou

Toru Ishida

Takafumi Dohdoh

Masanosuke Ikegaya

Toshio Kushida

Akira Suzuki

Tetsuharu Urawa

Nobuaki Yamada

Akira Onozawa

Kenji Kohzu

Mikako Ujiie

Kosuke Kitaichi

Shinya Ogane

Kazumi Tameshige

Fumiyoshi Sato

Atsushi Tsukada

A vane pump includes: a suction port configured to guide working oil to a pump chambers; a discharge port configured to guide the working oil discharged from the pump chambers; and a notch formed from an opening edge portion of the suction port towards a reversing direction of a rotation direction of a rotor, wherein the pump chambers each communicates with the suction port through the notch during a course of the transition from the state, in which the pump chamber is in communication with the discharge port, to the state, in which the communication with the discharge port is shut off, as the rotor is rotated.

Vane pump with a notch provided at a suction port

Moving servo motors of molds in synchronization with the operations of platens which enables fine patterns or shapes to be formed even on a large molded article. A mold clamping device forms patterns or the like on a molded article by detecting a mold position of a second platen among first, second, third platens with digital mold opening/closing position detector, and driving servo motors for molds of the molds in synchronization with a digital mold opening/closing position signal from the digital mold opening/closing position detector.

Mold clamping device and method

A telephone sends, in accordance with a user's instruction, a call connection request that includes a source telephone number and a destination telephone number to a connecting device or VoIP server device that corresponds to the source telephone number. Management server device, upon identifying a set of a source telephone number and a destination telephone number that is more appropriate than a set of those included in the call connection request, sends a notice to the telephone to prompt a user to change the telephone numbers. The connecting device or VoIP server device that establishes a call connection in accordance with the call connection request, notifies a destination telephone of a to-be-notified telephone number that is selected by the management server device based on the destination telephone number.

Device and method for using appropriate telephone number for call connection

There are provided an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned and capable of performing cleaning at a high cleaning level for highly precise substrates and the like used in an electronics industry. Occurrence of damage on the substrate to be cleaned is suppressed by holding an object to be cleaned so as to be positioned out of a region where perpendiculars extend from an oscillating surface of an ultrasonic transducer to a liquid surface (an ultrasonic-irradiated region) under and in the vicinity of the liquid surface of a cleaning solution, exciting a capillary wave on a surface of the cleaning solution by an ultrasonic wave, and separating particulate contamination of the object to be cleaned by an acoustic pressure generated by the capillary wave without irradiating the object to be cleaned directly with the ultrasonic wave.

Ultrasonic cleaning apparatus

A notification apparatus includes: an obtaining unit that obtains information on a use of a first mobile communication network when a mobile communication terminal configured to use selectively one of a first identifier and a second identifier which are assigned to the first mobile communication network and the second mobile communication network, respectively so as to perform a communication currently connects to the second mobile communication network using the second identifier; and a notifying unit that notifies the information obtained by the obtaining unit to the mobile communication terminal via the second mobile communication network.

Notification apparatus, notification system, notification method, and program

A control apparatus includes: a determination unit that determines whether identification information for identifying a mobile communication terminal in a second mobile communication network can be changed from first identification information assigned in the first mobile communication network to a second identification information assigned in the second mobile communication network, when the mobile communication terminal in which the first identification information is stored is situated in a region in which the second mobile communication network can be used and the mobile communication terminal uses the first mobile communication network via a second mobile communication network; and a notification unit that transmits a notification of a change of the identification information to a request apparatus that is connected to the second mobile communication network and is configured to request the mobile communication terminal to change the identification information, if it is determined that the identification information can be changed.

Control apparatus, control method, communication system and program

In order to perform SM swap efficiently, a mobile communication device that performs mobile communication includes: an attachment unit for attaching thereto an embedded subscriber identity module (eSIM) that stores therein an Operational Profile (OP) and a Provisioning Profile (PP); a PP reception unit for receiving, through a mobile communication network associated with the OP stored in the eSIM, the PP associated with an Subscription Manager (SM) corresponding to a destination mobile communication network, and storing the received PP in the eSIM; and an OP reception unit for performing communication with the SM using the stored PP associated with the SM to receive the OP associated with the mobile communication network, and storing the received OP in the eSIM.

Communications system, mobile communications device, transition control device, transition control method, and transition control program

An ultrasonic cleaning device includes an ultrasonic transducer () for providing ultrasonic energy to a propagation liquid (), an ultrasonic propagation tube () for flowing the propagation liquid provided with the ultrasonic energy by the ultrasonic transducer, a holding mechanism disposed below the ultrasonic propagation tube for holding an object to be cleaned (), and a cleaning liquid supply mechanism for supplying a cleaning liquid to a cleaning surface of the object to be cleaned held by the holding mechanism. The ultrasonic propagation tube () is disposed so that a side surface thereof may contact a liquid film () of the cleaning liquid formed on the cleaning surface by supplying the cleaning liquid to the cleaning surface by the cleaning liquid supply mechanism.

Ultrasonic cleaning device

An ultrasonic cleaning device is provided which can easily cope with an increase in a diameter of a cleaning surface of an object to be cleaned. An ultrasonic cleaning device according to the present invention includes an ultrasonic transducerfor providing ultrasonic energy to a propagation liquid, an ultrasonic propagation tubefor flowing the propagation liquid provided with the ultrasonic energy by the ultrasonic transducer, a holding mechanism disposed below the ultrasonic propagation tube for holding an object to be cleaned, and a cleaning liquid supply mechanism for supplying a cleaning liquid to a cleaning surface of the object to be cleaned held by the holding mechanism, and the ultrasonic propagation tubeis disposed so that a side surface thereof may contact a liquid filmof the cleaning liquid formed on the cleaning surface by supplying the cleaning liquid to the cleaning surface by the cleaning liquid supply mechanism.

In a state where an adhesive tape is attached onto a main surface of a semiconductor wafer, a trench is formed in a rear surface of the semiconductor wafer. For forming the trench in the rear surface of the semiconductor wafer, after coating a resist film on the rear surface of the semiconductor wafer, the resist film is patterned by using the photolithography technology. The patterning of the resist film is performed so as not to leave the resist film in the region where the trench is to be formed. Then, the trench is formed in a predetermined region of the semiconductor wafer by the dry etching technology using the patterned resist film as a mask. Specifically, the trench is formed in the region near the dicing line.

Semiconductor device, semiconductor wafer and manufacturing method of the same

In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chipand a resin is enlarged by making the external size of a die padsmaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chipshaving different external sizes can be mounted on the die padby cutting the leading ends of leadsto a suitable length in accordance with the external sizes of the semiconductor chips

Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two

A technique capable of stably releasing chips from a dicing tape, includes grinding a back surface of a semiconductor wafer, while adhering a pressure sensitive adhesive tape to a circuit forming surface of the semiconductor wafer formed with an integrated circuit, to achieve a predetermined thickness and forcibly oxidizing the back surface of the semiconductor wafer. Then, the pressure sensitive adhesive tape adhered to the circuit forming surface of the semiconductor wafer is released, and a dicing tape is adhered to the back surface of the semiconductor wafer. Further, the semiconductor wafer is divided by dicing it into individual chips, and then the back surface of the chip is pressed by way of the dicing tape, thereby releasing the chips from the dicing tape.

Fabrication method of semiconductor integrated circuit device

The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

Method of manufacturing a semiconductor device

A manufacturing method of a semiconductor device including preparing a lead frame having a die pad, leads arranged around the die pad and a silver plating layer formed over a first portion of each of the leads, mounting a semiconductor chip over a main surface of the die pad with a rear surface of the chip fixed to the main surface of the die pad, electrically connecting electrodes of the chip with the leads through wires, forming a molding resin sealing the die pad, the first portion, the semiconductor chip, and the wires, and forming a lead-free solder plating layer over a second portion of each of the leads exposed from the molding resin. An area of the die pad is smaller than an area of the chip, and a part of the molding resin contacts with the rear surface of the chip exposed from the die pad.

Semiconductor device and method of manufacturing the same

Growing community of inventors

Tokyo, Japan

Kazunari Suzuki