Kabushiki Kaisha Toshiba

Kazunari Ishimaru

Fumitomo Matsuoka

Hirohisa Kawasaki

Atsushi Yagishita

Akira Hokazono

Akio Kaneko

Yasunori Okayama

Kaori Umezawa

Hideo Aoki

Takeshi Watanabe

Kiyotaka Miyano

Makoto Fujiwara

Hidetoshi Koike

Tomonao Takamatsu

Minoru Takahashi

Kunihiro Kasai

Hiroshi Gojohbori

Masahito Nishigohri

Kanna Tomiye

A semiconductor device comprises: a semiconductor element; a mounting substrate with the semiconductor element mounted thereon; a first high thermal conductivity member formed on a surface of the mounting substrate; and a first cooling member thermally connected to at least a part of the first high thermal conductivity member. The first high thermal conductivity member is thermally connected to the semiconductor element, and the first high thermal conductivity member has an outer edge which is located outside an outer edge of the semiconductor element.

Semiconductor device with cooling member

According to the present invention, there is provided a semiconductor device fabrication method, comprising: depositing a mask material on a semiconductor substrate; patterning the mask material and forming a trench in a surface portion of the semiconductor substrate by etching, thereby forming a first projection in a first region, and a second projection wider than the first projection in a second region; burying a device isolation insulating film in the trench; etching away a predetermined amount of the device isolation insulating film formed in the first region; etching away the mask material formed in the second region; forming a first gate insulating film on a pair of opposing side surfaces of the first projection, and a second gate insulating film on an upper surface of the second projection; depositing a first gate electrode material on the device isolation insulating film, mask material, and second gate insulating film; planarizing the first gate electrode material by using as stoppers the mask material formed in the first region and the device isolation insulating film formed in the second region; depositing a second gate electrode material on the mask material, first gate electrode material, and device isolation insulating film; and patterning the first and second gate electrode materials, thereby forming a first gate electrode in the first region, and a second gate electrode in the second region.

Semiconductor device and method of fabricating the same

A semiconductor device manufacturing method is disclosed. The method is to form a second semiconductor layer which has less susceptibility to adopting insulative characteristics than a first semiconductor layer on the first semiconductor layer. Then, grooves which expose portions of the second and first semiconductor layers are formed to extend from the upper surface of the second semiconductor layer into the first semiconductor layer. Next, portions of the first and second semiconductor layers which are exposed to the grooves are changed into an insulator form to fill the grooves with the insulator-form portions of the first semiconductor layer.

Semiconductor device manufacturing method

A semiconductor device includes a semiconductor substrate, an insulating film projected on a surface of the semiconductor substrate, a semiconductor film provided on a side surface of the insulating film, and MIS transistor formed in the semiconductor film, the MIS transistor having source, gate and drain region. The semiconductor device further includes a gate electrode provided on the gate region of the MIS transistor, the length of the gate electrode being larger than the thickness of the semiconductor film.

Semiconductor device with silicon-film fins and method of manufacturing the same

There is provided a semiconductor integrated circuit including a logic circuit and a writing circuit configured to receive a writing data outputted from the logic circuit, invert the writing data to generate an inverted data, compare the writing data with the inverted data and output the held writing data if the writing data is different from the inverted data.

Semiconductor integrated circuit

A semiconductor device includes a first semiconductor layer, and a first insulated-gate field-effect transistor of a first conductivity type that is provided in a major surface region of the first semiconductor layer. The semiconductor device further includes an electrostrictive layer that is provided on a back surface of the first semiconductor layer and applies a first stress along a channel length to a channel region of the first insulated-gate field-effect transistor when the first insulated-gate field-effect transistor is operated.

Semiconductor device with electrostrictive layer in semiconductor layer and method of manufacturing the same

According to the present invention, there is provided a semiconductor device fabrication method, comprising:

A semiconductor device suitable for the miniaturization and comprising properly controlled Si/SiGe gate electrode comprises an insulator formed on a semiconductor substrate, a first gate electrode formed on the insulator and including silicon-germanium, wherein a germanium concentration is higher near an interface to the insulator and lower in a surface side opposite to the insulator, and a second gate electrode formed on the insulator and including silicon-germanium, wherein a germanium concentration is substantially uniform and an n-type dopant of a concentration of above 6&#xd7;10atoms/cmis contained.

Semiconductor device and method for manufacturing the same

A semiconductor layer in which a primary part of a FinFET is formed, i.e., a fin has a shape which is long in a direction x and short in a direction y. A width of the fin in the direction y changes on three stages. First, in a channel area between gate electrodes each having a gate length Lg, the width of the fin in the direction y is Wch. Further, the width of the fin in the direction y in a source/drain extension area adjacent to the channel area in the direction x is Wext (&#x3e;Wch). Furthermore, the width of the fin in the direction y in a source/drain area adjacent to the source/drain extension area in the direction x is Wsd (&#x3e;Wext).

Fin-shaped semiconductor device

A semiconductor device has a first and a second semiconductor layer provided on an insulating film on a support substrate. A first memory cell transistor, which constitutes a part of a memory cell in an SRAM, has a first gate electrode of a first conductivity type and first source/drain diffusion layers of a second conductivity type opposite to the first conductivity type. The following expression is fulfilled the thickness of the first conductivity type&#x2266;one-third of a length of the first gate electrode in its channel length. A first peripheral transistor, which constitutes a part of a peripheral circuit, has a third gate electrode and a third source/drain diffusion layers. The following expression is satisfied the thickness of the second semiconductor layer&#x3e;one-third of a length of the third gate electrode in its channel length direction.

Semiconductor device and semiconductor device manufacturing method

A semiconductor memory is formed of first, second, third, fourth, fifth and sixth field effect transistors. The first and second transistors have a first line as gates, one ends of current paths of the first and second transistors are connected to a reference potential electrode. The third and fourth transistors have a second line as gates, and one ends of current paths of the third and fourth transistors are connected to the reference electrode. The fifth transistor has a first word line as a gate, and one end of a current path of the fifth transistor is connected to the other ends of the current paths of the first and second transistors. The sixth transistor having a second word line as a gate, and one end of a current path of the sixth transistor is connected to the other ends of the current paths of the third and fourth transistors.

Semiconductor memory including static random access memory formed of FinFET

A semiconductor device has a fuse to be blown with an energy beam. The semiconductor device has copper wiring levels formed on a semiconductor substrate on which semiconductor elements are formed, an uppermost wiring level formed on said copper wiring levels and including a refractory metal film connected to a top one of the copper wiring levels, the fuse formed from a part of the uppermost wiring level, and a surface protective film formed on the uppermost wiring level.

Semiconductor device with fuse to be blown with energy beam and method of manufacturing the semiconductor device

Gate electrodes in an inverter section and a transfer section are formed only on element areas, and connected to each other by means of local interconnection layers. As a result, a memory cell of a very small size but a large capacity can be formed without considering a gate fringe or shortening phenomenon problem.

Semiconductor device and its manufacturing process

A semiconductor device comprises an LDD structure MOS transistor wherein the formation of defects due to ion implantation at the edge of the side wall of the gate electrode is suppressed. In order to perform the ion implantation for forming the source and drain regions of the MOS transistor, impurity ions are implanted using the first and second side walls provided to the gate electrode as a mask, and then the heat treatment for impurity activation is performed after removing the second side wall near the source and drain regions doped with high-concentration impurity ions. By removing the second side wall prior to the heat treatment, the stress applied to the edges of the high-concentration impurity doped regions in an amorphous state is decreased. The defects therefore can be suppressed from being formed at the edges of the source and drain regions near the gate electrode in the recrystallization of the amorphous layer by the heat treatment. As a result, the semiconductor device with high performance and reliability, in which the gate leakage current is small, and the manufacturing method thereof can be attained.

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Yokohama, Japan

Kazunari Ishimaru