General Electric Company

General Electric Corporation Gmbh

Kazunao Kubotera

Nirajkumar Chaturbhai Patel

Suresh Subramanian

Thomas Paul Feist

Ramesh Hariharan

Bernard P Landa

Wit Bushko

Joseph T Woods

Kevin H Dal

Daniel Furlano

In one embodiment, a data storage media comprises: a substrate comprising at least one plastic portion, an edge lift height of less than about 8&#x3bc;, and an axial displacement peak of less than about 500&#x3bc; under shock or vibration excitation; and at least one data layer on said substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate. In another embodiment, the data storage media comprises: a substrate comprising at least one plastic portion and an axial displacement peak of less than about 500&#x3bc; under shock or vibration excitation, and an areal density of about 10 Gbit/in; and at least one data layer on the substrate. The data layer can be at least partly read from, written to, or a combination thereof by at least one energy field, and, when the energy field contacts the storage media, the energy field is incident upon the data layer before it could be incident upon the substrate.

Data storage media utilizing a substrate including a plastic resin layer, and method thereof

Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Carbon-reinforced thermoplastic resin composition and articles made from same

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Kazunao Kubotera