Ngk Spark Plug Company, Limited

Kazunaga Higo

Hironori Sato

Erina Yamada

Takuya Torii

Kenji Suzuki

Masaki Muramatsu

Yasuhiro Sugimoto

Kazuhiro Suzuki

Daisuke Yamashita

Tomohito Ando

Kenji Nishio

Masao Izumi

Hidemasa Igarashi

Tetsuji Tsukada

Masatsune Arakawa

A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.

Component-incorporated wiring substrate and method of manufacturing the same

A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder and includes a lower conductor post located within the through-hole and an upper conductor post located above the lower conductor post and projected outside the layer; the lower conductor post includes an external alloy layer disposed on an external side surface thereof; and the conductor post is brought into intimate contact with an internal side surface of the through-hole via the external alloy layer.

Wiring board

A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may comprise a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder; the conductor post includes a lower conductor post, which is located within the through-hole and includes an external side surface and a lower end surface, and an upper conductor post, which is located above the lower conductor post and is projected outside the solder resist layer; and at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer.

Wiring board and method of manufacturing the same

A wiring substrate is configured such that each of laminate portions provided above and below a substrate core includes insulating layers and conductor layers stacked alternately. Of the conductor layers of the laminate portions, signal line layers are treated with a silane coupling treatment, which is a surface modification treatment, so that each signal line comprises a flat surface. A roughening treatment is performed on the remaining conductor layers of the laminate portions such that the surfaces of these layers are roughened. This structure provides an advantage when high-frequency signals are transmitted through the signal line layers. That is, when each signal line comprises a flat surface, an increase in conductor loss due to the skin effect can be prevented. In addition, by means of chemical bonding attained through the silane coupling treatment, the reliability of adhesion between the signal line layers and the insulating layer is sufficiently attained.

Wiring substrate and method of manufacturing the same

A method of fabricating a wiring board including at least one conductor layer and at least one resin insulating layer, the method including a wiring groove forming step of forming a wiring groove in the resin insulating layer by irradiating a surface of the resin insulating layer with a laser, and a wiring layer forming step of forming the conductor layer such that at least a portion of the conductor layer is embedded in the wiring groove to form a wiring layer in the wiring groove.

Method of fabricating wiring board

A wiring board comprising: a plate core having a first main surface and a second main surface; conductor layers including a conductor line; dielectric layers laminated alternately with said conductor layers on at least one of said first and second main surfaces; via conductors as defined herein; a signal through-hole as defined herein; a signal through-hole conductor as defined herein; a first path end pad as defined herein; a second path end pad as defined herein; a shield through-hole as defined herein; and a shield through-hole conductor as defined herein; wherein: a signal transmission path is formed as defined herein; at least one of said conductor layers is disposed on each of said first and second main surface sides; said surface conductor on said first main surface side and said conductor line form a strip line, a microstrip line, or a coplanar waveguide with constant characteristic impedance Z; an inner surface of said shield through-hole is covered with said shield through-hole conductor; and an interaxis distance between said signal through-hole conductor and said shield through-hole conductor is adjusted as defined herein.

Growing community of inventors

Iida, Japan

Kazunaga Higo