Hitachi Aic Inc.

Kazumitsu Ishikawa

Masayuki Sakurai

Hiroyuki Kudoh

Shoji Oikawa

Haruo Suzuki

Yasuaki Nakamura

An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.

Electronic component device and method of manufacturing the same

A printed wiring board ( ) having a cavity ( ) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate ( A) having flat surfaces on both sides; a lower plate body ( B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity ( ) in a part thereof, for receiving an electronic part ( ) within an inside thereof; conductor layers ( ) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes ( ) or flat through-holes ( &prime;), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes ( ) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc., can be received or stored within a space of the cavity ( ), thereby enabling the mounting of the electronic parts thereon with high density and reliability, such as on a motherboard ( ).

Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof

A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.

Growing community of inventors

Kanagawa, Japan

Kazumitsu Ishikawa