Yamaichi Electronics Co., Ltd.

Yamaichi Electric Co., Ltd.

Yamaichi Electric Mfg. Co., Ltd.

Yamachi Electric Co., Ltd.

Kazumi Uratsuji

Noriyuki Matsuoka

Shunji Abe

Yoshiyuki Kato

Hideki Sagano

Shuuji Kunioka

Ryuichi Nakamura

Hideki Sato

A pressing surface portion of a presser member for selectively holding a semiconductor device is supported to be movable upward and downward in accordance with the up/down motion of a cover member to be close to or away from a alignment plate, as well as to be rotatable between a position directly above the alignment plate and a predetermined waiting position.

Socket for semiconductor device

A semiconductor device-socket is provided, in which a partition wall for dividing slits engaged with a contact portion of a contact terminal in an object under test-accommodation member has a slope for guiding leads of a semiconductor device onto the contact portion of an adjacent contact terminal.

Semiconductor device-socket

An intermediate portion between groups of contact pins in a lead frame of a contact pin module is supported by a supporting plate.

Contact pin module and testing device provided with the same

An IC carrier includes a carrier base, a carrier cover and a wiring sheet, through which an IC and a socket contact each other, interposed between the carrier cover and the wiring sheet. The IC is retained by the carrier base such that the IC and the wiring sheet face each other. The IC carrier further includes a plurality of connecting pins projecting from an opposing surface of one of the carrier base and the carrier cover. The connecting pins are inserted into through-holes formed in the wiring sheet and then press fitted into connecting holes formed in the other of the carrier base and the cover, so that an area in the vicinity of a peripheral edge of the wiring sheet is sandwiched between the carrier base and the carrier cover.

IC carrier

Between an IC and an IC receptacle is interposed a flexible wiring sheet, via which contact pieces of the IC and contacts of the IC receptacle are held in contact with one another. In this case, lateral deviation and flexing of the wiring sheet are prevented satisfactorily, and proper contact between the IC and IC receptacle is ensured. A back-up frame is applied by adhesive to the flexible wiring sheet to form a contact agency. The back-up frame 11 has a central window 11 to form a non-backed-up region in a central portion of the flexible wiring sheet 3 that covers the window. The IC 3 and flexible wiring sheet are held in forced contact with each other in the non-backed-up region. The back-up frame has an outer edge portion forming a back-up region for backing up an edge portion of the wiring sheet. In this back-up region, the IC receptacle and the flexible wiring sheet 1 are held in contact with each other.

Contact agency interposed between IC and IC receptacle

An IC carrier includes a carrier body for retaining a flexible wiring sheet and an IC in an opposing relation. The carrier body has suction holes formed in a flexible wiring sheet placing surface thereof and extending all the way through the carrier body. A negative pressure is applied to the flexible wiring sheet through the suction holes, thereby retaining a relative position between the flexible wiring sheet and the carrier body.

An IC socket is equipped with a plurality of elastic contact pins which are brought into contact with spherical bumps of an IC package. Each of the contact pins has at a foremost end thereof a contacting portion disposed opposite to a lower spherical surface of the spherical bump. The contacting portion has a relief portion which is kept in a non-contacting condition relative to a lower dead point portion on the lower spherical surface of the spherical bump, and a contacting end is brought into press contact at an area thereof around the relief portion with that area of the spherical surface of the spherical bump outwardly adjacent to the lower dead point.

IC socket

In an IC socket, a depressing portion of a cover is pressed against a pressure receiving portion of a pressure receiving lever by downwardly pressing the cover, and then a contact portion of a contact is displaced in the rearward direction by movement of the pressure receiving lever. The depressing portion is formed by an inclined cam surface having a downward gradient in the rearward direction. When the cover is moved in the downward direction, the pressure receiving portion is caused to slidably move from the upper end side to the lower end side of the downwardly inclined cam surface.

A contact structure for an IC socket is usable for an IC package having a number of spherical type terminals or a number of cylindrical terminals arranged on the lower surface of an IC main body. To realize this contact structure for an IC socket, a number of contacts arranged corresponding to the spherical type terminals or the cylindrical terminals on the IC main body are provided. Resilient contact pieces for allowing each contact to come into pressure contact with each terminal at one point or at two points on the peripheral surface of the respective terminals are provided. Plural groups are constructed for a group of contacts and a group of terminals for changing an orientation of each resilient contact piece for allowing the group of contacts to give pressure contact force to the group of terminals in three directions or four directions. Each of the plural groups is arranged to generate an opposing force between adjacent groups.

Contact structure for IC socket

A contacting structure with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the contact pin includes a contacting portion supported by a resilient support element, and the contacting portion is arranged in opposite relation to that part of a spherical surface of the spherical bump other than a lower-most point thereof. The contacting portion has a projection capable of pressing into the spherical surface of the spherical bump, and also has a pressure receiving surface for setting an amount by which the projection presses into the spherical surface.

Contacting structure with respect to spherical bump

An IC socket includes a socket body, an IC package receiving portion formed in the socket body and adapted to receive an IC package therein, a plurality of contacts arranged in array along the IC package receiving portion, and a contact opening/closing cover overlying the socket body. The contacts are displaced between a position for contacting leads of the IC package and a position for removing the contacting relation upon upward and downward movements of the contact opening/closing cover. The IC socket further includes a positioning member which is displaced in the same direction as the contacts in upon the upward and downward movements of the contact opening/closing cover, so as to regulate the portions of the contacts in the neighborhood of a contacting portion of each contact.

An IC carrier comprising a case for receiving an IC, a carrier body for receiving the case, and a positioning device for correctly positioning the IC which is received in the case.

An IC carrier comprising first and second blocks, the second block is relatively movably engaged in the second block; first and second side regulation portions formed on the first and second blocks, respectively, and adapted to pressure contact opposite side faces of an IC in the sense of a lateral direction of the IC, respectively; a bottom regulation portion formed on at least one of the first and second side regulation portions and adapted to support a bottom face of the IC captured between the first and second side regulation portions; and a spring disposed between the first and second blocks such that the first and second blocks are normally biased and relatively slid, by a resilient force of the spring, in a direction reducing a distance between the first and second side regulation portions, so that the first and second side regulation portions are brought into pressure contact with the opposite side faces of the IC when the IC is inserted into the carrier.

An IC socket including a socket body and an IC receiving portion formed in the socket body and having an open top at an upper surface of the socket body and an open bottom at a lower surface thereof, the IC being loaded into the IC receiving portion through the open bottom, the improvement comprising a lifter for lifting the IC into a raised-position within the IC receiving portion, contacts arranged on the socket body so as to be pressure contacted with contacting elements of the IC by a lifting force of the lifter applied to the IC, and engagement means for engaging the lifter so that the IC is held in the raised-position.

A connector for an electric part having a contact shutter device for forming an open state or a closed state of a contact, comprising a finger-like latch member able to be engaged with and disengaged from an electric part, the finger-like latch member being operatively connected to an action of the contact shutter device for displacing a contact in an open state in order to be disengaged from the electric part, the finger-like latch member being operatively connected to an action of the contact shutter device for displacing the contact in a closed state in order to be engaged with the electric part.

Growing community of inventors

Tokyo, Japan

Kazumi Uratsuji