Hitachi Chemical Company, Ltd.

Kazumasa Takeuchi

Katsuyuki Masuda

Nozomu Takano

Masaki Yamaguchi

Makoto Yanagida

Kenji Tanaka

Nobuyuki Ogawa

Ken Nanaumi

Takashi Yamadera

Tetsuya Saito

Shin Takanezawa

Yasuyuki Mizuno

Naoki Fukutomi

Yuko Tanaka

Masashi Tanaka

Kazuhito Obata

Masaki Morita

Yoshitsugu Matsuura

Shigeru Haeno

Yuuji Ooyama

Yoshinori Nagai

Masato Fukui

Shuuichi Hatakeyama

Kazuko Suzuki

Ritsuko Obata

Akiko Kawaguchi

The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cmdue to nitrile groups (P) with respect to the peak height near 1730 cmdue to carbonyl groups (P) in the IR spectrum of the cured resin composition (P/P) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.

Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain.

Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate

It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board () according to a preferred embodiment of the invention has a construction with a substrate (), a conductor () formed in a flexible region () and conductors () formed in non-flexible regions (). The conductor () formed in the flexible region () has a total thickness of 1-30 &#x3bc;m, and the conductors () formed in the non-flexible regions () have a total thickness of 30-150 &#x3bc;m.

Printed wiring board

The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet

A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90&#xb0;, cracks do not occur in the base material.

Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 &#x3bc;m.

Prepreg, metal-clad laminate and printed circuit board using same

The present invention is directed to a prepreg comprising a fiber base material impregnated with a resin composition which comprises a polyamide-imide resin and a thermosetting resin as essential components, and a metal-clad laminated sheet obtained by pressing the prepreg and a metal foil having a surface roughness: Rz&#x2266;3.0 together while heating. In addition, the present invention provides a heat-resistant laminated sheet which is excellent in micro-wiring formation properties, thermal shock resistance, reflow resistance, and crack resistance.

Prepreg and a laminated sheet

Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.

Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device

Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device

A resin composition which can be cured by application of heat or irradiation of light, comprising (A) a bismaleimide compound, (C) an acridine compound represented by the formula (1) or (2) as an thermosetting accelerator or a photo-polymerization initiator, and (B) an optional resin ingredient other than (A); a film and laminate produced by using the resin composition; and a method of producing a multilayer wiring board by using the resin composition as a material of insulating layers: ##STR1## wherein R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.7, R.sub.8 and R.sub.9 are hydrogen, a halogen, an alkyl or alkoxy group, R.sub.1 is an alkyl group, and R.sub.10 is an alkylene group.

Resin composition which can be cured by application of heat or

A photolithographically viahole-forming photosensitive element is formed of a light-transmitting base material and a photosensitive resin composition laminated as a layer on the light-transmitting base material. The photosensitive resin composition comprises:

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Chikusei, Japan

Kazumasa Takeuchi