Hitachi, Ltd.

Hitachi Cable, Inc.

Kazumasa Fujioka

Wataru Nakayama

Takahiro Daikoku

Naoyuki Tamura

Isao Nakajima

Heikichi Kuwahara

Shinjiro Ueda

Hideaki Kamohara

Syuuji Saitoo

Kazuya Higeta

Kunihiro Takahashi

Nobuo Suzuki

Sumio Okuno

Takao Kuroda

Eiichi Toyota

Takeo Nemoto

Toshiaki Kobari

Muneo Mizumoto

Sumio Yamaguchi

Koichi Isaka

Toshio Takasaki

A cooling apparatus for electronic device comprises an electronic element unit which comprises a base member, a thermal conductive electric insulating layer soldered to the base member and a plurality of electronic elements soldered to the thermal conductive electric insulating layer at least one cooling unit which is detachably kept in pressure contact with the base member of the electronic element unit and comprises a cooling block, at least one heat pipe having a refrigerant sealingly contained therein and inserted in the cooling block at one end thereof and a plurality of radiation fins provided at the other end of the at least one heat pipe; and a device which serves to detachably keep the electronic element unit and the cooling unit in pressure contact with each other. The other end of the heat pipe extends obliquely with a predetermined angle (.alpha.) with respect to the inserted portion thereof.

Cooling apparatus for electronic elements

A cooling apparatus having a plurality of heat pipes is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid in the heat pipes has been frozen. The cooling apparatus has a block of a high heat conductivity in which one end of each heat pipe serving as an evaporation section of the heat pipe is embedded. Heat radiation fins are attached to portions of the heat pipes exposed from the block, so that the exposed portions of the heat pipes serve as condensation sections of the respective heat pipes. There are two types of heat radiation fins: a first type of fins which are attached to all the heat pipes and a second type of fins which are attached only to selected heat pipes.

Heat-pipe type cooling apparatus

A molecular beam source suppresses a temperature fall at the opening of a crucible, to make a temperature distribution within the crucible uniform and to prevent the phenomenon of bumping of a source substance, whereby the quality of an evaporated film can be enhanced. The source includes a heater disposed around the crucible which is formed of straight parts and U-shaped end parts continuously repeated at equal intervals. The straight parts are arranged so as to extend in a vertical direction of the crucible and the U-shaped end parts are bent outwards at outer-peripheral positions of the opening of the crucible.

Molecular beam source

In order to adapt a thermal head for a thermal printer to a raised speed, the thickness .delta.(.mu.m) of a heat accumulating layer in the head is set at: ##EQU1## where k: temperature conductivity of the heat accumulating layer,

Thermal head for thermal printer

In a molecular beam epitaxy apparatus, the loading chamber for introducing the substrates is made separable from both the preparation chamber for cleaning the substrates and the growth chamber for forming thin films onto the respective substrates, so that the evacuation of the loading chamber is possible even when the loading chamber is separated from the apparatus, thus improving the productivity thereof.

Apparatus for manufacturing semiconductors

A thermal head is provided with a heat accumulating member disposed on a substrate, a plurality of heating resistors juxtaposed on the heat accumulating member in a manner to be spaced from each other, electrodes for supplying electric power to the heating resistors, and a protective member for preventing oxidation and wear of the heating resistors and the electrodes, these constituents being formed as layers. When the electric power is supplied to the electrodes, heat is generated by a heating portion of the heating resistor corresponding to the electrodes, and it is transmitted to a head surface via a thermally conductive member disposed in a printing dot portion of the protective member. The heat from the printing dot portion is used for effecting printing on a medium to-be-recorded through a thermosensitive sheet which lies in contact with the head surface.

Thermal head

A rotary substrate holder of a molecular beam epitaxy apparatus including leads-cum-posts serving both as leads for passing a current to a heater for heating a substrate and as posts for supporting the heater. By this arrangement, heat transferred from the heater to a bearing disposed in the vicinity of the heater is minimized in amount, thereby prolonging the service life of the holder and minimizing a heat loss thereof.

Rotary substrate holder of molecular beam epitaxy apparatus

A rotor for hydrogen-cooled rotary electric machines is provided with a gas inlet chamber and a gas outlet chamber which are circumferentially defined by radially extending partition walls and disposed in a region between a retaining ring holding field windings in position and a rotor shaft. The gas outlet chamber is divided into a first zone located near the polar axis and a second zone located near the interpolar axis. Rotor cooling gas is introduced through a gas inlet port to the gas inlet chamber to flow to the gas outlet chamber divided into a plurality of zones while cooling the field windings. From the gas outlet chamber, the gas is discharged through axially extending passages and fan-like ventilating devices to the outside of the rotor.

Rotor for hydrogen-cooled rotary electric machines

A rotor for hydrogen-cooled rotary electric machines is provided with a gas inlet chamber and a gas outlet chamber which are circumferentially defined by radially extending partition walls and disposed in a region between a retaining ring holding rotor windings in position and a rotor shaft. Rotor cooling gas is introduced through a gas inlet port to a gas inlet chamber to flow to a gas outlet chamber divided into a plurality of zones while cooling the rotor windings. Form the gas outlet chamber, the gas flows through axially extending passages to a plurality of fan-like ventilating means to be discharged outside of the rotor.

A hermetic casing filled with a cooling gas contains a stator core having cooling ducts in radial direction, and a rotor comprised of a rotor body and an end-winding region and a fan for circulating the cooling gas. The cooled gas is divided into two flows at fan outlet by the dividing wall. One gas flow pressurized by the fan makes its way to the rotor end region and cools the same, and is discharged to the armature end region. The other gas flow pressurized by the gas goes to the stator core and the rotor body and cools the same, and then is discharged to the inlet side of the cooler. The two gas flows merge with each other at the inlet of the cooler, is cooled through the cooler, and reach the fan inlet region.

Growing community of inventors

Ibaraki, Japan

Kazumasa Fujioka