Daido Hoxan Inc.

Kazuma Yamamoto

Takashi Yokoyama

Akira Yoshino

Yoshinori Ohmori

Go Matsuda

Shigeki Itou

Masato Yamamoto

Takahiro Mishima

A method and an apparatus for cutting a wafer from a crystalline ingot, by directing a stream or streams of etching gas at the crystalline ingot in a vacuum. Waste in cutting can be greatly minimized and the work environment can also be kept clean. Further, excellent surface smoothness can be realized on the cut wafers.

Method and apparatus for producing a wafer

A method for processing semiconductor materials such as a crystalline ingot or a wafer and an apparatus employed therein. An etching gas is supplied on the surface of a semiconductor material, while laser irradiation or light quantum irradiation is applied on a predetermined part of the semiconductor material surface, whereby a component of the etching gas is excited, reacted with a component of the semiconductor material and evaporated for elimination. Thereby, semiconductor materials can be processed hygienically, easily and with high precision.

Method for processing semiconductor material

Growing community of inventors

Osaka, Japan

Kazuma Yamamoto