Denso Corporation

Adeka Corporation

Kazuma Yamaguchi

Yasuki Furutake

Soji Masui

Yoichi Kajino

Nobuhisa Shimizu

Kensuke Chikata

Ryo Ogawa

Daisuke Takama

Shinsuke Yamada

Keisuke Ota

Takao Izumi

Kohei Hirayama

Hirokazu Saito

Takashi Aoki

Takeshi Kazama

Ken Nishioka

Kazuya Kushida

Shunsuke Ito

There is provided a photocurable adhesive having good deep-section curability. A photocurable adhesive is formulated to be curable by laser light irradiation. The photocurable adhesive contains an epoxy adhesive component and titanium black. The content of the titanium black is 1 ppm by mass or more and 150 ppm by mass or less relative to 100 parts by mass of the epoxy adhesive component. The titanium black may have a primary particle size of 5 nm or more and 150 nm or less.

Photocurable adhesive

There is provided a photocurable adhesive which is capable of reducing the amount of gas discharged from the cured product. A photocurable adhesive is formulated to be curable by laser light irradiation. The photocurable adhesive contains an epoxy adhesive component, and a light-absorbing component configured to generate heat by laser light irradiation. The epoxy adhesive component contains a cyanate ester resin (A), epoxy resin (B), latent amine curing agent (C), and ion scavenger (D).

A printed circuit board capable of reducing or suppressing connection failure includes a base film made of insulating material, an electric conductor pattern formed on a front surface of the base film, and an insulating cover film covering the electric conductor pattern. The printed circuit board also includes a circuit portion with a circuit formed by the electric conductor pattern, and a pad portion with a bonding pad composed of the electric conductor pattern exposed from the insulating cover film. The pad portion has higher rigidity than the circuit portion.

Printed circuit board and method of producing printed circuit board

A camera module, which is mounted on an inside of a front windshield of a vehicle and to image an external environment of the vehicle, includes a lens unit and an imager to image the external environment by forming an optical image, which is from the external environment through the lens unit.

Vehicle windshield camera module

Vehicle windshield mounted camera module

A camera is module mounted on an inside of a windshield in a vehicle and is configured to photograph an outside of the vehicle. The camera module includes: a first camera for photographing the outside with a first imaging element through a first lens unit; and a second camera having a view angle narrower than the first camera and photographing the outside with a second imaging element through a second lens unit. The first imaging element and the second imaging element have a same pixel specification.

Camera module

A camera device which includes a holder which retains an optical member therein and a circuit board on which an image sensor is mounted. The holder is joined to the circuit board using an adhesive agent. The circuit board at least partially includes a metallic layer and a resinous layer stacked in a thickness-wise direction of the circuit board. The circuit board has a metallic layer-absent portion in which the metallic layer is partially omitted. The metallic layer-absent portion is located so as to overlap the joint between the holder and the circuit board in the thickness-wise direction of the circuit board, thereby minimizing the transfer of heat of the adhesive agent to the metallic layer. This achieves effective hardening the adhesive agent, which will facilitate the ease with which the camera device is assembled.

Camera device

A camera device includes a holder in which an optical member is retained and a circuit board with an image sensor. The circuit board at least includes a stack of a solder resist, a metallic layer, and a resinous layer. A groove or recess is formed in the circuit board to have a depth extending through thicknesses of the solder resist and the metallic layer to expose a portion of an outer surface of the resinous layer. The holder is attached to the exposed portion of the outer surface of the resinous layer using an adhesive agent. An overflow stopper is formed at least round the recess to stop the adhesive agent from flowing outside the recess during a production process, thereby enhancing the degree of joining of the holder and the circuit board, and ensuring the stability in positional relation between the image sensor and the optical member.

Growing community of inventors

Kariya, Japan

Kazuma Yamaguchi