Hitachi Metals, Ltd.

Hitachi Cable, Inc.

Kazuma Kuroki

Hiromitsu Kuroda

Hideyuki Sagawa

Yuichi Oda

Shohei Hata

Osamu Ikeda

Seigi Aoyama

Masahide Okamoto

Kotaro Tanaka

Takuto Yamaguchi

Tetsuya Tokumitsu

Hiroyoshi Hiruta

Hiroaki Numata

Shigeru Okamoto

Humio Horii

Tetsuya Tokumitu

Nobuhito Sakuyama

A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.

Solder joint material and method of manufacturing the same

The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (), Al-based metallic layers () on both sides thereof, and X-based metallic layers () (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Junction material, manufacturing method thereof, and manufacturing method of junction structure

A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt&#xb7;ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 &#x3bc;m or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 &#x3bc;m or less.

Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method

A composite material includes a clad material including a base material that includes an iron-chromium alloy and vibration-damping layers that are provided on both surfaces of the base material and include a metal to suppress a vibration. A total thickness of the vibration-damping layers provided on the both surfaces of the base material is in a range of not less than 10% and not more than 40% relative to a total thickness of the clad material.

Composite material

A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.

Composite material for brazing and a brazed product manufactured using the same

To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.

Lead component and method for manufacturing the same, and semiconductor package

A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe&#x2014;Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W/Wto be 0.56 to 0.66, where Wis a weight of Ni contained in the entire brazing material layer and Wis a total weight of Ni and Ti contained in the entire brazing material layer.

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Hitachinaka, Japan

Kazuma Kuroki