Ebara Corporation

Kazuma Ideguchi

Hideki Wakabayashi

Tensei Sato

Ryuya Koizumi

Yosuke Nagasawa

Shugo Midorikawa

One object of the present disclosure is to improve the accuracy of detection of an abnormality of various devices, and/or to advance the timing of detection of an abnormality. There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; an electric field regulating member placed between the substrate and the anode, provided with an opening, and equipped with an opening adjustment member configured to change a dimension of the opening; a motor configured to drive the opening adjustment member; and a control device configured to obtain an electric current value or a load factor of the motor, to calculate an amount of change in the load factor of the motor per unit time from the obtained electric current value or the obtained load factor of the motor, and to detect an abnormality of the electric field regulating member when it is detected that the amount of change in the load factor of the motor per unit time exceeds a predetermined threshold value.

Apparatus for plating and method of plating

In a plating apparatus, a short circuit of a wiring between a rectifier and a plating device is detected without using a substrate in vain. In the plating apparatus that supplies a current from the rectifier to the substrate to plate the substrate, a short circuit detection method includes a step of outputting a current with a predetermined current value from the rectifier, in a state where the substrate and a substrate holder holding the substrate are not electrically connected to the rectifier, a step of acquiring an output voltage value of the rectifier, a step of comparing the output voltage value with a predetermined reference voltage value, and a step of determining that a short circuit occurs in a circuit for connecting the rectifier and the substrate, in a case where the output voltage value is lower than the reference voltage value.

Short circuit detection method in plating apparatus, control method of plating apparatus, and plating apparatus

Provided is a technique configured to cause a first actual operation to be started in a short time when the actual operation of a substrate processing component group is performed a plurality of times. A substrate processing systemincludes a substrate processing apparatushaving a substrate processing component groupand a controller. The substrate processing component groupis configured to perform a test operation and an actual operation. The substrate processing component grouphas a first substrate processing component and a second substrate processing component. When the actual operation is performed a plurality of times, the controllercauses the first substrate processing component to perform the test operation and causes the actual operation of the first substrate processing component to be started after completion of the test operation of the first substrate processing component.

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Tokyo, Japan

Kazuma Ideguchi