Semiconductor Energy Laboratory Co., Ltd.

Kazuma Furutani

Kiyoshi Kato

Takahiko Ishizu

Yuto Yakubo

Shunpei Yamazaki

Yutaka Shionoiri

Yusuke Sekine

Yoshinori Ieda

Takayuki Ikeda

Masashi Tsubuku

Kouhei Toyotaka

Hiromichi Godo

Munehiro Kozuma

Takeshi Aoki

Toshihiko Takeuchi

Atsushi Hirose

Masashi Fujita

Kousuke Sasaki

Keita Sato

A novel correction method for a display apparatus is provided. A correction circuit of the display apparatus obtains offset corresponding to a current flowing through a second subpixel when a first subpixel is not lit. The correction circuit of the display apparatus obtains, for each pixel, correction output data, obtained by correcting, with the offset, data corresponding to a current flowing through each of the second subpixels in sequentially supplying correction video data to the first subpixels and stores the correction video data and the correction output data corresponding to the correction video data in a memory circuit. The correction circuit of the display apparatus calculates coefficients obtained when a relation between the correction video data and the correction output data corresponding to the correction video data is approximated by a quadratic expression and stores the coefficients in the memory circuit. The correction circuit of the display apparatus stores a correction table that is created on the basis of the correction output data and the coefficients, in the memory circuit. The correction circuit of the display apparatus corrects display video data in accordance with the correction table.

Correction method of display apparatus and the display apparatus

A semiconductor device with a novel structure is provided. The semiconductor device includes a memory circuit including a first transistor and a second transistor. The first transistor is formed on a silicon substrate. The second transistor is formed in a layer above a layer where the first transistor is provided. The first transistor includes a first gate electrode and a first back gate electrode with a first channel formation region interposed therebetween. The first gate electrode is electrically connected to one of a source and a drain of the second transistor. The first back gate electrode is formed using a region where an impurity element imparting a conductivity type is selectively introduced in the silicon substrate. The second transistor includes a second channel formation region. The second channel formation region includes a metal oxide.

Semiconductor device

A memory device which includes a gain-cell memory cell formed using an n-channel transistor and in which a potential lower than a potential applied to a bit line is not necessary is provided. Memory cells included in the memory device are arranged in a matrix, and each of the memory cells is connected to a write word line, a write bit line, a read word line, and a read bit line. The write word line is arranged in parallel to one of directions of a row and a column of memory cells arranged in a matrix, and the write bit line is arranged in parallel to the other of the directions of the row and the column. The read word line is arranged in parallel to the one of the directions of the row and the column of the memory cells arranged in a matrix, and the read bit line is arranged in parallel to the other of the directions of the row and the column.

Memory device, semiconductor device, and electronic device

A semiconductor device having a novel structure is provided. The semiconductor device includes a CPU and an accelerator. The accelerator includes a first memory circuit and an arithmetic circuit. The first memory circuit includes a first transistor. The first transistor includes a semiconductor layer containing a metal oxide in a channel formation region. The arithmetic circuit includes a second transistor. The second transistor includes a semiconductor layer containing silicon in a channel formation region. The first transistor and the second transistor are provided to be stacked. The CPU includes a CPU core including a flip-flop provided with a backup circuit. The backup circuit includes a third transistor. The third transistor includes a semiconductor layer containing a metal oxide in a channel formation region.

A novel semiconductor device, a semiconductor device with low power consumption, or a semiconductor device capable of retaining data for a long period is provided. The semiconductor device includes a first selection circuit connected to a plurality of first memory circuits, a second selection circuit connected to a plurality of second memory circuits, and a third selection circuit connected to a plurality of third memory circuits, thereby being capable of conducting power gating of each of the first memory circuits, each of the second memory circuits, or each of the third memory circuits separately. Accordingly, the memory circuits to which data is not written or from which data is not read can be kept in a state where power supply thereto is stopped, so that power consumption of the semiconductor device can be reduced.

Semiconductor device comprising memory circuit and selection circuit

A minute current measurement method is provided. In the current measurement method, a first potential is applied to a first terminal of a transistor under test, a second potential is applied to a first terminal of a first transistor, the first transistor is turned on to accumulate a predetermined charge in a node electrically connecting a second terminal of the transistor under test with a second terminal of the first transistor, a third potential of an output terminal of a read circuit electrically connected to the node is measured, the first transistor is turned off, a fourth potential of the output terminal of the read circuit electrically connected to the node is measured, the amount of the charge held by the node is estimated from the amount of change in the potential of the output terminal of the read circuit (e.g., a difference between the third potential and the fourth potential), and a value of current flowing between the first terminal of the transistor under test and the second terminal of the first transistor is calculated from the amount of the charge held by the node.

Measuring method of low off-state current of transistor

A semiconductor device has a non-volatile memory cell including a write transistor which includes an oxide semiconductor and has small leakage current in an off state between a source and a drain, a read transistor including a semiconductor material different from that of the write transistor, and a capacitor. Data is written or rewritten to the memory cell by turning on the write transistor and applying a potential to a node where one of a source electrode and drain electrode of the write transistor, one electrode of the capacitor, and a gate electrode of the read transistor are electrically connected to one another, and then turning off the write transistor so that the predetermined amount of charge is held in the node.

Semiconductor device and driving method thereof

To provide a semiconductor device whose power can be turned off without the need for a peripheral circuit for data to escape temporarily and in which stored data is not lost even in an off state of the power of the device, and a memory device including the semiconductor device. In a holding circuit of the semiconductor device, a transistor that includes a semiconductor layer (at least a channel formation region) including an oxide semiconductor material with which small off-state current can be achieved is used. Further, the semiconductor device includes a switching element which enables a comparison circuit in which comparison between data stored in the holding circuit and reference data input from the outside does not need to be performed to become forcibly inactive.

Semiconductor device and memory device including semiconductor device

A semiconductor device including a first transistor and a second transistor and a capacitor which are over the first transistor is provided. A semiconductor layer of the second transistor includes an offset region. In the second transistor provided with an offset region, the off-state current of the second transistor can be reduced. Thus, a semiconductor device which can hold data for a long time can be provided.

An object is to provide a semiconductor memory device capable of copying memory data without using an external circuit. The semiconductor memory device includes a bit line to which first terminals of a plurality of memory cells are connected in common; a pre-charge circuit which is connected to the bit line and pre-charges the bit line with a specific potential in data reading; a data holding circuit comprising a capacitor which temporarily holds data read out from the memory cell or data which is written to the memory cell; and an inverted data output circuit which outputs inverted data of data held in the data holding circuit to the bit line. The inverted data output circuit includes a means for controlling output of inverted data of data held in the data holding circuit.

Semiconductor memory device

One object is to provide a method for measuring current by which minute current can be measured. A value of current flowing through an electrical element is not directly measured but is calculated from change in a potential observed in a predetermined period. The method for measuring current includes the steps of: applying a predetermined potential to a first terminal of an electrical element having the first terminal and a second terminal; measuring an amount of change in a potential of a node connected to the second terminal; and calculating, from the amount of change in the potential, a value of current flowing between the first terminal and the second terminal of the electrical element. Thus, the value of minute current can be measured.

Current measurement method, inspection method of semiconductor device, semiconductor device, and test element group

A semiconductor device which can operate normally even when the communication distance is extremely short, and which stores excess electric power which is not needed for circuit operation of the semiconductor device when a large amount of electric power is supplied thereto. The following are included: an antenna; a first AC/DC converter circuit which is connected to the antenna; a second AC/DC converter circuit which is connected to the antenna through a switching element; a detecting circuit which controls operation of the switching element in accordance with the value of a voltage output from the first AC/DC converter circuit; and a battery which stores electric power supplied from the antenna through the second AC/DC converter circuit. When the switching element is operated, electric power supplied from outside is at least partly supplied to the battery through the second AC/DC converter circuit.

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Kanagawa, Japan

Kazuma Furutani