Semiconductor Energy Laboratory Co., Ltd.

Kazuki Tsuda

Hiromichi Godo

Hitoshi Kunitake

Satoru Ohshita

Yoshiyuki Kurokawa

Hidefumi Rikimaru

Kouhei Toyotaka

Shunpei Yamazaki

Tatsuya Onuki

Satoru Okamoto

Yuichi Yanagisawa

Shota Mizukami

Hajime Kimura

Kiyoshi Kato

Takayuki Ikeda

Hideki Uochi

Takanori Matsuzaki

Yasuhiro Jinbo

Yuki Okamoto

Kohei Yokoyama

Haruyuki Baba

A display apparatus having a novel structure is provided. A plurality of display panels, a fixing member having a curved surface, and a housing storing the fixing member are included. The display panel includes a display portion including a pixel circuit, a non-display portion provided to surround the display portion, a gate driver circuit for driving the pixel circuit, and a source driver circuit. The gate driver circuit is provided at a position overlapping with the display portion. The source driver circuit is provided at a position overlapping with the non-display portion. The plurality of display panels are fixed along the curved surface of the fixing member.

Display apparatus

A highly reliable memory device is provided. The memory device includes a first conductor, a second conductor above the first conductor, a third conductor above the second conductor, a fourth conductor above the third conductor, a fifth conductor above the fourth conductor, a sixth conductor above the fifth conductor, a seventh conductor, a first insulator, a second insulator, a first semiconductor, and a second semiconductor. At least third conductor and the fourth conductor have an opening. The first insulator, the first semiconductor, the second insulator, and the second semiconductor are provided in this order on an inner surface of the opening. The seventh conductor is provided between the first semiconductor and the second insulator in a region between the third conductor and the second insulator. The first semiconductor is electrically connected to the second conductor and the fifth conductor. The second semiconductor is electrically connected to the first conductor and the sixth conductor.

Memory device and method for manufacturing the same

To provide a novel electronic device. The electronic device includes a housing and a display device. The display device includes a first layer, a second layer, and a third layer. The first layer, the second layer, and the third layer are provided in different layers. The first layer includes a driver circuit and an arithmetic circuit. The second layer includes pixel circuits and a cell array. The third layer includes light-receiving devices and light-emitting devices. The pixel circuits each have a function of controlling light emission of the light-emitting device. The driver circuit has a function of controlling the pixel circuits. The arithmetic circuit has a function of performing arithmetic processing on the basis of first data corresponding to currents output from the light-receiving devices and second data corresponding to a potential held in the cell array.

Electronic device

Malfunctions of a circuit is prevented and the reliability of a semiconductor device using the circuit is improved. The semiconductor device includes a first transistor, a second transistor, a load, and a wiring having a function of supplying a power supply potential to the load. A semiconductor layer of the first transistor includes an oxide semiconductor. A semiconductor layer of the second transistor includes an oxide semiconductor. A source and a drain of the first transistor are electrically connected to the wiring. A first gate of the first transistor is supplied with a reference potential. A source and a drain of the second transistor are supplied with the reference potential. A first gate of the second transistor is electrically connected to the wiring. The semiconductor layer of the first transistor includes a region overlapping with the wiring. The semiconductor layer of the second transistor includes a region overlapping with the wiring.

Semiconductor device comprising transistor, load, and wiring configured to supply power supply potential to the load

A novel semiconductor device is provided. A structure body extending in a first direction, a first conductor extending in a second direction, and a second conductor extending in the second direction are provided. In a first intersection portion where the structure body and the first conductor intersect with each other, a first insulator, a first semiconductor, a second insulator, a second semiconductor, a third insulator, a fourth insulator, and a fifth insulator are provided concentrically around a third conductor. In a second intersection portion where the structure body and the second conductor intersect with each other, the first insulator, the first semiconductor, the second insulator, a fourth conductor, the second semiconductor, and the third insulator are provided concentrically around the third conductor.

Semiconductor device and electronic device

A semiconductor device with low power consumption is provided. The semiconductor device includes a first transistor, a second transistor, and a capacitor. The first transistor includes a first gate and a first back gate, and the second transistor includes a second gate and a second back gate. A gate insulating layer for the first back gate has ferroelectricity. The first transistor has a function of, when being in an off state, retaining a first potential corresponding to first data. The second transistor has a function of making an output current flow between a source and a drain of the second transistor.

A semiconductor device is provided in which power consumption is reduced and an increase in circuit area is inhibited. The semiconductor device includes a high frequency amplifier circuit, an envelope detection circuit, and a power supply circuit. The power supply circuit has a function of supplying a power supply potential to the high frequency amplifier circuit, an output of the high frequency amplifier circuit is connected to the envelope detection circuit, and an output of the envelope detection circuit is connected to the power supply circuit. The power supply circuit can reduce the power consumption by changing the power supply potential in accordance with the output of the high frequency amplifier circuit. The use of an OS transistor in the envelope detection circuit can inhibit an increase in circuit area.

Semiconductor device including high frequency amplifier circuit, electronic component, and electronic device

An electronic device having an eye tracking function is provided. The electronic device includes a display device and an optical system. The display device includes a first light-emitting element, a second light-emitting element, a sensor portion, and a driver circuit portion. The sensor portion includes a light-receiving element. The first light-emitting element has a function of emitting infrared light or visible light. The second light-emitting element has a function of emitting light of a color different from that of light emitted from the first light-emitting element. When the first light-emitting element emits infrared light, the light-receiving element has a function of detecting the infrared light that is emitted from the first light-emitting element and reflected by an eyeball of a user. When the first light-emitting element emits visible light, the light-receiving element has a function of detecting the visible light that is emitted from the first light-emitting element and reflected by the eyeball of the user. The first light-emitting element and the second light-emitting element are placed in one layer. The layer where the first light-emitting element and the second light-emitting element are positioned overlaps with the sensor portion.

A memory device with a small number of wirings using a NAND flash memory having a three-dimensional structure with a large number of stacked memory cell layers is provided. A decoder is formed using an OS transistor. An OS transistor can be formed by a method such as a thin film method, whereby the decoder can be provided to be stacked above the NAND flash memory having a three-dimensional structure. This can reduce the number of wirings provided substantially perpendicular to the memory cell layers.

Memory device and electronic device

A highly reliable memory device is provided. On a side surface of a first conductor extending in a first direction, a first insulator, a first semiconductor, a second insulator, a second semiconductor, and a third insulator are provided in this order when seen from the first conductor side. A first region overlapping with a second conductor with the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator therebetween, and a second region overlapping with a third conductor with the first insulator, the first semiconductor, the second insulator, the second semiconductor, and the third insulator therebetween are provided in the first conductor. In the second region, a fourth conductor is provided between the first insulator and the first semiconductor.

Memory device

A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a first insulator; a first oxide over the first insulator; a second oxide over the first oxide; a first conductor, a second conductor, a third oxide, a fourth oxide, and a second insulator over the second oxide; a third insulator over the first conductor, the second conductor, the third oxide, and the fourth oxide; a fourth insulator over the second insulator; and a third conductor over the fourth insulator. The second insulator is positioned between the first conductor and the second conductor. The third oxide is positioned between the first conductor and the second insulator. The fourth oxide is positioned between the second conductor and the second insulator. The thickness of the third oxide between the first conductor and the second insulator is greater than or equal to 3 nm and less than or equal to 8 nm. The thickness of the fourth oxide between the second conductor and the second insulator is greater than or equal to 3 nm and less than or equal to 8 nm.

Semiconductor device

A memory device with large storage capacity is provided. A NAND memory device includes a plurality of connected memory cells each provided with a writing transistor, a reading transistor, and a capacitor. An oxide semiconductor is used in a semiconductor layer of the writing transistor. The reading transistor includes a back gate. When a reading voltage is applied to the back gate, information stored in the memory cell is read out.

A novel semiconductor device is provided. A memory string, which extends in the Z direction and includes a conductor and an oxide semiconductor, intersects with a plurality of wirings CG extending in the Y direction. The conductor is placed along a center axis of the memory string, and the oxide semiconductor is concentrically placed outside the conductor. The conductor is electrically connected to the oxide semiconductor. An intersection portion of the memory string and the wiring CG functions as a transistor. In addition, the intersection portion functions as a memory cell.

Semiconductor device, driving method of semiconductor device, and electronic device

A semiconductor device with a high driving speed is provided. The semiconductor device includes first to fourth cells, a converter circuit, and first to fourth wirings. The first and second cells make a first current and a second current each corresponding to the product of first data and second data flow in the first wiring and the second wiring, respectively. The third and fourth cells make base currents in the same amount flow in the first and second wirings. The converter circuit outputs, from an output terminal thereof, a voltage corresponding to the differential current between the sum of the first current and the base current flowing in the first wiring and the sum of the second current and the base current flowing in the second wiring.

Growing community of inventors

Atsugi, Japan

Kazuki Tsuda